CERAMIC ELECTRONIC COMPONENT
    1.
    发明公开

    公开(公告)号:US20240321516A1

    公开(公告)日:2024-09-26

    申请号:US18678525

    申请日:2024-05-30

    发明人: Takuya GOITSUKA

    摘要: To provide ceramic electronic component capable of increasing strength of identification mark against physical impact from outside while suppressing decrease in recognition accuracy of identification mark. Ceramic electronic component includes element body containing ceramic as main material, and identification mark formed on surface of element body, at least a part of identification mark protruding from surface of element body. Element body includes first portion that surrounds identification mark and is in contact with outer edge portion of identification mark when viewed from thickness direction orthogonal to surface of element body, and second portion surrounding first portion when viewed from thickness. First portion is raised with respect to second portion.

    CERAMIC ELECTRONIC COMPONENT
    3.
    发明公开

    公开(公告)号:US20240282519A1

    公开(公告)日:2024-08-22

    申请号:US18654216

    申请日:2024-05-03

    发明人: Takuya GOITSUKA

    IPC分类号: H01G2/24 H01G4/12

    CPC分类号: H01G2/24 H01G4/1209

    摘要: A ceramic electronic component that includes: an element body containing ceramic as main material thereof; and an identification mark on a surface of element body, wherein the element body includes: a first layer containing a specific compound containing barium and silicon; and a second layer that contains the specific compound, is interposed between the identification mark and the first layer, and has a proportion of the specific compound lower than a proportion of the specific compound in the first layer.

    CERAMIC LAMINATED SUBSTRATE, MODULE, AND METHOD OF MANUFACTURING CERAMIC LAMINATED SUBSTRATE

    公开(公告)号:US20210143092A1

    公开(公告)日:2021-05-13

    申请号:US17156026

    申请日:2021-01-22

    发明人: Takuya GOITSUKA

    摘要: Provided is a ceramic laminated substrate which is formed on an electronic component to be mounted and is less likely to cause mounting defects even if there is irregularity in the height of solders. The ceramic laminated substrate includes: a ceramic laminate on which ceramic layers are laminated; via conductors; terminal electrodes; and a land electrode. The land electrode has a first land electrode and a second land electrode that are used to join different terminal electrodes of a single electronic component. The area of the first land electrode is smaller than the area of the second land electrode, and the first land electrode has a bump electrode and a plating layer, the second land electrode has a membrane electrode and plating layers, and the height of the first land electrode is formed higher than the height of the second land electrode.