摘要:
Disclosed is a semiconductor integrated circuit device that includes an output circuit with power thereof supplied from one power supply system, an input circuit with an input terminal thereof connected to an output terminal of the output circuit through a signal line and with power thereof supplied from other power supply system different from the one power supply system, and a circuit that restrains a current flowing from the output circuit into the signal line when an ESD stress is applied from the output circuit to a signal transmitting/receiving portion of the input circuit.
摘要:
A protection circuit that includes a first power supply system including a first power supply and a first ground, a second power supply system including a second power supply and a second ground, the second power supply system being connected to the first power supply system via a signal line through which signal transfer is performed between a circuit in the first power supply system and a circuit in the second power supply system, and a control circuit that, when coupled to an electro-static discharge (ESD) stress being applied to the first power supply system controls a switch, the switch being provided between the signal line and the first power supply.
摘要:
A protection circuit includes a first power supply system including a first power supply and a first ground, a second power supply system including a second power supply and a second ground, and a control circuit that, when coupled to an electro-static discharge (ESD) stress being applied to the first power supply system, controls a first switch. The first switch is provided between the signal line and the first ground. The control circuit includes a capacitance element, a resistance element in series with the capacitance element, and an inverter, an output of the inverter being connected between a gate of the first switch, an input of the inverter being connected to a connecting point between the capacitance element and the resistance element.
摘要:
A protection circuit includes a first power supply system including a first power supply and a first ground, a second power supply system including a second power supply and a second ground, and a control circuit that, when coupled to an electro-static discharge (ESD) stress being applied to the first power supply system, controls a first switch. The first switch is provided between the signal line and the first ground. The control circuit includes a capacitance element, a resistance element in series with the capacitance element, and an inverter, an output of the inverter being connected between a gate of the first switch, an input of the inverter being connected to a connecting point between the capacitance element and the resistance element.
摘要:
A protection circuit that includes a first power supply system including a first power supply and a first ground, a second power supply system including a second power supply and a second ground, the second power supply system being connected to the first power supply system via a signal line through which signal transfer is performed between a circuit in the first power supply system and a circuit in the second power supply system, and a control circuit that, when coupled to an electro-static discharge (ESD) stress being applied to the first power supply system controls a switch, the switch being provided between the signal line and the first power supply.
摘要:
Disclosed is a semiconductor integrated circuit device that includes an output circuit with power thereof supplied from one power supply system, an input circuit with an input terminal thereof connected to an output terminal of the output circuit through a signal line and with power thereof supplied from other power supply system different from the one power supply system, and a circuit that restrains a current flowing from the output circuit into the signal line when an ESD stress is applied from the output circuit to a signal transmitting/receiving portion of the input circuit.
摘要:
To reduce the leak current in the MOSFET connected between the pad and the ground. There are provided a pad PAD for an input or output signal, an n-type MOSFET M1a connected between the pad PAD and the ground and having its gate terminal and backgate connected in common, and a potential control circuit 10 that controls a potential Vb of the gate terminal and the backgate of the n-type MOSFET M1a based on a potential Vin of the pad PAD. The potential control circuit 10 comprises n-type MOSFETs M2 and M3; the n-type MOSFET M1a has its gate terminal and backgate connected to backgates and drains of the n-type MOSFETs M2 and M3; the n-type MOSFET M2 has its source grounded and its gate terminal connected to the pad PAD via a resistance R; and the n-type MOSFET M3 has its source connected to the pad PAD and its gate terminal grounded.
摘要翻译:以减少连接在焊盘和地之间的MOSFET中的漏电流。 提供用于输入或输出信号的焊盘PAD,连接在焊盘PAD和地之间并且其栅极端子和背板共同连接的n型MOSFET M 1 a和控制电位的电位控制电路10 基于焊盘PAD的电位Vin,栅极端子和n型MOSFET M1a的背栅极的Vb。 电位控制电路10包括n型MOSFET M 2和M 3; n型MOSFET M 1 a的栅极端子和背栅极连接到n型MOSFET M 2和M 3的后栅和漏极; n型MOSFET M 2的源极接地,其栅极端子通过电阻R连接到焊盘PAD; 并且n型MOSFET M 3的源极连接到焊盘PAD并且其栅极端子接地。
摘要:
To reduce the leak current in the MOSFET connected between the pad and the ground. There are provided a pad PAD for an input or output signal, an n-type MOSFET M1a connected between the pad PAD and the ground and having its gate terminal and backgate connected in common, and a potential control circuit 10 that controls a potential Vb of the gate terminal and the backgate of the n-type MOSFET M1a based on a potential Vin of the pad PAD. The potential control circuit 10 comprises n-type MOSFETs M2 and M3; the n-type MOSFET M1a has its gate terminal and backgate connected to backgates and drains of the n-type MOSFETs M2 and M3; the n-type MOSFET M2 has its source grounded and its gate terminal connected to the pad PAD via a resistance R; and the n-type MOSFET M3 has its source connected to the pad PAD and its gate terminal grounded.
摘要:
A semiconductor integrated device includes a plurality of power system circuit units, a first circuit unit to which electric power is supplied from first power supply wiring, and first ground wiring to which the first circuit unit is coupled. Moreover, the semiconductor integrated device includes a second circuit unit to which electric power is supplied from second power supply wiring, and second ground wiring coupled to the second circuit unit. The first circuit unit includes a first interface circuit unit, and the second circuit unit includes a second interface circuit unit configured to perform inputting or outputting of a signal to and from the first interface circuit unit. The first ground wiring is coupled to the second ground wiring through a protection circuit, and the second interface circuit unit is placed in the vicinity of the first interface circuit unit.
摘要:
A semiconductor device includes a protective circuit at an input/output port thereof, wherein the protective circuit includes a plurality of protective MOS transistors. A diffused region is disposed between the n-type source/drain regions and a guard ring formed in a p-well for encircling the source/drain regions of the protective transistors. The diffused region is of lightly doped p-type or of an n-type and increases the resistance of a parasitic bipolar transistor formed in association with the protective transistors. The increase of the resistance assists protective function of the protective device against an ESD failure of the internal circuit of the semiconductor device.