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    Power monitor for silicon-photonics-based laser
    1.
    发明授权
    Power monitor for silicon-photonics-based laser 有权

    公开(公告)号：US12212117B2

    公开(公告)日：2025-01-28

    申请号：US18495848

    申请日：2023-10-27

    Applicant: Marvell Asia Pte Ltd

    Inventor： Xiaoguang He ,  Radhakrishnan L. Nagarajan

    IPC: H01S5/026 ,  H01S5/02 ,  H01S5/343

    Abstract: A laser device based on silicon photonics with in-cavity power monitor includes a gain chip, a reflector, and a photodiode. The gain chip is mounted on a silicon photonics substrate and is configured to emit light from an active region bounded between a frontend facet and a backend facet. The reflector is configured to reflect the light in a cavity formed between the reflector and the frontend facet through which a laser light is output. The photodiode is coupled to one or more waveguides in the cavity by a splitter disposed directly in an optical path between the reflector and a component positioned in the cavity. The photodiode is configured to measure power of light propagating through the cavity between the reflector and the component.

    In-packaged multi-channel light engine on single substrate
    2.
    发明授权
    In-packaged multi-channel light engine on single substrate 有权

    公开(公告)号：US11777631B2

    公开(公告)日：2023-10-03

    申请号：US17563231

    申请日：2021-12-28

    Applicant: MARVELL ASIA PTE LTD.

    Inventor： Radhakrishnan L. Nagarajan ,  Liang Ding ,  Mark Patterson ,  Roberto Coccioli

    IPC: H04J14/00 ,  H04J14/02 ,  G02B6/293 ,  G02B6/42

    CPC classification number: H04J14/02 ,  G02B6/29352 ,  G02B6/4246

    Abstract: An in-packaged multi-channel light engine is packaged for four or more sub-assemblies of optical-electrical sub-modules. Each is assembled with at least four laser chips, one or more driver chip, and one or more trans-impedance amplifier (TIA) chip separately flip-mounted on a silicon photonics interposer and is coupled to an optical interface block and an electrical interface block on a sub-module substrate. The in-packaged multi-channel light engine further includes a first frame fixture holding the four or more sub-assemblies and a second frame fixture configured to hold the first frame fixture with the four or more sub-assemblies. The in-packaged multi-channel light engine further includes an interposer plate inserted between the sub-module substrates and a module substrate and is compressed between a backplate member attached to a bottom side of the module substrate and a top plate member configured as a heatsink with a plurality of fin structures.

    Network systems and methods for CXL standard
    3.
    发明授权
    Network systems and methods for CXL standard 有权

    公开(公告)号：US11388268B1

    公开(公告)日：2022-07-12

    申请号：US16777655

    申请日：2020-01-30

    Applicant: Marvell Asia Pte, Ltd.

    Inventor： Kumaran David Siva ,  Arash Farhoodfar ,  Radhakrishnan L. Nagarajan

    IPC: G06F13/12 ,  G06F13/38 ,  H04B10/278 ,  H04B10/80 ,  H04L1/00 ,  H04L69/10 ,  H04L69/12 ,  H04L69/16 ,  H04L69/18

    Abstract: A first processing unit for a computer server apparatus includes a first circuit configured to process a first type of data to be transmitted and received over a communication channel in accordance with a peripheral component interconnect express (PCIe) protocol, a second circuit configured to process a second type of data to be transmitted and received over the communication channel in accordance with a compute express link (CXL) protocol, and an optical communication interface configured to modulate the first type of data and the second type of data into a first signal in a PAM format to be transmitted over the communication channel to a second processing unit and receive, from the second processing unit over the communication channel, a second signal including either one of the first type of data and the second type of data modulated in the PAM format.

    System and method for secure transactions to transmit cryptocurrency
    6.
    发明授权
    System and method for secure transactions to transmit cryptocurrency 有权

    公开(公告)号：US11238428B1

    公开(公告)日：2022-02-01

    申请号：US15962906

    申请日：2018-04-25

    Applicant: Marvell Asia Pte. Ltd.

