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公开(公告)号:US07385559B2
公开(公告)日:2008-06-10
申请号:US11573519
申请日:2005-07-13
Applicant: Kiyoshi Kanagawa , Masanobu Okada
Inventor: Kiyoshi Kanagawa , Masanobu Okada
IPC: H01Q1/24
CPC classification number: H01Q1/242 , H01Q1/12 , H01R12/7011 , H01R13/2478 , H01R35/00 , H01R2201/02
Abstract: In an antenna feed structure for electrically connecting a rotatable antenna to a circuit formed on a circuit board by means of a feeding metallic part, an antenna rotary shaft formed so as to protrude from one end of the antenna and formed of a conductor has a preferably spherical end. The feeding metallic part has a mounting portion, an antenna contact-and-connection portion, and an elastic supporting portion. The mounting portion is mounted to the circuit board. The antenna contact-and-connection portion is brought into contact with and is connected to the end of the antenna rotary shaft. The elastic supporting portion supports the antenna contact-and-connection portion at the mounting portion and produces biasing force towards the antenna rotary shaft from the antenna contact-and-connection portion. The antenna contact-and-connection portion has a recess wall preferably having a spherical shape which is in correspondence with the spherical shape of the end of the antenna rotary shaft. The spherical end of the antenna rotary shaft press-contacts the spherical recess wall of the antenna contact-and-connection portion.
Abstract translation: 在通过馈电金属部件将可旋转天线电连接到形成在电路板上的电路的天线馈送结构中,形成为从天线的一端突出并由导体形成的天线旋转轴优选地 球形端。 馈电金属部件具有安装部分,天线接触连接部分和弹性支撑部分。 安装部安装在电路板上。 天线接触连接部分与天线旋转轴的端部接触并连接到天线旋转轴的端部。 弹性支撑部分在安装部分处支撑天线接触连接部分,并且从天线接触连接部分产生朝向天线旋转轴的偏压力。 天线接触连接部具有优选具有与天线旋转轴的端部的球形对应的球形的凹部壁。 天线旋转轴的球形端接触天线接触连接部分的球形凹槽。
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公开(公告)号:US5538442A
公开(公告)日:1996-07-23
申请号:US316510
申请日:1994-09-30
Applicant: Masanobu Okada
Inventor: Masanobu Okada
CPC classification number: H01R24/62 , H01R13/74 , H01R35/00 , Y10S439/946
Abstract: A modular fitting open slit, which is open at its rear end part, for freely inserting a modular plug into and removing it from said modular fitting open slit is provided at a rear end part of a modem card, and said open slit is provided with inner walls which function as a guide part for setting a direction of insertion of a modular plug, an extreme end position setting part for positioning an extreme end of said modular plug which is inserted, a return prevention part for engaging with said modular plug inserted to prevent it from coming off and terminals which function as a terminal connecting part which is electrically connected to the terminals of the modular plug. Said open slit is provided with L-shaped guide members for guiding insertion of said modular plug with their base sides set to be pivotally turnable and said guide members are formed to be freely remountable in said open slit. For inserting the modular plug into the open slit, the guide members are turned to make their L-shaped inner walls serve as the guide surfaces for positioning insertion of the modular plug. Thus the present invention enables to easily and accurately insert the modular plug insert into said open slit and provide a communication card which is not obstructive even when it is kept loaded in a personal computer or the like.
