公开(公告)号：US11887839B2

公开(公告)日：2024-01-30

申请号：US16382604

申请日：2019-04-12

申请人： NIKON CORPORATION

发明人： Hirofumi Arima ,  Ryoichi Suganuma ,  Takuya Sato ,  Satoru Suzuki

IPC分类号： H01L23/34 ,  H01L27/146 ,  H01L23/40 ,  H04N5/225 ,  H04N23/54 ,  H04N23/57

CPC分类号： H01L23/34 ,  H01L23/4006 ,  H01L27/14601 ,  H01L27/14618 ,  H04N23/54 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H04N23/57 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An imaging unit comprising an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside. An imaging apparatus comprises an imaging unit that includes an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside.

公开(公告)号：US10412824B2

公开(公告)日：2019-09-10

申请号：US15679340

申请日：2017-08-17

申请人： NIKON CORPORATION

发明人： Ryoichi Suganuma ,  Hirofumi Arima ,  Satoru Suzuki ,  Takuya Sato

IPC分类号： H05K1/02 ,  H04N5/225 ,  H05K1/05 ,  H05K3/46 ,  H01L27/146 ,  H05K1/11 ,  H05K1/18 ,  H05K3/44 ,  H05K1/03

摘要： A substrate comprises: a first insulating layer; a second insulating layer having an elastic modulus that is different from an elastic modulus of the first insulating layer; and a core layer that is sandwiched by the first insulating layer and the second insulating layer, and is more rigid than the first insulating layer and the second insulating layer.

公开(公告)号：US10304752B2

公开(公告)日：2019-05-28

申请号：US14454475

申请日：2014-08-07

申请人： NIKON CORPORATION

发明人： Hirofumi Arima ,  Ryoichi Suganuma ,  Takuya Sato ,  Satoru Suzuki

IPC分类号： H01L23/34 ,  H01L27/146 ,  H01L23/40 ,  H04N5/225

摘要： An imaging unit comprising an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside. An imaging apparatus comprises an imaging unit that includes an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside.

公开(公告)号：US11343907B2

公开(公告)日：2022-05-24

申请号：US16524568

申请日：2019-07-29

申请人： NIKON CORPORATION

发明人： Ryoichi Suganuma ,  Hirofumi Arima ,  Satoru Suzuki ,  Takuya Sato

IPC分类号： H05K1/02 ,  H04N5/225 ,  H05K1/05 ,  H05K3/46 ,  H01L27/146 ,  H05K1/11 ,  H05K1/18 ,  H05K3/44 ,  H05K1/03

摘要： A substrate comprises: a first insulating layer; a second insulating layer having an elastic modulus that is different from an elastic modulus of the first insulating layer; and a core layer that is sandwiched by the first insulating layer and the second insulating layer, and is more rigid than the first insulating layer and the second insulating layer.

公开(公告)号：US09743510B2

公开(公告)日：2017-08-22

申请号：US14579108

申请日：2014-12-22

申请人： NIKON CORPORATION

发明人： Ryoichi Suganuma ,  Hirofumi Arima ,  Satoru Suzuki ,  Takuya Sato

IPC分类号： H01L29/16 ,  H05K1/02 ,  H04N5/225 ,  H05K1/05 ,  H05K3/46 ,  H01L27/146 ,  H05K1/11 ,  H05K1/18 ,  H05K3/44 ,  H05K1/03

CPC分类号： H05K1/0271 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15153 ,  H01L2924/1531 ,  H01L2924/16195 ,  H04N5/2253 ,  H05K1/0206 ,  H05K1/0283 ,  H05K1/0366 ,  H05K1/05 ,  H05K1/056 ,  H05K1/111 ,  H05K1/181 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0133 ,  H05K2201/068 ,  H05K2201/10015 ,  H05K2201/10121 ,  H01L2924/00014

摘要： A substrate comprises: a first insulating layer; a second insulating layer having an elastic modulus that is different from an elastic modulus of the first insulating layer; and a core layer that is sandwiched by the first insulating layer and the second insulating layer, and is more rigid than the first insulating layer and the second insulating layer.