公开(公告)号：US20180041670A1

公开(公告)日：2018-02-08

申请号：US15783433

申请日：2017-10-13

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI

IPC: H04N5/225 ,  H05K1/02 ,  H05K1/18 ,  G02B23/24 ,  H01L27/146

CPC classification number: H04N5/2253 ,  G02B23/2484 ,  H01L27/14 ,  H01L27/14618 ,  H01L27/14636 ,  H04N2005/2255 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/3405 ,  H05K2201/09027 ,  H05K2201/09045 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10446

Abstract: An image pickup apparatus includes: an image pickup device including a plurality of convex electrodes disposed on an opposing surface; and a wiring board including a plurality of first edge electrodes on a first main surface and a plurality of second edge electrodes on a second main surface, wherein the wiring board is disposed in an upright state on the opposing surface, the plurality of convex electrodes include first convex electrodes and second convex electrodes, the first convex electrodes are bonded to the first edge electrodes, the second convex electrodes are bonded to the second edge electrodes, and the wiring board is held between the first convex electrodes and the second convex electrodes.

公开(公告)号：US20170330908A1

公开(公告)日：2017-11-16

申请号：US15668807

申请日：2017-08-04

Applicant: OLYMPUS CORPORATION

Inventor： Satoru ADACHI ,  Nana AKAHANE ,  Noriyuki FUJIMORI

IPC: H01L27/146 ,  H04N5/363 ,  H01L29/94 ,  H04N5/378 ,  A61B1/05

CPC classification number: H01L27/14609 ,  A61B1/051 ,  H01L27/14612 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14643 ,  H01L29/945 ,  H04N5/363 ,  H04N5/369 ,  H04N5/378

Abstract: An image sensor includes: a pixel chip provided with a plurality of pixels, a plurality of first transfer lines, and a plurality of capacitors; a circuit chip provided with a plurality of column reading circuits, a plurality of column scanning circuits, a second transfer line, and a constant current source; and a connection portion stacked and provided between the pixel chip and the circuit chip and configured to connect a capacitor, which is arranged in the pixel chip and has a trench structure, and a first transistor arranged in the circuit chip to each other via an electrode. The capacitor is configured to form a transfer capacity removing a noise included in an imaging signal and connect the pixel chip and the circuit chip to each other via the electrode and the connection portion.

公开(公告)号：US20170255001A1

公开(公告)日：2017-09-07

申请号：US15602396

申请日：2017-05-23

Applicant: OLYMPUS CORPORATION ,  PANASONIC CORPORATION

Inventor： Tomokazu YAMASHITA ,  Takatoshi IGARASHI ,  Noriyuki FUJIMORI ,  Yoshiki TAKAYAMA ,  Yutaka HARADA

IPC: G02B23/24 ,  H04N5/225 ,  H04N5/335 ,  A61B1/00 ,  A61B1/05

CPC classification number: G02B23/2484 ,  A61B1/0011 ,  A61B1/051 ,  G02B23/2469 ,  H04N5/2253 ,  H04N5/2256 ,  H04N5/2257 ,  H04N5/335 ,  H04N2005/2255

Abstract: An imaging unit includes: a flexible substrate including one end connected to a light receiving surface of a solid state image sensor, the flexible substrate extending to a surface side opposite to the light receiving surface; a multi-layer substrate connected to a surface of the flexible substrate, the surface of the flexible substrate being a surface to which the solid state image sensor is connected, the multi-layer substrate including a plurality of electronic components mounted thereon; and a connection layer configured to electrically and mechanically connect to connection members provided on the surface of the flexible substrate and a surface of the multi-layer substrate facing the surface of the flexible substrate.