Abstract translation: 在调制解调器卡的后端部设置有在其后端开口的模块化配件开口狭缝,用于将模块化插头自由地插入所述模块化配件开放狭缝中并将其从所述模块化配件开口切除,并且所述开口狭缝设置有 用作设置模块化插头的插入方向的引导部的内壁,用于定位插入的所述模块化插头的前端的前端位置设定部,用于与插入的模块插头接合的防止返回部, 防止其脱离,并且用作电连接到模块化插头的端子的端子连接部的端子。 所述开口设置有L形引导件,用于引导所述组合式插头的插入,其底部侧面设置为可枢转地转动,并且所述导向件形成为可自由地重新安装在所述开口狭缝中。 为了将模块化插头插入打开的狭缝中,引导构件被转动以使其L形内壁用作用于定位插入模块化插头的引导表面。 因此,本发明能够容易且准确地将模块化插头插入到所述开放狭缝中,并且提供即使在个人计算机等中保持负载时也不阻碍的通信卡。
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公开(公告)号:US5395268A
公开(公告)日:1995-03-07
申请号:US096042
申请日:1993-07-22
Applicant: Masanobu Okada
Inventor: Masanobu Okada
IPC: H01R13/514 , G06F3/00 , G06K19/077 , H01R12/71 , H01R13/33 , H01R13/639 , H01R24/00 , H05K1/18 , H01R23/02
CPC classification number: H01R24/62 , H01R2201/16 , Y10S439/946
Abstract: A modular jack which is made thin. A hole is pierced in a flat member and a box member is disposed at an opening on one side of the hole. A modular plug is inserted through an opening opposite to the opening where the box member is located. At that time, the insertion direction is regulated by the inner walls of the hole or the inner walls of the box member, push is stopped by a bottom portion of the box member, return is stopped by a hook portion located near the opening through which the modular plug is inserted, and an electrode section is electrically connected to the modular plug. Springs enable only one action to be required.
Abstract translation: 一个变薄的模块化插座。 一个孔被刺穿在一个平的构件中,一个箱体被设置在孔一侧的一个开口处。 模块化插头通过与盒构件所在的开口相对的开口插入。 此时,插入方向由孔的内壁或盒构件的内壁调节,推动被盒构件的底部阻止,返回由位于开口附近的钩部停止,通过该钩部 插入模块化插头,电极部分电连接到模块化插头。 弹簧只能执行一个操作。
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公开(公告)号:US07407112B2
公开(公告)日:2008-08-05
申请号:US11852749
申请日:2007-09-10
Applicant: Kiyoshi Kanagawa , Masanobu Okada , Naoki Kitahora , Yutaka Ida
Inventor: Kiyoshi Kanagawa , Masanobu Okada , Naoki Kitahora , Yutaka Ida
IPC: G06K19/06
CPC classification number: H01Q1/2275 , G06K19/07749
Abstract: A card apparatus includes a card case housing a circuit substrate, a case main body and an extended portion made of resin material and being disposed integrally with the case main body. The extended portion accommodates one end side portion of the circuit substrate. The case main body includes a metal cover disposed opposite to at least one of the front surface and the back surface of the circuit substrate. A metal cover extension extending from the metal cover and constituted of a first conductive plate is embedded in a case wall constituting the extended portion, and a second conductive plate constituting an antenna element is embedded in the case wall constituting the extended portion, the second conductive plate being provided at a predetermined distance apart from the metal cover extension.
Abstract translation: 卡装置包括容纳电路基板的卡壳体,壳体主体和由树脂材料制成的延伸部分,并与壳体主体一体设置。 延伸部分容纳电路基板的一端侧部分。 壳体主体包括与电路基板的前表面和后表面中的至少一个相对设置的金属盖。 从金属盖延伸并由第一导电板构成的金属盖延伸部嵌入构成延伸部的壳壁中,构成天线元的第二导电板嵌入构成延伸部的壳壁上,第二导电 板与金属盖延伸部隔开预定距离设置。
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公开(公告)号:US20080009174A1
公开(公告)日:2008-01-10
申请号:US11574650
申请日:2005-07-13
Applicant: Kiyoshi Kanagawa , Masanobu Okada
Inventor: Kiyoshi Kanagawa , Masanobu Okada
CPC classification number: G06K7/003 , G06K7/0021 , G06K19/07741
Abstract: A card-type apparatus includes a circuit substrate and a card-type case for accommodating the circuit substrate including a flat portion disposed opposite to the circuit substrate with a gap between the circuit substrate and the flat portion. A memory card accommodating space, provided between the flat portion of the card-type case and the circuit substrate, is capable of detachably accommodating the memory card inserted from a memory card slot along the circuit substrate surface. A terminal is provided on a region of the circuit substrate in the memory card accommodating space. A plate section for adjusting the gap is provided on the flat portion on the side of the memory card accommodating space. On the plate section, a protrusion is provided so as to increase the contact pressure between the memory card and the terminal by pressing the memory card stored in the memory card accommodating space against the terminal.