    Inventor： Radhakrishnan L. Nagarajan

    IPC: G06Q20/22 ,  H04L9/08 ,  H03M13/01 ,  H04L9/06 ,  G06Q20/06 ,  G06Q20/38 ,  G06Q20/36 ,  H04B10/40 ,  H04B10/077 ,  G06N10/00

    Abstract: The present invention is directed to an optical module based on silicon photonics. The optical module provides a cyptocurrency wallet stored in a memory resource and includes an optical communication block with a direct-to-cloud interface for connecting to entities in a cloud infrastructure. The optical module further includes an application block to enable a cryptocurrency transaction via the direct-to-cloud interface. The optical module is configured to be an optical Quantum Key Generation Distribution device using a quantum key generation encryption protocol to encrypt a private key protected transaction in an encrypted transaction envelope. Furthermore, the optical module includes an external interface connecting the application block to a user/host via a physical layer to establish a secure link before executing a peer-to-peer transaction between entities in the cloud infrastructure.

    Integrated coherent optical transceiver, light engine
    7.
    发明授权
    Integrated coherent optical transceiver, light engine 有权

    公开(公告)号：US12136951B2

    公开(公告)日：2024-11-05

    申请号：US16842115

    申请日：2020-04-07

    Applicant: Marvell Asia Pte, Ltd.

    Inventor： Radhakrishnan L. Nagarajan

    IPC: H04B10/40 ,  G02B6/12 ,  G02B6/126 ,  G02B6/42 ,  H01S3/13 ,  H01S5/00 ,  H01S5/0234 ,  H01S5/02375 ,  G02B6/122 ,  H01S5/0687 ,  H04B10/29 ,  H04B10/291 ,  H04B10/50 ,  H04B10/564 ,  H04J14/02 ,  H04J14/06

    Abstract: An coherent transceiver includes a single silicon photonics substrate configured to integrate a laser diode chip flip-mounted and coupled with a wavelength tuning section to provide a laser output with tuned wavelengths which is split in X:Y ratio partly into a coherent receiver block as local-oscillator signals and partly into a coherent transmitter block as a light source. The coherent receiver includes a polarization-beam-splitter-rotator to split a coherent input signal to a TE-mode signal and a TM*-mode signal respectively detected by two 90-deg hybrid receivers and a flip-mounted TIA chip assisted by two local-oscillator signals from the tunable laser device. The coherent transmitter includes a driver chip flip-mounted on the silicon photonics substrate to drive a pair of Mach-Zehnder modulators with 90-degree shift in quadrature-phase branches to modulate the laser output to two polarized signals with I/Q modulation and uses a polarization-beam-rotator-combiner to combine them as a coherent output signal.

    Integrated optical transceiver
    8.
    发明授权
    Integrated optical transceiver 有权

    公开(公告)号：US12128729B2

    公开(公告)日：2024-10-29

    申请号：US18380085

    申请日：2023-10-13

    Applicant: Marvell Asia Pte Ltd

    Inventor： Ding Liang ,  Mark Patterson ,  Roberto Coccioli ,  Radhakrishnan L. Nagarajan

    IPC: B60G21/05 ,  B60G15/02

    CPC classification number: B60G21/05 ,  B60G15/02

    Abstract: An optical transceiver includes a silicon photonics substrate and multiple devices. The devices are configured to process optical signals propagating to and from the optical transceiver, and to perform at least one of an optical-to-electrical conversion of received optical signals to incoming electric signals and an electrical-to-optical conversion of outgoing electric signals to transmitted optical signals. The devices are each fabricated to include respectively a package substrate configured according to one of multiple different package substrate mounting technologies. Each package substrate among the multiple devices is mounted on the silicon photonics substrate according to mounting requirements of the respective package substrate mounting technology of that package substrate. At least two of the package substrates are mounted according to the mounting requirements of different package substrate mounting technologies.

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