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公开(公告)号:US10745326B2
公开(公告)日:2020-08-18
申请号:US15609387
申请日:2017-05-31
Applicant: NGK Insulators, Ltd.
Inventor: Akinobu Oribe , Takahiro Tomita , Hiroharu Kobayashi
IPC: C04B38/06 , C04B37/00 , C04B35/484
Abstract: A porous ceramic structure includes one sheet, and a plurality of porous ceramic particles bonded on the sheet. A gap d formed between adjacent ones of the porous ceramic particles is 10˜80 μm.
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公开(公告)号:US10442739B2
公开(公告)日:2019-10-15
申请号:US15221903
申请日:2016-07-28
Applicant: NGK INSULATORS, LTD.
Inventor: Hiroharu Kobayashi
IPC: C04B38/00 , C08K7/24 , F02F1/42 , C04B35/488 , C04B35/622 , C04B35/626 , C04B35/638 , C04B35/48 , C04B35/634 , C04B38/06 , C09K21/02 , F01N13/08 , F01N13/14 , C04B111/00 , C04B111/28
Abstract: Provided is a porous plate-shaped filler that can be used as a material for a heat-insulation film having excellent heat insulation performance. In a porous plate-shaped filler 1 having a plate shape, an aspect ratio is 3 or higher, a minimum length is 0.5 to 50 μm, and an overall porosity is 20 to 90%, and the porosity is lower in the circumferential part than in the center part. When this porous plate-shaped filler 1 of the present invention is contained in a heat-insulation film, the infiltration of a matrix into the filler is reduced, and thus the thermal conductivity can be lowered. Therefore, even a thin heat-insulation film can have a greater heat-insulation effect than before.
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公开(公告)号:US10317004B2
公开(公告)日:2019-06-11
申请号:US15284798
申请日:2016-10-04
Applicant: NGK INSULATORS, LTD.
Inventor: Hiroharu Kobayashi , Takahiro Tomita , Akinobu Oribe
IPC: C09D7/40 , F16L59/02 , C09D7/62 , C04B38/00 , C04B38/06 , C09D201/00 , C09C1/00 , C09C1/30 , C09C1/36 , C09C1/40 , C09C3/00 , C09C3/04 , C09C3/06 , C09C3/10 , C09D183/04 , C04B35/48
Abstract: A porous plate-shaped filler is a plate shape having an aspect ratio of 3 or more, and has a minimum length of 0.1 to 50 μm and a porosity of 20 to 90%. Furthermore, the porous plate-shaped filler 1 includes plate-shaped pores 2 having an aspect ratio of 1.5 or more. Consequently, in the porous plate-shaped filler, a thermal conductivity is low. The heat insulation film includes the porous plate-shaped filler, whereby a heat insulation effect of the heat insulation film can improve.
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公开(公告)号:US20160195344A1
公开(公告)日:2016-07-07
申请号:US15044299
申请日:2016-02-16
Applicant: NGK INSULATORS, LTD.
Inventor: Takahiro Tomita , Kenkichi Nagai , Hiroharu Kobayashi
IPC: F28F13/00
CPC classification number: F28F13/00 , F28F2013/001 , F28F2013/005 , F28F2013/008 , H01L23/3731 , H01L23/3733 , H01L2924/0002 , H01L2924/00
Abstract: The thermal diode is formed of a first material as a ceramic material exhibiting thermal conductivity that increases in a certain temperature range of −200° C. or higher but 1000° C. or lower and a second material exhibiting the thermal conductivity that decreases in the temperature range, the first material and the second material being bonded together. The first material has preferably a microstructure having a characteristic length La of 1 nm to 10 μm.
Abstract translation: 热二极管由作为陶瓷材料的第一材料形成,其具有在-200℃或更高但1000℃或更低的特定温度范围内增加的导热性,并且在第 温度范围,第一材料和第二材料结合在一起。 第一材料优选具有1nm至10μm的特征长度La的微结构。
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公开(公告)号:US11059753B2
公开(公告)日:2021-07-13
申请号:US16420334
申请日:2019-05-23
Applicant: NGK INSULATORS, LTD.
Inventor: Yoshimasa Kobayashi , Hiroharu Kobayashi , Kazuki Iida
IPC: C04B35/581 , C04B35/645
Abstract: A method for producing an oriented AlN sintered body includes a first step of preparing a formed body by forming a mixture obtained by mixing a sintering aid with an AlN raw-material powder containing a plate-like AlN powder whose plate surface is a c-plane and which has an aspect ratio of 3 or more and an average thickness of 0.05 to 1.8 μm, wherein the mixture is formed such that the plate surface of the plate-like AlN powder is disposed along a surface of the formed body; and a second step of obtaining an oriented AlN sintered body by subjecting the formed body to hot-press sintering in a non-oxidizing atmosphere while applying a pressure to the surface of the formed body.