Abstract translation: 卡式装置包括电路基板和用于容纳电路基板的卡型壳体,该电路基板包括与电路基板相对设置的平坦部分,在电路基板和平坦部分之间具有间隙。 设置在卡式壳体的平坦部分和电路基板之间的存储卡容纳空间能够沿着电路基板表面可拆卸地容纳从存储卡插槽插入的存储卡。 端子设置在存储卡容纳空间中的电路基板的区域上。 在存储卡容纳空间侧的平坦部分上设置有用于调整间隙的板部分。 在板部分上,设置突起,以通过将存储在存储卡容纳空间中的存储卡抵靠端子来增加存储卡和终端之间的接触压力。
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公开(公告)号:US06571469B2
公开(公告)日:2003-06-03
申请号:US09844245
申请日:2001-04-26
Applicant: Masanobu Okada , Kazuyoshi Nakaya , Hiroyuki Nakaji , Hirofumi Doi , Iku Nagai , Junichi Nakasone
Inventor: Masanobu Okada , Kazuyoshi Nakaya , Hiroyuki Nakaji , Hirofumi Doi , Iku Nagai , Junichi Nakasone
IPC: H01K310
CPC classification number: H01L23/49805 , H01L21/4853 , H01L2924/0002 , H01R43/0256 , H05K1/141 , H05K3/0052 , H05K3/3442 , H05K3/3478 , H05K3/368 , H05K3/403 , H05K3/42 , H05K2201/09181 , H05K2201/10984 , H05K2203/041 , H05K2203/043 , Y02P70/613 , Y10T29/49117 , Y10T29/49165 , Y10T29/49789 , Y10T29/4979 , H01L2924/00
Abstract: A blanking plate is attached to the bottom surfaces of a split board and a remaining board, which are separated from one bare board. After depositing solder paste on a back electrode of the split board, a solder ball is attached on the solder paste. The split board is then heated to melt the solder ball. The molten solder flows along the back electrode and an edge electrode into a through-hole. A portion of the molten solder swells out of the bottom surface of the bare board, and solidifies and bonds to the back electrode and the edge electrode.
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公开(公告)号:US06534726B1
公开(公告)日:2003-03-18
申请号:US09696097
申请日:2000-10-25
Applicant: Masanobu Okada , Tomoyuki Koide , Kazuyoshi Nakaya , Hiroyuki Nakaji
Inventor: Masanobu Okada , Tomoyuki Koide , Kazuyoshi Nakaya , Hiroyuki Nakaji
IPC: H01R1204
CPC classification number: H05K3/3442 , H01L23/49805 , H01L2924/0002 , H05K3/368 , H05K3/403 , H05K2201/09181 , H05K2201/209 , H05K2203/0415 , Y02P70/613 , Y10T29/49117 , Y10T29/49165 , H01L2924/00
Abstract: End-face through holes each comprising a concave-curved end-face opening groove and an end-face electrode covering the inner wall of the groove are formed in the end-faces of a substrate. Furthermore, a solder having a semi-circular shape is attached to the end-face electrode. The solder comprises an electrode facing portion facing the end-face electrode in the end-face groove, and a protuberant portion elongated from the electrode facing portion to protrude on the back-surface side of the substrate. Thereby, even if the substrate or the like is warped, a gap between the end-face electrode and the electrode pad of a mother board can be filled with the protuberant portion of the solder to connect the end-face electrode and the electrode pad to each other.
