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公开(公告)号：US20120272686A1
公开(公告)日：2012-11-01
申请号：US13461405
申请日：2012-05-01
Applicant: Osamu Horiuchi , Kazuhisa Watanabe , Masaaki Nakayama
Inventor： Osamu Horiuchi , Kazuhisa Watanabe , Masaaki Nakayama
CPC classification number: C03B13/16 , B65H27/00 , B65H2402/80 , B65H2404/1321 , C04B33/36 , C04B2235/3472 , C04B2235/5228 , C04B2235/5264 , C04B2235/602 , C04B2235/608 , C04B2235/9607 , F16C13/00 , Y10T428/21
Abstract: A disk roll base material includes 25 to 50 wt % of ceramic wool, 5 to 30 wt % of kibushi clay, 2 to 20 wt % of bentonite, and 25 to 45 wt % of a filler selected from alumina, wollastonite and calcined kaolin clay.
Abstract translation: 圆盘辊基材包括25-50重量％的陶瓷棉，5至30重量％的赤柏粘土，2至20重量％的膨润土和25至45重量％的填料，其选自氧化铝，硅灰石和煅烧高岭土 。
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公开(公告)号：US20100113238A1
公开(公告)日：2010-05-06
申请号：US12612278
申请日：2009-11-04
Applicant: Osamu Horiuchi , Kazuhisa Watanabe , Masaaki Nakayama
Inventor： Osamu Horiuchi , Kazuhisa Watanabe , Masaaki Nakayama
CPC classification number: B65H27/00 , B65H2402/80 , B65H2404/1321 , Y10T428/21
Abstract: The present invention relates to a process for producing a base material for obtaining therefrom ring-shaped disks for use in a disk roll including a rotating shaft and the ring-shaped disks fitted thereon by insertion, whereby the peripheral surface of the disks serves as a conveying surface, the process including molding a raw slurry material into a platy shape and drying the plate, the raw slurry material containing inorganic fibers which have a wet volume of 300 mL/5 g or larger and which are amorphous or have a degree of crystallinity of 50% or lower.
Abstract translation: 本发明涉及一种用于制造用于获得圆盘的基材的方法，所述圆盘用于包括旋转轴的盘卷和通过插入安装在其上的环形盘，由此盘的周面用作 所述方法包括将原料浆料成型为板状并干燥板，含有湿体积为300mL / 5g或更大的无定形或具有结晶度的无机纤维的原料浆料 为50％以下。
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公开(公告)号：US09388008B2
公开(公告)日：2016-07-12
申请号：US12612278
申请日：2009-11-04
Applicant: Osamu Horiuchi , Kazuhisa Watanabe , Masaaki Nakayama
Inventor： Osamu Horiuchi , Kazuhisa Watanabe , Masaaki Nakayama
IPC: B65H27/00
CPC classification number: B65H27/00 , B65H2402/80 , B65H2404/1321 , Y10T428/21
Abstract: The present invention relates to a process for producing a base material for obtaining therefrom ring-shaped disks for use in a disk roll including a rotating shaft and the ring-shaped disks fitted thereon by insertion, whereby the peripheral surface of the disks serves as a conveying surface, the process including molding a raw slurry material into a platy shape and drying the plate, the raw slurry material containing inorganic fibers which have a wet volume of 300 mL/5 g or larger and which are amorphous or have a degree of crystallinity of 50% or lower.
Abstract translation: 本发明涉及一种用于制造用于获得圆盘的基材的方法，所述圆盘用于包括旋转轴的盘卷和通过插入安装在其上的环形盘，由此盘的周面用作 所述方法包括将原料浆料成型为板状并干燥板，含有湿体积为300mL / 5g或更大的无定形或具有结晶度的无机纤维的原料浆料 为50％以下。
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公开(公告)号：US20120255327A1
公开(公告)日：2012-10-11
申请号：US13064642
申请日：2011-04-05
Applicant: Kazuhisa Watanabe , Masaaki Nakayama , Osamu Horiuchi
Inventor： Kazuhisa Watanabe , Masaaki Nakayama , Osamu Horiuchi
CPC classification number: C03B17/061 , B65H27/00 , C03B17/068 , C04B33/32 , C04B33/36 , C04B35/636 , C04B2235/3427 , C04B2235/5228 , C04B2235/5264 , C04B2235/6567 , C04B2235/77 , C04B2235/94 , C04B2235/9607
Abstract: A disk roll base material includes 20 to 38 wt % of alumina silicate wool that include 40 to 60 wt % of alumina and 40 to 60 wt % of silica, and have a content of shots having a dimension of 45 μm or more of 5 wt % or less, 10 to 30 wt % of kibushi clay, 2 to 20 wt % of bentonite, and 20 to 40 wt % of mica.