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公开(公告)号:US20200010374A1
公开(公告)日:2020-01-09
申请号:US16575768
申请日:2019-09-19
Applicant: NGK Insulators, Ltd.
Inventor: Hiroharu Kobayashi , Kazuki Iida , Yoshimasa Kobayashi
IPC: C04B35/581 , C01B21/072 , C04B35/63 , C04B35/64
Abstract: Aluminum nitride particles used as a material of an aluminum nitride sintered compact are disclosed. The aluminum nitride particles may have a same crystal orientation. The aluminum nitride particles each have an aspect ratio of 3 or more, a plate-like shape, a planar length of 0.6 μm or more and 20 μm or less, and a thickness length of 0.05 μm or more and 2 μm or less.
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公开(公告)号:US20180134574A1
公开(公告)日:2018-05-17
申请号:US15869506
申请日:2018-01-12
Applicant: NGK Insulators, Ltd.
Inventor: Hiroharu Kobayashi , Takahiro Tomita , Akinobu Oribe
CPC classification number: C01G25/02 , C04B38/00 , C04B2201/32 , C04B35/00 , C04B38/0054 , C04B38/0074
Abstract: A porous ceramic particle has a porosity of 20% to 99%, and one principal surface of the porous ceramic particle is a mirror surface, and an aspect ratio thereof is greater than or equal to 3.
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公开(公告)号:US20170349497A1
公开(公告)日:2017-12-07
申请号:US15609421
申请日:2017-05-31
Applicant: NGK Insulators, Ltd.
Inventor: Akinobu ORIBE , Takahiro Tomita , Hiroharu Kobayashi
IPC: C04B37/00 , C04B35/484 , C04B38/06 , C04B35/626 , C04B35/64
CPC classification number: C04B37/001 , C04B35/484 , C04B35/6261 , C04B35/64 , C04B37/008 , C04B38/067 , C04B2235/3225 , C04B2235/3246 , C04B2235/6025 , C04B2235/6567 , C04B2235/94 , C04B2235/95 , C04B2237/348 , C04B38/0054 , C04B38/0074
Abstract: A porous ceramic structure includes one sheet, and a porous ceramic aggregate bonded on the sheet. The porous ceramic aggregate includes a plurality of porous ceramic particles.
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公开(公告)号:US09656920B2
公开(公告)日:2017-05-23
申请号:US15001541
申请日:2016-01-20
Applicant: NGK INSULATORS, LTD.
Inventor: Takahiro Tomita , Kenkichi Nagai , Hiroharu Kobayashi
IPC: C04B35/565 , C04B35/584 , C04B35/581 , C04B35/575 , H01H37/32 , C04B38/00
CPC classification number: C04B35/584 , C04B35/565 , C04B35/575 , C04B35/581 , C04B38/008 , C04B2235/3213 , C04B2235/3217 , C04B2235/3225 , C04B2235/5445 , C04B2235/5454 , C04B2235/666 , C04B2235/781 , C04B2235/85 , C04B2235/9607 , H01H37/32
Abstract: A ceramic material has a characteristic length La of a micro-structure thereof that satisfies 0.1 LAMFP≦La≦100 LAMFP, and has thermal conductivity that monotonously increases from room temperature to 100° C., where LAMFP denotes apparent mean free path of phonons at room temperature, and is defined as LAMFP=(3×thermal conductivity)/(heat capacity×speed of sound). The characteristic length La of the micro-structure is an interval between particles of different type of material when the ceramic material includes a composite material in which the different type of material is dispersed in a base material, is an interval between one pore and another pore when the ceramic material includes a porous body, and is the crystalline particle size (interval between one grain boundary and another grain boundary) when the ceramic material includes a polycrystalline body.
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公开(公告)号:US11136271B2
公开(公告)日:2021-10-05
申请号:US16575768
申请日:2019-09-19
Applicant: NGK Insulators, Ltd.
Inventor: Hiroharu Kobayashi , Kazuki Iida , Yoshimasa Kobayashi
IPC: C04B35/581 , C01B21/072 , C04B35/63 , C04B35/64
Abstract: Aluminum nitride particles used as a material of an aluminum nitride sintered compact are disclosed. The aluminum nitride particles may have a same crystal orientation. The aluminum nitride particles each have an aspect ratio of 3 or more, a plate-like shape, a planar length of 0.6 μm or more and 20 μm or less, and a thickness length of 0.05 μm or more and 2 μm or less.
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