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    BASE MEMBER OR LIGHT-EMITTING DEVICE
    1.
    发明申请
    BASE MEMBER OR LIGHT-EMITTING DEVICE 有权

    公开(公告)号：US20220302672A1

    公开(公告)日：2022-09-22

    申请号：US17696349

    申请日：2022-03-16

    申请人： NICHIA CORPORATION

    发明人： Kiyoshi ENOMOTO ,  Eiichiro OKAHISA

    IPC分类号： H01S5/0239 ,  H01S5/02345 ,  H01S5/02315 ,  H01S5/02325

    摘要： A base member includes a lower portion and a lateral portion. The lateral portion includes a first lateral surface, a second lateral surface not adjacent to the first lateral surface, and a third lateral surface adjacent to the first lateral surface, and first to third step portions. The first step portion is arranged inward of the first lateral surface along a portion or an entirety of the first lateral surface, and has a first upper surface provided with a wiring pattern. The second step portion is arranged inward of the second lateral surface along a portion or an entirety of the second lateral surface, and has a second upper surface provided with a wiring pattern. The third step portion is arranged inward of the third lateral surface along only a portion of the third lateral surface, and has a third upper surface provided with a wiring pattern.

    LIGHT-EMITTING DEVICE
    2.
    发明申请
    LIGHT-EMITTING DEVICE 审中-公开
    发光装置

    公开(公告)号：US20160341395A1

    公开(公告)日：2016-11-24

    申请号：US15157897

    申请日：2016-05-18

    申请人： NICHIA CORPORATION

    发明人： Seiji KIYOTA ,  Kazuma KOZURU ,  Eiichiro OKAHISA

    IPC分类号： F21V5/00 ,  H01S5/00 ,  F21V5/04 ,  H01S5/40

    CPC分类号： F21V5/007 ,  F21V5/04 ,  G02B3/0056 ,  G02B19/0057 ,  H01S5/0071 ,  H01S5/02216 ,  H01S5/02276 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/4018 ,  H01S5/4025 ,  H01S5/405

    摘要： A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.

    摘要翻译： 发光装置包括：基板; 具有矩阵图案的多个透镜部分的透镜阵列; 以及设置在基板上的多个半导体激光元件。 每个半导体激光元件发射各自的激光束，每个激光束具有在每个相应透镜部分的光入射表面上在列方向上比在行方向上更大的宽度的光束形状。 透镜部分在行方向上具有小于（i）每个透镜部分的最大外径和（ii）列方向上的顶点间距离的行方向上的顶点间距离。 透镜部的行方向的曲率与列方向上的透镜部的曲率相同。

    PLURALITY OF LIGHT-EMITTING DEVICES, AND LIGHT-EMITTING MODULE
    4.
    发明公开
    PLURALITY OF LIGHT-EMITTING DEVICES, AND LIGHT-EMITTING MODULE 审中-公开

    公开(公告)号：US20240030676A1

    公开(公告)日：2024-01-25

    申请号：US18356092

    申请日：2023-07-20

    申请人： NICHIA CORPORATION

    发明人： Kiyoshi ENOMOTO ,  Eiichiro OKAHISA

    IPC分类号： H01S5/02253 ,  H01S5/40

    CPC分类号： H01S5/02253 ,  H01S5/4093

    摘要： A plurality of light emitting devices include first and second light-emitting devices. The first light-emitting device includes: a first package, first semiconductor laser elements sealed in the first package, and a first lens member having lens surfaces. The second light-emitting device includes a second package having a same outer shape as the first package, one or more second semiconductor laser elements sealed in the second package, and a second lens member having one or more lens surfaces. The first semiconductor laser elements include a semiconductor laser element to emit first light having a color different from light emitted from any of the second semiconductor laser elements. A curvature of the lens surface of the first lens member to transmit the first light is the same as a curvature of one of the lens surfaces of the second lens member.

    SEMICONDUCTOR LASER DEVICE AND BACKLIGHT DEVICE USING THE SEMICONDUCTOR LASER DEVICE
    7.
    发明申请
    SEMICONDUCTOR LASER DEVICE AND BACKLIGHT DEVICE USING THE SEMICONDUCTOR LASER DEVICE 有权
    使用半导体激光器件的半导体激光器件和背光器件

    公开(公告)号：US20160285234A1

    公开(公告)日：2016-09-29

    申请号：US15081284

    申请日：2016-03-25

    申请人： NICHIA CORPORATION

    发明人： Eiichiro OKAHISA

    IPC分类号： H01S5/022 ,  F21V8/00

    CPC分类号： H01S5/02292 ,  G02B6/0066 ,  G02B6/4214 ,  H01S5/02208

    摘要： The semiconductor laser device includes a base member having a recess that opens upward, a semiconductor laser element disposed on a bottom surface of the recess, and a light reflecting member being disposed forward of a light emitting surface of the semiconductor laser element and including a light reflecting surface to reflect laser light emitted from the semiconductor laser element. The semiconductor laser element and the light reflecting member are arranged such that a direction of an optical axis of light that is reflected by the light reflecting member is different from a direction that is perpendicular to a lower surface of the base member.

