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公开(公告)号：US20170105193A1
公开(公告)日：2017-04-13
申请号：US15291951
申请日：2016-10-12
Applicant: MEDIATEK INC.
Inventor： Te-Huang Liu , Huang-Yi Yu , Chia-Feng Yeh , Chih-Kuang Wu , Cheng-Hsien Chang
IPC: H04W68/02
Abstract: Aspects of the disclosure provide a method for call management. The method includes receiving a signal from one of a first transceiver and a second transceiver in an electronic device. The signal indicates an incoming call managed by a first service provider that the electronic device subscribes service from. The method further includes determining whether the other of the first transceiver and the second transceiver is operative in an active call managed by a second service provider that the electronic device subscribes service from, and rejecting the incoming call when the other transceiver is operative in the active call managed by the second service provider.
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公开(公告)号：US20250085751A1
公开(公告)日：2025-03-13
申请号：US18788086
申请日：2024-07-29
Applicant: MEDIATEK INC.
Inventor： Yu-Chia Chang , Chien-Chih Huang , Ta-Chang Liao , Chia-Feng Yeh , Ching-Lin Hsiao , Wei-Te Wu
IPC: G06F1/20 , G06F1/3234
Abstract: A thermal power budget optimization method includes acquiring sensor log information from a plurality of sensors of a heating device, generating a virtual surface temperature of the heating device according to the sensor log information, setting a target surface temperature of the heating device, and dynamically adjusting a thermal power budget of the heating device according to the virtual surface temperature and the target surface temperature over time.
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公开(公告)号：US09521246B2
公开(公告)日：2016-12-13
申请号：US14670418
申请日：2015-03-27
Applicant: MEDIATEK INC.
Inventor： Jih-Ming Hsu , Wei-Ting Wang , Wen-Tsan Hsieh , Tai-Yu Chen , Chia-Feng Yeh , Chien-Tse Fang
CPC classification number: H04M1/72569 , G06F1/206 , H04M1/72525 , H04M1/72577
Abstract: The invention provides a thermal control method and a thermal control system. The thermal control method comprises: detecting a temperature variance of a component of the electronic device to generate a detecting result; and determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result. The thermal control system comprises: a detecting unit, for detecting a temperature variance of a component of the electronic device to generate a detecting result; and a determining unit, for determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result.
Abstract translation: 本发明提供一种热控制方法和热控制系统。 热控制方法包括：检测电子设备的部件的温度变化以产生检测结果; 以及根据检测结果确定集成电路的温度阈值作为节流点。 热控制系统包括：检测单元，用于检测电子设备的部件的温度变化以产生检测结果; 以及确定单元，用于根据检测结果将集成电路的温度阈值确定为节流点。
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公开(公告)号：US09837595B2
公开(公告)日：2017-12-05
申请号：US14717159
申请日：2015-05-20
Applicant: MediaTek Inc.
Inventor： Long-Kun Yu , Chin-Chiang Chang , Chia-Wei Chi , Chia-Feng Yeh , Tai-Yu Chen
IPC: H02J7/04 , H02J7/16 , H01L35/32 , H01L23/498 , H01L35/28 , H01L21/66 , H01L23/04 , H01L23/12 , H01L23/20 , H01L23/00 , H01L25/04 , H02J7/00 , H01L23/38
CPC classification number: H01L35/32 , H01L22/34 , H01L23/04 , H01L23/12 , H01L23/20 , H01L23/38 , H01L23/49811 , H01L23/49827 , H01L24/17 , H01L25/04 , H01L35/28 , H01L2224/08145 , H01L2224/16145 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17107 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/18161 , H02J7/0052 , H01L2924/00012 , H01L2924/00
Abstract: The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.
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Patent Agency Ranking
公开(公告)号：US09785157B2
公开(公告)日：2017-10-10
申请号：US14863426
申请日：2015-09-23
Applicant: MEDIATEK INC.
Inventor： Wei-Ting Wang , Chia-Feng Yeh
CPC classification number: G05D23/1917 , G06F1/206 , G06F1/3209 , G06F1/3215 , G06F1/325 , G06F1/329 , Y02D10/24
Abstract: A method for controlling circuit modules within a chip is provided, wherein the circuit modules includes at least one processor and at least one network module, and the method includes: obtaining a plurality of temperature-related information of the circuit modules; and allocating power limits or throughput limits of the circuit modules according to the temperature-related information of the circuit modules, respectively.
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6.发明申请METHOD FOR CONTROLLING CIRCUIT MODULES WITHIN CHIP AND ASSOCIATED SYSTEM ON CHIP 有权用于控制芯片中的电路模块的方法和芯片上的相关系统公开(公告)号：US20160291665A1
公开(公告)日：2016-10-06
申请号：US14863426
申请日：2015-09-23
Applicant: MEDIATEK INC.
