公开(公告)号：US20180192518A1

公开(公告)日：2018-07-05

申请号：US15907366

申请日：2018-02-28

申请人： Murata Manufacturing Co., Ltd.

发明人： Yoshihito OTSUBO ,  Masaaki MINAMI

IPC分类号： H05K1/14 ,  H05K1/03 ,  H05K3/36 ,  B32B15/08 ,  B23K20/10 ,  B29C65/08 ,  B29C65/00

CPC分类号： H05K1/142 ,  B23K20/10 ,  B29C65/08 ,  B29C65/081 ,  B29C66/1282 ,  B29C66/12841 ,  B29C66/43 ,  B29C66/71 ,  B29C66/72321 ,  B29C66/73161 ,  B29C66/73921 ,  B29C66/742 ,  B29C66/81419 ,  B29C66/8322 ,  B29K2705/02 ,  B29K2995/0072 ,  B29K2995/0074 ,  B29L2031/3425 ,  B32B15/08 ,  B32B2457/08 ,  H05K1/0313 ,  H05K1/117 ,  H05K1/147 ,  H05K3/328 ,  H05K3/36 ,  H05K3/368 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0338 ,  H05K2201/09036 ,  H05K2203/0278 ,  H05K2203/0285 ,  Y10T428/19 ,  B29K2067/003

摘要： A resin board structure includes a first member including a first metal film and one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, and a second member including a second metal film. The first and second metal films are bonded together, and at least a portion the first metal film and at least a portion of the second metal film overlap each other. The first and second metal films are metallurgically bonded at an interface between the first metal film and the second metal film. The first member includes a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other, and the first junction resin covering portion includes an uneven surface to reduce or prevent slippage due to ultrasonic vibration.