公开(公告)号：US09797781B2

公开(公告)日：2017-10-24

申请号：US14683211

申请日：2015-04-10

申请人： Murata Manufacturing Co., Ltd.

发明人： Tadamasa Miura ,  Shuichi Kawata ,  Yuki Yamamoto

IPC分类号： H01C7/10 ,  G01K7/22 ,  H01C7/02 ,  H01C7/04 ,  H01C1/14 ,  H01C1/012 ,  H01C7/00 ,  H01M2/34 ,  H01M10/48 ,  H01M10/0525

CPC分类号： G01K7/22 ,  H01C1/012 ,  H01C1/14 ,  H01C1/1406 ,  H01C1/1413 ,  H01C7/008 ,  H01C7/02 ,  H01C7/04 ,  H01M2/348 ,  H01M10/0525 ,  H01M10/486 ,  H01M2200/10

摘要： In order to further improve stress tolerance, a thermistor device includes a first base material member made of resin, a thermistor element including a thermistor thin film provided on a metal base material and first and second external electrodes provided on the thermistor thin film, and a first lead electrode and a second lead electrode provided on a principal surface of the first base material member, and connected to the first external electrode and the second external electrode. Each of the metal base material and the thermistor thin film undergoes a deflection between the first external electrode and the second external electrode.

公开(公告)号：US20150173185A1

公开(公告)日：2015-06-18

申请号：US14635429

申请日：2015-03-02

申请人： Murata Manufacturing Co., Ltd.

发明人： Satoshi Ito ,  Yoichi Moriya ,  Tetsuo Kanamori ,  Yukihiro Yagi ,  Yuki Yamamoto

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K3/06 ,  H05K1/11

CPC分类号： H05K1/0298 ,  H05K1/115 ,  H05K3/06 ,  H05K3/38 ,  H05K3/4038 ,  H05K3/4661 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/0554 ,  H05K2203/063 ,  H05K2203/1105 ,  H05K2203/1461

摘要： A circuit board structure and a manufacturing method for a circuit board that ensures an electrical connection between a metal foil and a projection without using a conductive adhesive and is less likely to cause a decrease in the reliability of the connection due to the interlayer separation or the like is provided. A circuit board includes an insulating layer, a lower main surface wiring pattern and an upper main surface wiring pattern disposed on either side of the insulating layer, and an interlayer connection conductor passing through the insulating layer in a thickness direction and electrically connecting to the lower main surface wiring pattern and the upper main surface wiring pattern. The interlayer connection conductor is formed integrally with the lower main surface wiring pattern, and is bonded to the upper main surface wiring pattern via an intermetallic compound.

摘要翻译： 一种用于电路板的电路板结构和制造方法，其确保金属箔和突起之间的电连接而不使用导电粘合剂，并且不太可能导致由于层间隔离引起的连接的可靠性降低 喜欢被提供。 电路板包括绝缘层，下主表面布线图案和布置在绝缘层两侧的上主表面布线图案，以及层间连接导体，其沿​​厚度方向穿过绝缘层并电连接到下层 主表面布线图案和上表面布线图案。 层间连接导体与下主表面布线图形一体地形成，并且通过金属间化合物结合到上主表面布线图案。