Inventor： Wei-Ting Wang , Chia-Feng Yeh
CPC classification number: G05D23/1917 , G06F1/206 , G06F1/3209 , G06F1/3215 , G06F1/325 , G06F1/329 , Y02D10/24
Abstract: A method for controlling circuit modules within a chip is provided, wherein the circuit modules includes at least one processor and at least one network module, and the method includes: obtaining a plurality of temperature-related information of the circuit modules; and allocating power limits or throughput limits of the circuit modules according to the temperature-related information of the circuit modules, respectively.
Abstract translation: 提供了一种用于控制芯片内的电路模块的方法，其中电路模块包括至少一个处理器和至少一个网络模块，该方法包括：获得电路模块的多个温度相关信息; 以及分别根据电路模块的温度相关信息分配电路模块的功率限制或吞吐量极限。
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7.发明申请THERMAL PROTECTION METHOD FOR REFERRING TO THERMAL HEADROOM TO CONTROL SELECTION OF COMPUTING POWER SETTING OF PROCESSOR-BASED SYSTEM AND RELATED MACHINE READABLE MEDIUM 审中-公开用于引导热源的热保护方法以控制基于处理器的系统的计算功率选择和相关机器可读介质的选择公开(公告)号：US20160034009A1
公开(公告)日：2016-02-04
申请号：US14700111
申请日：2015-04-29
Applicant: Mediatek Inc.
Inventor： Wei-Ting Wang , Chien-Tse Fang , Chia-Feng Yeh
IPC: G06F1/20
CPC classification number: G06F1/206
Abstract: A thermal protection method includes: determining a thermal headroom based on a difference between a current temperature and a predetermined threshold temperature; determining a power budget based on the thermal headroom; and utilizing a processor-based system to employ a target computing power setting according to at least the power budget, wherein selection of the target computing power setting is constrained by the power budget to ensure that the target computing power setting does not make the current temperature exceed the predetermined threshold temperature when employed by the processor-based system.
Abstract translation: 热保护方法包括：基于当前温度和预定阈值温度之间的差来确定热余量; 基于热余量确定功率预算; 并且利用基于处理器的系统来根据至少功率预算来采用目标计算能力设置，其中目标计算能力设置的选择受功率预算约束，以确保目标计算功率设置不使当前温度 在基于处理器的系统使用时超过预定阈值温度。
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8.发明申请公开(公告)号：US20150378501A1
公开(公告)日：2015-12-31
申请号：US14764582
申请日：2014-12-30
Applicant: MEDIATEK INC.
Inventor： Hsiao-Wen Chen , Cheng-Wei Shih , Yung-Tso Chen , Chia-Feng Yeh
CPC classification number: G06F3/0416 , G06F3/0488 , H04B5/0031 , H04B5/02 , H04W4/80 , H04W76/10
Abstract: A touch communication connection establishing method, for establishing a touch communication between a first touch panel device (500) with a first touch panel (501) and a second touch panel device (900) with a second touch panel (901). The touch communication connection establishing method comprises: sensing at least one control action, wherein the control action comprises at least one touch communication related action, and/or determining if an arrangement of the control action meets a predetermined rule to generate a determining result; and establishing the touch communication connection between the first touch panel device (500) and the second touch panel device (900) based on the determining result.
Abstract translation: 一种用于在具有第一触摸面板（501）的第一触摸面板装置（500）和第二触摸面板装置（900）之间建立触摸通信的触摸通信连接建立方法。 所述触摸通信连接建立方法包括：感测至少一个控制动作，其中所述控制动作包括至少一个触摸通信相关动作，和/或确定所述控制动作的配置是否满足预定规则以产生确定结果; 以及基于确定结果建立第一触摸面板装置（500）和第二触摸面板装置（900）之间的触摸通信连接。
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公开(公告)号：US20150350407A1
公开(公告)日：2015-12-03
申请号：US14670418
申请日：2015-03-27
Applicant: Mediatek Inc.
Inventor： Jih-Ming Hsu , Wei-Ting Wang , Wen-Tsan Hsieh , Tai-Yu Chen , Chia-Feng Yeh , Chien-Tse Fang
IPC: H04M1/725
CPC classification number: H04M1/72569 , G06F1/206 , H04M1/72525 , H04M1/72577
Abstract: The invention provides a thermal control method and a thermal control system. The thermal control method comprises: detecting a temperature variance of a component of the electronic device to generate a detecting result; and determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result. The thermal control system comprises: a detecting unit, for detecting a temperature variance of a component of the electronic device to generate a detecting result; and a determining unit, for determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result.
Abstract translation: 本发明提供一种热控制方法和热控制系统。 热控制方法包括：检测电子设备的部件的温度变化以产生检测结果; 以及根据检测结果确定集成电路的温度阈值作为节流点。 热控制系统包括：检测单元，用于检测电子设备的部件的温度变化以产生检测结果; 以及确定单元，用于根据检测结果将集成电路的温度阈值确定为节流点。
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