Abstract translation: 在基板的端面形成有各自包括凹曲面端面开口槽和覆盖槽内壁的端面电极的端面贯通孔。 此外,具有半圆形状的焊料附着到端面电极。 焊料包括在端面槽中面向端面电极的电极面对部分,以及从电极对向部分伸长以在基板的背面侧突出的突出部分。 由此,即使基板等翘曲,母板的端面电极和电极焊盘之间的间隙也可以填充焊料的隆起部分,以将端面电极和电极焊盘连接到 彼此。
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公开(公告)号:US07435127B2
公开(公告)日:2008-10-14
申请号:US11574650
申请日:2005-07-13
Applicant: Kiyoshi Kanagawa , Masanobu Okada
Inventor: Kiyoshi Kanagawa , Masanobu Okada
IPC: H01R13/64
CPC classification number: G06K7/003 , G06K7/0021 , G06K19/07741
Abstract: A card-type apparatus includes a circuit substrate and a card-type case for accommodating the circuit substrate including a flat portion disposed opposite to the circuit substrate with a gap between the circuit substrate and the flat portion. A memory card accommodating space, provided between the flat portion of the card-type case and the circuit substrate, is capable of detachably accommodating the memory card inserted from a memory card slot along the circuit substrate surface. A terminal is provided on a region of the circuit substrate in the memory card accommodating space. A plate section for adjusting the gap is provided on the flat portion on the side of the memory card accommodating space. On the plate section, a protrusion is provided so as to increase the contact pressure between the memory card and the terminal by pressing the memory card stored in the memory card accommodating space against the terminal.
Abstract translation: 卡式装置包括电路基板和用于容纳电路基板的卡型壳体,该电路基板包括与电路基板相对设置的平坦部分,在电路基板和平坦部分之间具有间隙。 设置在卡式壳体的平坦部分和电路基板之间的存储卡容纳空间能够沿着电路基板表面可拆卸地容纳从存储卡插槽插入的存储卡。 端子设置在存储卡容纳空间中的电路基板的区域上。 在存储卡容纳空间侧的平坦部分上设置有用于调整间隙的板部分。 在板部分上,设置突起,以通过将存储在存储卡容纳空间中的存储卡抵靠端子来增加存储卡和终端之间的接触压力。
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公开(公告)号:US07000312B2
公开(公告)日:2006-02-21
申请号:US10308120
申请日:2002-12-03
Applicant: Kenji Fukunabe , Masanobu Okada , Kazuyoshi Nakaya
Inventor: Kenji Fukunabe , Masanobu Okada , Kazuyoshi Nakaya
CPC classification number: H05K3/3442 , H05K3/3452 , H05K3/368 , H05K2201/09181 , H05K2201/09381 , H05K2201/09663 , H05K2201/099 , H05K2201/10984 , Y02P70/613 , Y10T29/49126 , Y10T29/49144 , Y10T29/49149
Abstract: In a circuit board, when lands provided on a rear surface of a substrate are each separated into a mainland and a sub-land, warping or other defects of the substrate can be ignored when soldering, and the substrate can be mounted with a high bonding strength. On the rear surface of a module substrate, partitions are each provided to separate a metal film into the mainland and the sub-land. Accordingly, when the substrate is mounted on a motherboard, solder applied beforehand from each end-surface electrode to the mainland can be largely protruded downward from the mainland, and warping or other defects of the substrate can be ignored by this protruding portion of the solder. In addition, in the state in which the substrate is mounted, since the solder is pushed out from between the mainland and the motherboard and overflows the partition, both the mainland and the sub-land can be soldered to the motherboard side, and hence stable bonding can be obtained at a large bonding area.
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公开(公告)号:USD456588S1
公开(公告)日:2002-05-07
申请号:US29128902
申请日:2000-09-01
Applicant: Fiona Fairhurst , Jane Cappaert , Masanobu Okada
Designer: Fiona Fairhurst , Jane Cappaert , Masanobu Okada
CPC classification number: A41D7/00 , A41D2400/24
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