公开(公告)号：US20170133342A1

公开(公告)日：2017-05-11

申请号：US15339594

申请日：2016-10-31

Applicant: NXP B.V.

Inventor： Wiwat Tanwongwan ,  Piyarat Suwannakha ,  Chanon Suwankasab

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L24/48 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/85047 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/386 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00

Abstract: An integrated circuit package is provided. The integrated circuit package comprises: a die; a lead; and a bond wire comprising a first end coupled to the die and a second end coupled to the lead via bond. The bond wire further comprises: a first portion between a first bend in the bond wire and the bond and forming a first angle with respect to the lead; and a second portion forming a second angle with respect to the lead. The first bend is immediately between the first and second portions and is configured to reduce the angle of the bond wire with respect to the lead from the second angle to the first angle.