    摘要翻译： 半导体激光装置包括具有向上开口的凹部的底座构件，设置在凹部的底面上的半导体激光元件，以及配置在半导体激光元件的发光面的前方的光反射构件， 反射表面以反射从半导体激光元件发射的激光。 半导体激光元件和光反射部件被布置成使得由光反射部件反射的光的光轴方向与垂直于基底部件的下表面的方向不同。

    METHOD FOR MANUFACTURING LASER PACKAGE
    8.
    发明申请
    METHOD FOR MANUFACTURING LASER PACKAGE 有权

    公开(公告)号：US20220416500A1

    公开(公告)日：2022-12-29

    申请号：US17900544

    申请日：2022-08-31

    申请人： NICHIA CORPORATION

    发明人： Masatoshi NAKAGAKI ,  Kazuma KOZURU ,  Eiichiro OKAHISA

    IPC分类号： H01S5/0237 ,  B23K1/00 ,  H01S5/40 ,  H01S5/02255

    摘要： A laser package includes: a substrate having an upper surface; a first laser element disposed on the substrate and configured to emit light in a first direction; a first optical member having a lower surface bonded to the upper surface of the substrate, a reflecting surface inclined relative to the lower surface and configured to reflect the light, and an upper surface connected to the reflecting surface, the upper surface of the first optical member being located farther in the first direction than the reflecting surface; and a bonding material disposed on the upper surface of the substrate. The first optical member is bonded to the substrate via the bonding material. In a top view, a portion of the bonding material protrudes from three sides of the upper surface of the first optical member.

    LIGHT EMITTING DEVICE
    9.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20200185881A1

    公开(公告)日：2020-06-11

    申请号：US16794476

    申请日：2020-02-19

    申请人： NICHIA CORPORATION

    发明人： Takuya HASHIMOTO ,  Eiichiro OKAHISA

    IPC分类号： H01S5/022 ,  H01S5/024 ,  H01L23/00

    摘要： A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body and positioned inward of the frame; a cover including: a support member that is fixed on an upper surface of the frame and has an opening inside the frame, and a light transmissive portion disposed so as to close the opening; and a lens body disposed on the support member and above the light transmissive portion. A difference between a thermal expansion coefficient of the light transmissive portion and a thermal expansion coefficient of the lens body is smaller than a difference between a thermal expansion coefficient of the light transmissive portion and a thermal expansion coefficient of the main body.

    LIGHT EMITTING DEVICE
    10.
    发明申请
    LIGHT EMITTING DEVICE 有权

    公开(公告)号：US20170122505A1

    公开(公告)日：2017-05-04

    申请号：US15337046

    申请日：2016-10-28

    申请人： NICHIA CORPORATION

    发明人： Seiji KIYOTA ,  Kazuma KOZURU ,  Eiichiro OKAHISA

    IPC分类号： F21K9/64 ,  H01S5/40 ,  H01S5/00 ,  H01S5/022 ,  F21V7/04 ,  F21V5/04

    CPC分类号： F21K9/64 ,  F21V5/04 ,  F21V7/04 ,  F21Y2115/30 ,  H01S5/005 ,  H01S5/02236 ,  H01S5/02248 ,  H01S5/02276 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/40 ,  H01S5/4031

    摘要： A light emitting device includes a base defining a recess opening upward, a semiconductor laser element, a light reflecting member to reflect light from the semiconductor laser element, a wavelength converting member to convert wavelength of light from the light reflecting member, and a cover including a light-transmissive member and covering the opening of the recess. The recess is defined in the base by first inner lateral surfaces extending downward from a periphery of the opening of the recess defined in the upper surface of the base, a bottom surface connected to the first inner lateral surfaces, a mounting surface connected to the first inner lateral surfaces and located higher than the bottom surface in a region different from the bottom surface when viewed from above, and second inner lateral surfaces connecting the bottom surface and the mounting surface. The wavelength converting member is fixed on the mounting surface.