TRANSFER MOLDING METHOD AND TRANSFER MOLDING APPARATUS
    1.
    发明申请
    TRANSFER MOLDING METHOD AND TRANSFER MOLDING APPARATUS 有权
    转印成型方法和转印成型设备

    公开(公告)号:US20140124965A1

    公开(公告)日:2014-05-08

    申请号:US13762766

    申请日:2013-02-08

    申请人: OMRON Corporation

    IPC分类号: B29D11/00 B29C59/02

    摘要: A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.

    摘要翻译: 传递模塑方法具有传递模塑步骤,其通过加热第一和第二模具中的至少一个,并且相互面对地设置在第一模具和第二模具之间的树脂薄片上进行传递模塑,以及冷却步骤 冷却树脂片。 冷却步骤包括冷却树脂片的第一冷却步骤,同时施加的压力保持在小于传送成型步骤中的施加压力值的第一设定值,以及冷却树脂片的第二冷却步骤,同时 施加的压力降低到小于第一设定值的第二设定值。

    Transfer molding method and transfer molding apparatus
    2.
    发明授权
    Transfer molding method and transfer molding apparatus 有权
    传递成型法和传递成型设备

    公开(公告)号:US09452572B2

    公开(公告)日:2016-09-27

    申请号:US13762766

    申请日:2013-02-08

    申请人: OMRON Corporation

    摘要: A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.

    摘要翻译: 传递模塑方法具有传递模塑步骤,其通过加热第一和第二模具中的至少一个,并且相互面对地设置在第一模具和第二模具之间的树脂薄片上进行传递模塑,以及冷却步骤 冷却树脂片。 冷却步骤包括冷却树脂片的第一冷却步骤,同时施加的压力保持在小于传送成型步骤中的施加压力值的第一设定值,以及冷却树脂片的第二冷却步骤,同时 施加的压力降低到小于第一设定值的第二设定值。

    DIE STRUCTURE, TRANSFER MOLDING APPARATUS, TRANSFER MOLDING METHOD, OPTICAL MEMBER, AREA LIGHT SOURCE DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, AND MOBILE DEVICE
    6.
    发明申请
    DIE STRUCTURE, TRANSFER MOLDING APPARATUS, TRANSFER MOLDING METHOD, OPTICAL MEMBER, AREA LIGHT SOURCE DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, AND MOBILE DEVICE 有权
    DIE结构,转印成型设备,转印成型方法,光学部件,区域光源装置,液晶显示装置和移动装置

    公开(公告)号:US20140125918A1

    公开(公告)日:2014-05-08

    申请号:US13763014

    申请日:2013-02-08

    申请人: OMRON CORPORATION

    IPC分类号: B29C59/02

    摘要: A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.

    摘要翻译: 传递成型方法包括将树脂片插入相对设置的第一管芯和第二管芯之间的插入步骤,将树脂片夹在第一和第二管芯之间的夹持步骤,同时转印的转印面 与树脂片的至少一个表面接触的部件和传递模塑步骤,加热第一和第二模具中的至少一个,以至少使树脂片材的表面部分 并且当通过形成在转印表面中的凹部形成厚部时,通过与凹部连接的凹槽部分,残留在凹部中的剩余空气排出。