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    Parallel robot
    1.
    发明申请
    Parallel robot 有权
    平行机器人

    公开(公告)号：US20060245894A1

    公开(公告)日：2006-11-02

    申请号：US11084829

    申请日：2005-03-21

    申请人： Michael Merz ,  Shambhu Roy

    发明人： Michael Merz ,  Shambhu Roy

    IPC分类号： B66F9/00

    CPC分类号： B25J17/0266 ,  B25J9/104 ,  B25J19/0016 ,  Y10S414/115 ,  Y10T74/20305 ,  Y10T74/20329

    摘要： A parallel robot or parallel kinematics mechanism is provided for uses such as robotics or machining. The mechanism comprises a fixed base, a main arm, and a first and second support arm to position and orient an object in a cylindrical space with at least three degrees of freedom and retained inclination. The main arm includes an end component for supporting the object and linkage means to retain the inclination of the end component with respect to the base for all positions and orientations of the end component. The mechanism advantageously provides a large cylindrical workspace and a small footprint and is capable of moving an object at high accelerations and speeds. The mechanism can be equipped with an additional motor to orient an object, thereby providing the mobility of a SCARA robot. Alternatively, it can be equipped with passive transmission means that allow for an object to be displaced in parallel to itself.

    摘要翻译： 提供并行机器人或平行运动机构用于机器人或机械加工等用途。 该机构包括固定基座，主臂以及第一和第二支撑臂，以在至少三个自由度和保持的倾斜度的空间中定位和定向物体在圆柱形空间中。 主臂包括用于支撑物体的端部部件和联动装置，以保持端部部件相对于基部的倾斜，用于端部部件的所有位置和取向。 该机构有利地提供了大的圆柱形工作空间和小的占地面积，并且能够以高加速度和速度移动物体。 该机构可以配备有额外的电机来定向物体，从而提供SCARA机器人的移动性。 或者，其可以配备有被动传输装置，其允许物体与其自身平行移位。

    BIASABLE COOLING PEDESTAL
    2.
    发明申请
    BIASABLE COOLING PEDESTAL 审中-公开
    可变冷却垫

    公开(公告)号：US20100247804A1

    公开(公告)日：2010-09-30

    申请号：US12730762

    申请日：2010-03-24

    申请人： Shambhu Roy

    发明人： Shambhu Roy

    IPC分类号： C23C16/44 ,  C23C16/00

    CPC分类号： C23C14/541 ,  C23C14/345 ,  C23C14/50 ,  H01J37/20 ,  H01J37/34 ,  H01J2237/2001 ,  H01L21/67109

    摘要： In some embodiments, a method for cooling a substrate upon a biasable cooling pedestal for supporting a substrate during deposition within a plasma vapor deposition chamber may include a supplying a low pressure inert gas from the shaft of a liquid-chilled pedestal to flow through one or more channels within grooved a metal substrate support and a liquid-chilled body. By maintaining a cooling gas supply at a pressure well below that which may displace the weight of the substrate, the gas may enable even heat transfer between the cooling pedestal and the substrate to cool the substrate during deposition without the use of electrical or mechanical mechanisms for clamping the substrate in place.

    摘要翻译： 在一些实施例中，在用于在等离子体气相沉积室内沉积期间支撑衬底的可偏置冷却基座上冷却衬底的方法可包括从液体冷却基座的轴供应低压惰性气体流过一个或 沟槽内有更多的通道，金属基底支架和液体冷却体。 通过将冷却气体供应保持在远低于可能移动基板重量的压力下，气体可以实现冷却基座和基板之间的均匀传热，以在沉积期间冷却基板，而不需要使用电气或机械机构 将基板夹紧就位。

    Micro thermal chamber having proximity control temperature management for devices under test
    5.
    发明申请
    Micro thermal chamber having proximity control temperature management for devices under test 有权
    微型热室具有接受测试设备的温度管理

    公开(公告)号：US20050224492A1

    公开(公告)日：2005-10-13

    申请号：US10822841

    申请日：2004-04-13

    申请人： Shambhu Roy

    发明人： Shambhu Roy

    IPC分类号： G01R31/28 ,  G01R31/319 ,  H05B1/02

    CPC分类号： G01R31/31905 ,  G01R31/2862 ,  G01R31/2877

    摘要： A temperature unit to control a temperature of a device under test using a fluid includes a block disposed opposite the device under test and which defines a gap therebetween and through which the fluid passes across the device under test at a gap flow rate, and an actuator which moves the block. By adjusting the gap, the gap flow rate of the fluid flowing over the device under test changes so as to adjust the temperature of the device under test. Additionally, the block can be a heater block which generates heat receivable by the device under test across the gap such that the adjustment of the heater block by the actuator changes a thermal resistance across the gap.

    摘要翻译： 使用流体控制被测设备的温度的温度单元包括与被测设备相对设置的块，其限定了它们之间的间隙，并且流体通过该间隙以间隙流速穿过被测器件，并且致动器 它移动块。 通过调整间隙，流过被测器件的流体的间隙流量变化，以便调节被测器件的温度。 此外，该块可以是加热器块，该加热器块产生受被测器件在间隙上可接收的热量，使得致动器对加热器块的调节改变跨越间隙的热阻。