公开(公告)号：US20150207965A1

公开(公告)日：2015-07-23

申请号：US14676045

申请日：2015-04-01

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI ,  Takatoshi IGARASHI

IPC: H04N5/225 ,  A61B1/05

CPC classification number: H04N5/2251 ,  A61B1/051 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N2005/2255 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image pickup device including a vacant space portion that allows a connection electrode to be exposed to a second main surface side, the vacant space portion being formed at a position overlapping at least the connection electrode in a state where the image pickup device is viewed in plan view from a thickness direction A, and the connection electrode exposed to the second main surface side is electrically connected with a substrate at a position in the vacant space portion, the position overlapping the image pickup device in the state where the image pickup device is viewed in plan view from the thickness direction.

Abstract translation: 一种图像拾取装置，包括允许连接电极暴露于第二主表面侧的空闲空间部分，所述空间空间部分形成在与所述连接电极至少重叠的位置处，在所述图像拾取装置被观察的状态下 从厚度方向A的平面图，暴露于第二主表面侧的连接电极在空间部分的位置处与基板电连接，在图像拾取装置为 从厚度方向看平面图。

公开(公告)号：US20150085094A1

公开(公告)日：2015-03-26

申请号：US14556831

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI ,  Takatoshi IGARASHI ,  Kazuhiro YOSHIDA

IPC: H01L27/146 ,  H01L23/31 ,  H01L23/00 ,  H04N5/369

CPC classification number: H01L27/14636 ,  H01L23/3114 ,  H01L24/32 ,  H01L25/042 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2924/0002 ,  H01L2924/12042 ,  H04N5/369 ,  H01L2924/00

Abstract: An image pickup apparatus includes: an image pickup chip including a light receiving section and electrode pads, on a first main face, and a plurality of connection electrodes, each of which is connected to each of the electrode pads via each of a plurality of through-hole interconnections, on a second main face; a transparent cover glass having a larger plan-view dimension than the image pickup chip; a transparent adhesive layer that bonds the first main face of the image pickup chip and the cover glass; and a sealing member that covers a side face of the image pickup chip and a side face of the adhesive layer, and is made of an insulating material having a same plan-view dimension as the cover glass.

Abstract translation: 一种图像拾取装置包括：图像拾取芯片，包括在第一主面上的光接收部分和电极焊盘以及多个连接电极，每个连接电极通过多个通孔中的每一个连接到每个电极焊盘 在第二主面上的孔互连; 具有比图像拾取芯片更大的平面视图尺寸的透明盖玻璃; 将图像拾取芯片的第一主面和盖玻璃接合的透明粘合剂层; 以及覆盖图像拾取芯片的侧面和粘合剂层的侧面的密封构件，并且由具有与盖玻璃相同的平面尺寸的绝缘材料制成。

公开(公告)号：US20140003018A1

公开(公告)日：2014-01-02

申请号：US14017849

申请日：2013-09-04

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI

IPC: H05K1/18 ,  H05K3/10

CPC classification number: H05K1/181 ,  A61B1/0011 ,  A61B1/051 ,  H04N5/2251 ,  H05K1/18 ,  H05K1/186 ,  H05K3/0052 ,  H05K3/10 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/0919 ,  H05K2201/10121 ,  H05K2201/10356 ,  H05K2201/10416 ,  H05K2201/10446 ,  Y10T29/49162

Abstract: A wiring board includes a plurality of wiring layers, a plurality of insulating layers, and an electrode member made of a conductive material, the electrode member being incorporated in the wiring board in a state in which the electrode member includes exposed sections on side surfaces that cross the plurality of wiring layers and the plurality of insulating layers.

