公开(公告)号：US11457524B2

公开(公告)日：2022-09-27

申请号：US16397709

申请日：2019-04-29

Applicant: NXP B.V.

Inventor： Mahmoud Mohamed Amin El Sabbagh ,  Anu Mathew ,  Siamak Delshadpour

IPC: H05K1/02

Abstract: A chip includes a plurality of ground conductors that at least partially surround a signal conductor on a same die. The signal conductor carries an interface (e.g., high speed) signal, and the ground conductors filter electromagnetic interference generated by the signal carried by the signal conductor. A chip package includes a plurality of ground pins around a signal pin that carries an interface signal. The ground pins filter electromagnetic interference generated by the signal carried by the signal pin. A printed circuit board includes a plurality of ground conductors around a signal line. The ground conductors are in vias and filter electromagnetic interference generated by an interface signal carried by the signal line.

公开(公告)号：US11290068B2

公开(公告)日：2022-03-29

申请号：US16831114

申请日：2020-03-26

Applicant: NXP B.V.

Inventor： Mahmoud Mohamed Amin El Sabbagh ,  Daniel Meeks

IPC: H03F9/06 ,  H03F3/195 ,  H03F3/26 ,  H03F3/45 ,  H04L25/03 ,  H03F3/193

Abstract: Embodiments of active baluns are disclosed. In an embodiment, an active balun includes input terminals configured to receive a single-ended input signal and a linear redriver configured to transform the single-ended input signal into a differential output signal.