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公开(公告)号:US20240321516A1
公开(公告)日:2024-09-26
申请号:US18678525
申请日:2024-05-30
发明人: Takuya GOITSUKA
摘要: To provide ceramic electronic component capable of increasing strength of identification mark against physical impact from outside while suppressing decrease in recognition accuracy of identification mark. Ceramic electronic component includes element body containing ceramic as main material, and identification mark formed on surface of element body, at least a part of identification mark protruding from surface of element body. Element body includes first portion that surrounds identification mark and is in contact with outer edge portion of identification mark when viewed from thickness direction orthogonal to surface of element body, and second portion surrounding first portion when viewed from thickness. First portion is raised with respect to second portion.
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2.
公开(公告)号:US20220183156A1
公开(公告)日:2022-06-09
申请号:US17652104
申请日:2022-02-23
发明人: Takuya GOITSUKA
摘要: A stacked-layer board includes a base material including a plurality of dielectric layers stacked on each other, a first main surface being a surface at one end in a stacking direction of the plurality of dielectric layers, and a second main surface being a surface at the other end in the stacking direction, and a first conductor provided on the first main surface, and a first groove is in a surface of the first conductor.
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公开(公告)号:US20240282519A1
公开(公告)日:2024-08-22
申请号:US18654216
申请日:2024-05-03
发明人: Takuya GOITSUKA
CPC分类号: H01G2/24 , H01G4/1209
摘要: A ceramic electronic component that includes: an element body containing ceramic as main material thereof; and an identification mark on a surface of element body, wherein the element body includes: a first layer containing a specific compound containing barium and silicon; and a second layer that contains the specific compound, is interposed between the identification mark and the first layer, and has a proportion of the specific compound lower than a proportion of the specific compound in the first layer.
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4.
公开(公告)号:US20230144181A1
公开(公告)日:2023-05-11
申请号:US18149205
申请日:2023-01-03
发明人: Takuya GOITSUKA
CPC分类号: H01L23/49838 , H01L23/13 , H01L24/13 , H01L25/04 , H01L25/18 , H05K1/18 , H05K3/34 , H05K3/46 , H01L2224/13005 , H01L2224/81193 , H01L2924/15787 , H01L2924/19105
摘要: Provided is a ceramic laminated substrate which is formed on an electronic component to be mounted and is less likely to cause mounting defects even if there is irregularity in the height of solders. The ceramic laminated substrate includes: a ceramic laminate on which ceramic layers are laminated; via conductors; terminal electrodes; and a land electrode. The land electrode has a first land electrode and a second land electrode that are used to join different terminal electrodes of a single electronic component. The area of the first land electrode is smaller than the area of the second land electrode, and the first land electrode has a bump electrode and a plating layer, the second land electrode has a membrane electrode and plating layers, and the height of the first land electrode is formed higher than the height of the second land electrode.
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5.
公开(公告)号:US20210143092A1
公开(公告)日:2021-05-13
申请号:US17156026
申请日:2021-01-22
发明人: Takuya GOITSUKA
摘要: Provided is a ceramic laminated substrate which is formed on an electronic component to be mounted and is less likely to cause mounting defects even if there is irregularity in the height of solders. The ceramic laminated substrate includes: a ceramic laminate on which ceramic layers are laminated; via conductors; terminal electrodes; and a land electrode. The land electrode has a first land electrode and a second land electrode that are used to join different terminal electrodes of a single electronic component. The area of the first land electrode is smaller than the area of the second land electrode, and the first land electrode has a bump electrode and a plating layer, the second land electrode has a membrane electrode and plating layers, and the height of the first land electrode is formed higher than the height of the second land electrode.
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