-
公开(公告)号：US20190009375A1
公开(公告)日：2019-01-10
申请号：US15764165
申请日：2016-09-29
发明人： Yukiko HAYASHI , Arisa SHIRAISHI , Naoto OZAWA , Takayuki SUZUKI , Takeshi SHIRAI , Noriyoshi UCHIDA , Mitsuyasu FURUSAWA
摘要： The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.
-
公开(公告)号：US20180326545A1
公开(公告)日：2018-11-15
申请号：US15764268
申请日：2016-09-29
发明人： Yukiko HAYASHI , Arisa SHIRAISHI , Naoto OZAWA , Takayuki SUZUKI
CPC分类号： B23K37/04 , B23K1/0016 , B23K1/20 , B23K1/203 , B23K35/22 , B23K35/262 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/383 , B23K2101/40 , B23K2101/42 , H01L21/04 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29139 , H01L2224/29147 , H01L2224/32225 , H01L2224/75102 , H01L2224/7525 , H01L2224/75901 , H01L2224/83002 , H01L2224/83065 , H01L2224/83075 , H01L2224/8309 , H01L2224/83101 , H01L2224/83801 , H01L2224/83815 , H01L2224/83948 , H01L2924/014 , H05K3/34 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/01049 , H01L2924/0103
摘要： The present invention relates to a method for producing a soldered product by which soldering can be accomplished without using a jig. The method for producing a soldered product of the present invention comprises:a provision step of providing a solder and a temporary fixing agent for temporarily fixing the solder; a temporary fixing step of temporarily fixing the solder to a soldering target with the temporary fixing agent; a vaporization step of placing the soldering target with the solder temporarily fixed thereto in a vacuum or heating the soldering target with the solder temporarily fixed thereto to a predetermined temperature lower than the melting temperature of the solder, to vaporize the temporary fixing agent in order to form gaps between the solder and the soldering target; a reduction step, performed concurrently with or after the vaporization step, of reducing, with a reducing gas at a predetermined temperature lower than the melting temperature of the solder, the solder and the soldering target left in the vaporization step; and a solder melting step, performed after the reduction step, of heating the soldering target to a predetermined temperature equal to or higher than the melting temperature of the solder to melt the solder.
-
搜索结果
2 条记录 (耗时 0.015 秒)