Abstract translation: 圆盘辊基材料包括20至38重量％的氧化铝硅酸盐棉，其包含40至60重量％的氧化铝和40至60重量％的二氧化硅，并且具有45重量或更多的尺寸为5重量％ 10〜30重量％的赤柏粘土，2〜20重量％的膨润土，20〜40重量％的云母。
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公开(公告)号：US09051200B2
公开(公告)日：2015-06-09
申请号：US13064642
申请日：2011-04-05
Applicant: Kazuhisa Watanabe , Masaaki Nakayama , Osamu Horiuchi
Inventor： Kazuhisa Watanabe , Masaaki Nakayama , Osamu Horiuchi
CPC classification number: C03B17/061 , B65H27/00 , C03B17/068 , C04B33/32 , C04B33/36 , C04B35/636 , C04B2235/3427 , C04B2235/5228 , C04B2235/5264 , C04B2235/6567 , C04B2235/77 , C04B2235/94 , C04B2235/9607
Abstract: A disk roll base material includes 20 to 38 wt % of alumina silicate wool that include 40 to 60 wt % of alumina and 40 to 60 wt % of silica, and have a content of shots having a dimension of 45 μm or more of 5 wt % or less, 10 to 30 wt % of kibushi clay, 2 to 20 wt % of bentonite, and 20 to 40 wt % of mica.
Abstract translation: 圆盘辊基材料包括20至38重量％的氧化铝硅酸盐棉，其包含40至60重量％的氧化铝和40至60重量％的二氧化硅，并且具有45重量或更多的尺寸为5重量％ 10〜30重量％的赤柏粘土，2〜20重量％的膨润土，20〜40重量％的云母。
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Patent Agency Ranking
公开(公告)号：US08827883B2
公开(公告)日：2014-09-09
申请号：US13067011
申请日：2011-05-02
Applicant: Osamu Horiuchi , Kazuhisa Watanabe , Masaaki Nakayama
Inventor： Osamu Horiuchi , Kazuhisa Watanabe , Masaaki Nakayama
IPC: B25F5/02
CPC classification number: C03B13/16 , B65H27/00 , B65H2402/80 , B65H2404/1321 , C04B33/36 , C04B2235/3472 , C04B2235/5228 , C04B2235/5264 , C04B2235/602 , C04B2235/608 , C04B2235/9607 , F16C13/00 , Y10T428/21
Abstract: A process for producing a base material for disks including forming a raw slurry material into a platy shape and drying the plate, the raw slurry material containing inorganic fibers which have a wet volume of about 300 mL/5 g or larger and which are amorphous or have a degree of crystallinity of about 50% or lower.
Abstract translation: 一种用于制造圆盘基材的方法，包括将原料浆料形成为板状并干燥板，含有湿体积为约300mL / 5g或更大的无机纤维的原料浆料包含无定形或 具有约50％以下的结晶度。
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公开(公告)号：US20110287915A1
公开(公告)日：2011-11-24
申请号：US13067011
申请日：2011-05-02
Applicant: Osamu Horiuchi , Kazuhisa Watanabe , Masaaki Nakayama
Inventor： Osamu Horiuchi , Kazuhisa Watanabe , Masaaki Nakayama
CPC classification number: C03B13/16 , B65H27/00 , B65H2402/80 , B65H2404/1321 , C04B33/36 , C04B2235/3472 , C04B2235/5228 , C04B2235/5264 , C04B2235/602 , C04B2235/608 , C04B2235/9607 , F16C13/00 , Y10T428/21
Abstract: A process for producing a base material for disks including forming a raw slurry material into a platy shape and drying the plate, the raw slurry material containing inorganic fibers which have a wet volume of about 300 mL/5 g or larger and which are amorphous or have a degree of crystallinity of about 50% or lower.
Abstract translation: 一种用于制造圆盘基材的方法，包括将原料浆料形成为板状并干燥该板，含有湿体积为约300mL / 5g或更大的无机纤维的原料浆料包含无定形或 具有约50％以下的结晶度。
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公开(公告)号：US5876640A
公开(公告)日：1999-03-02
申请号：US674806
申请日：1996-07-03
Applicant: Yoshihisa Miyahara , Kohichi Kimura , Yoshiyuki Motoyoshi , Tatsuo Takagi , Osamu Horiuchi , Nobuya Tomosue , Toshihisa Okabe , Hiromi Furuya
Inventor： Yoshihisa Miyahara , Kohichi Kimura , Yoshiyuki Motoyoshi , Tatsuo Takagi , Osamu Horiuchi , Nobuya Tomosue , Toshihisa Okabe , Hiromi Furuya
Abstract: A coating fluid holding member including a porous molded body which is formed of heat-resistant fibers (or a mixture of heat-resistant fibers and a filler) bound to each other with a binder, has intercommunicating pores having an average pore size of 1 to 500 .mu.m, and has a porosity of 20 to 90%, and a coating fluid holding member including a porous molded body which is formed of heat-resistant fibers bound to each other with a binder, contains fine intercommunicating interstices between fibers and uniformly distributed pores having a diameter of 0.05 to 2 mm, and has a porosity of 30 to 90%. The holding member has a high fluid holding capacity for its volume and releases the coating fluid, such as a parting agent, an oil or a coating compound, in a stable manner for an extended period of time.