Abstract translation: 布线基板包括多个布线层，多个绝缘层和由导电材料制成的电极构件，该电极构件在电极构件包括在侧面上的暴露部分的状态下结合在布线板中， 穿过多个布线层和多​​个绝缘层。

公开(公告)号：US20210343779A1

公开(公告)日：2021-11-04

申请号：US17375532

申请日：2021-07-14

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI

IPC: H01L27/146 ,  H04N5/225

Abstract: A manufacturing method of an image pickup apparatus for endoscope includes: manufacturing two optical wafers each of which has a glass wafer as a base substrate and is a hybrid lens wafer including a plurality of resin lenses, and a spacer wafer including a plurality of spacers and being formed with an inorganic material; manufacturing a bonded wafer in which space in which the plurality of resin lenses are disposed is hermetically sealed by directly bonding the two optical wafers and the spacer wafer at a temperature lower than a softening point of the plurality of resin lenses; disposing a plurality of image pickup members on the bonded wafer; and cutting the bonded wafer on which the plurality of image pickup members are disposed.

公开(公告)号：US20170265721A1

公开(公告)日：2017-09-21

申请号：US15613399

申请日：2017-06-05

Applicant: OLYMPUS CORPORATION ,  PANASONIC CORPORATION

Inventor： Hironobu ICHIMURA ,  Tomohisa TAKAHASHI ,  Tomokazu YAMASHITA ,  Noriyuki FUJIMORI ,  Takatoshi IGARASHI ,  Yoshiki TAKAYAMA

IPC: A61B1/00 ,  G02B23/24

CPC classification number: A61B1/00096 ,  A61B1/0011 ,  A61B1/04 ,  A61B1/05 ,  A61B1/051 ,  G02B23/24 ,  G02B23/2423 ,  G02B23/2476 ,  G02B23/2484 ,  H04N5/2253 ,  H04N2005/2255

Abstract: An endoscope includes: an imaging unit disposed at a distal end portion of an insertion section inserted into a body of a subject; and a built-in component provided parallel with the imaging unit at the distal end portion, and extending substantially parallel with an axial direction of the insertion section. The imaging unit includes: a solid state image sensor including a light receiving unit; a flexible circuit board electrically connecting the solid state image sensor; and a rigid circuit board at least partially disposed on a proximal end side of the endoscope relative to the solid state image sensor, and electrically connected to the flexible circuit board.

公开(公告)号：US20170238785A1

公开(公告)日：2017-08-24

申请号：US15591778

申请日：2017-05-10

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI ,  Kazuaki KOJIMA

IPC: A61B1/00 ,  A61B1/05 ,  H01L27/146 ,  G02B13/00 ,  G02B23/24

CPC classification number: A61B1/0011 ,  A61B1/00096 ,  A61B1/00163 ,  A61B1/051 ,  B32B37/14 ,  B32B38/10 ,  G02B7/02 ,  G02B13/0035 ,  G02B13/006 ,  G02B13/0065 ,  G02B13/007 ,  G02B13/0085 ,  G02B23/243 ,  H01L27/14643 ,  H01L27/14687 ,  H04N5/2254 ,  H04N5/335 ,  Y10T156/1052

Abstract: A manufacturing method for an image pickup unit, the method including: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units; and a step of respectively bonding solid-state image pickup devices to emission surfaces of lights of the bending optical elements of the optical units.

公开(公告)号：US20160043122A1

公开(公告)日：2016-02-11

申请号：US14918843

申请日：2015-10-21

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An image pickup apparatus includes an image pickup device chip having a first primary surface on which an image pickup section, a circuit section and a guard ring are formed, the circuit section having a plurality of layers including an insulating layer that is made of a low dielectric constant material having a relative dielectric constant lower than silicon oxide, the guard ring being made of one or more materials selected from materials superior to the low dielectric constant material in humidity resistance; and a cover glass adhered to the first primary surface of the image pickup device chip.

Abstract translation: 一种图像拾取装置包括具有第一主表面的图像拾取装置芯片，其上形成有图像拾取部分，电路部分和保护环，该电路部分具有多个层，该多个层包括由低层构成的绝缘层 相对介电常数低于氧化硅的介电常数材料，保护环由选自耐低湿介电常数材料的材料中选出的一种或多种材料制成; 以及附着在图像拾取器件芯片的第一主表面上的覆盖玻璃。