公开(公告)号：US09741671B1

公开(公告)日：2017-08-22

申请号：US15348728

申请日：2016-11-10

Applicant: NXP B.V.

Inventor： Sven Trester ,  Claus Grzyb

IPC: H01L23/00 ,  H01L23/528 ,  H01L21/02 ,  H01L21/768

CPC classification number: H01L23/573 ,  H01L21/02532 ,  H01L21/02595 ,  H01L21/76838

Abstract: A semiconductor die with backside protection includes an active region and a first polysilicon layer formed on a front side of a semiconductor substrate. A signal net is connected to the first polysilicon layer by way of a metal contact and a conductive wire is formed above the active region. During an invasive attack, when a trench is formed in the substrate and an electrically conductive filling is deposited in the trench, the signal net, the conductive wire, and the first polysilicon shape form a short-circuit, which renders the die dysfunctional and thereby foiling the invasive attack.

公开(公告)号：US08701077B1

公开(公告)日：2014-04-15

申请号：US13710291

申请日：2012-12-10

Applicant: NXP B.V.

Inventor： Stefan Lemsitzer ,  Heimo Scheucher ,  Claus Grzyb

IPC: G06F17/50

CPC classification number: G11C17/10 ,  G11C7/24 ,  G11C8/20 ,  H01L27/112

Abstract: Aspects of the present disclosure are directed toward methods and systems which generate a plurality of Read-Only Memory (ROM) codes. In response to generating the ROM codes, an image is generated for each of the plurality of ROM codes. The images for each of the plurality of ROM codes are mapped on a single reticle, and a wafer is provided, which includes a plurality of individual devices. The reticle is utilized, which includes an image for each of the plurality of ROM codes, to print a respective one of the images onto a respective one of the plurality of individual devices.

Abstract translation: 本公开的方面涉及生成多个只读存储器（ROM）代码的方法和系统。 响应于产生ROM代码，为多个ROM代码中的每一个生成图像。 多个ROM代码中的每一个的图像被映射在单个掩模版上，并且提供包括多个单独器件的晶片。 使用掩模版，其包括用于多个ROM代码中的每一个的图像，以将相应的一个图像打印到多个单独设备中的相应一个上。