Abstract translation: 包括由耐热纤维（或耐热纤维和填料的混合物）形成的多孔成型体的涂布液保持部件用粘合剂彼此粘合，具有平均孔径为1〜 500μm，孔隙率为20〜90％，包含由耐热纤维形成的多孔成型体的涂布液保持部件由粘合剂彼此结合，在纤维之间具有细小的相互间隙，均匀分布 孔径为0.05〜2mm，孔隙率为30〜90％。 保持构件的体积具有高的流体保持能力，并以稳定的方式释放涂层流体，例如脱模剂，油或涂料化合物。
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9.发明授权Method of fabricating a molded semiconductor device having blocking banks between leads 失效制造在引线之间具有阻挡堤的模制半导体器件的方法
公开(公告)号：US5525547A
公开(公告)日：1996-06-11
申请号：US161374
申请日：1993-12-02
Applicant: Toshihiro Matsunaga , Yuji Shirai , Takayuki Okinaga , Osamu Horiuchi , Takashi Emata , Makoto Omata
Inventor： Toshihiro Matsunaga , Yuji Shirai , Takayuki Okinaga , Osamu Horiuchi , Takashi Emata , Makoto Omata
IPC: H01L21/56 , H01L23/495
CPC classification number: H01L23/49558 , H01L21/565 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/07802 , H01L2924/181
Abstract: A molded semiconductor device has a plurality of slender leads formed with a sealing strip connecting them together to prevent the molding material from leaking out between the leads. Specifically, the sealing strip comprising an adhesive and an electrically insulating material is applied to the leads substantially perpendicular to the lengthwise direction of the leads. The strip is place such that an inner edge thereof substantially lies on a boundary line or inside where the molding terminates. The strip is then thrust into spaces formed between the leads. Thereafter the semiconductor chip is connected to the leads, the semiconductor chip and the leads are placed in a molding unit, the strip serving to block the molding material leaking outside the molding unit.
Abstract translation: 模制的半导体器件具有多个细长的引线，其形成有将它们连接在一起的密封条，以防止模制材料在引线之间泄漏。 具体地，包括粘合剂和电绝缘材料的密封条被施加到基本上垂直于引线的长度方向的引线。 带材的位置使得其内边缘基本上位于模制终止的边界线或内部。 然后将条带推入形成在引线之间的空间中。 此后，将半导体芯片连接到引线，将半导体芯片和引线放置在模制单元中，该条用于阻止模制材料在模制单元外部泄漏。
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公开(公告)号：US5448105A
公开(公告)日：1995-09-05
申请号：US372901
申请日：1995-01-17
Applicant: Kazunori Katoh , Gen Murakami , Hiromichi Suzuki , Takayuki Okinaga , Takashi Emata , Osamu Horiuchi
Inventor： Kazunori Katoh , Gen Murakami , Hiromichi Suzuki , Takayuki Okinaga , Takashi Emata , Osamu Horiuchi
IPC: H01L23/433 , H01L23/495 , H01L23/48 , H01L23/44 , H01L23/52 , H01L23/60
CPC classification number: H01L23/49506 , H01L23/4334 , H01L2224/45144 , H01L2224/48247 , H01L2224/48639 , H01L2224/48644 , H01L2224/49171 , H01L2224/85439 , H01L2224/85444 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01028 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802
Abstract: A leadframe according to this invention is formed by bonding a single leadframe with a substrate using adhesive film or double-sided adhesive resin film, which is divided and attached to two or more predetermined points between them. This reduces the quantity of gas or contaminants generated from adhesives. Also, this results in the reduction of the stress generated during heat treatment of the leadframe and also in the elimination of warping of the lead frame due to thermal stress. Cracking does not occur on the resin because resin is removed easily and assuredly, and no air is left behind. This contributes to high reliability and increased productivity. The lead frame is further formed by bonding a plurality of metal substrates of different materials to single leadframe. This through more stable thermal behavior high reliability.
Abstract translation: 根据本发明的引线框架是通过使用粘合剂膜或双面粘合树脂膜将单个引线框与基板结合而形成的，所述粘合膜或双面粘合树脂膜被分隔并附接到它们之间的两个或更多个预定点。 这减少了由粘合剂产生的气体或污染物的数量。 此外，这导致在引线框架的热处理期间产生的应力的减少以及由于热应力消除引线框架的翘曲。 在树脂上不会发生裂纹，因为容易且可靠地除去树脂，并且不留下空气。 这有助于高可靠性和提高的生产率。 引线框通过将多种不同材料的金属基板结合到单引线框架而进一步形成。 这通过更稳定的热行为高可靠性。
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