Method for manufacturing group III nitride single crystals
    4.
    发明申请
    Method for manufacturing group III nitride single crystals 有权
    III族氮化物单晶的制造方法

    公开(公告)号:US20100107969A1

    公开(公告)日:2010-05-06

    申请号:US12655826

    申请日:2010-01-08

    IPC分类号: C30B7/00

    摘要: An underlying film 2 of a group III nitride is formed on a substrate 1 by vapor phase deposition. The substrate 1 and the underlying film 2 are subjected to heat treatment in the present of hydrogen to remove the underlying film 2 so that the surface of the substrate 1 is roughened. A seed crystal film 4 of a group III nitride single crystal is formed on a surface of a substrate 1A by vapor phase deposition. A group III nitride single crystal 5 is grown on the seed crystal film 4 by flux method.

    摘要翻译: 通过气相沉积在衬底1上形成III族氮化物的底层膜2。 将基板1和下面的薄膜2在氢气中进行热处理以除去下面的薄膜2,从而使基底1的表面变粗糙。 通过气相沉积在基板1A的表面上形成III族氮化物单晶的晶种膜4。 通过助熔法在晶种膜4上生长III族氮化物单晶5。

    SEMICONDUCTOR DEVICE
    5.
    发明申请
    SEMICONDUCTOR DEVICE 失效
    半导体器件

    公开(公告)号:US20070228519A1

    公开(公告)日:2007-10-04

    申请号:US11692290

    申请日:2007-03-28

    IPC分类号: H01L29/00

    摘要: A semiconductor device made of a group-III nitride semiconductor having excellent properties is provided. The semiconductor device has a horizontal diode structure of Schottky type or P—N junction type, or combined type thereof having a main conduction pathway in the horizontal direction in a conductive layer with unit anode portions and unit cathode electrodes being integrated adjacently to each other in the horizontal direction. The conductive layer is preferably formed by depositing a group-III nitride layer and generating a two-dimensional electron gas layer on the interface. Forming the conductive layer of the group-III nitride having high breakdown field allows the breakdown voltage to be kept high while the gap between electrodes is narrow, which achieves a semiconductor device having high output current per chip area. Further, an electrode pad layer provided on an insulation protecting layer relieves electric field concentration at a junction of each unit anode portion and each unit cathode electrode, which achieves higher breakdown voltage.

    摘要翻译: 提供由具有优异特性的III-III族氮化物半导体制成的半导体器件。 半导体器件具有肖特基型或PN结型的水平二极管结构,或者其组合型在导电层中具有在水平方向上的主导电通路,其中单元阳极部分和单元阴极电极在水平方向彼此相邻地相互整合 方向。 导电层优选通过沉积III族氮化物层并在界面上产生二维电子气层形成。 形成具有高击穿场的III族氮化物的导电层允许击穿电压保持较高,同时电极之间的间隙窄,这实现了每芯片面积具有高输出电流的半导体器件。 此外,设置在绝缘保护层上的电极焊盘层可以减轻每个单元阳极部分和每个单位阴极电极的接合处的电场浓度,从而实现更高的击穿电压。

    Semiconductor device
    7.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号:US08044485B2

    公开(公告)日:2011-10-25

    申请号:US11692290

    申请日:2007-03-28

    IPC分类号: H01L29/47

    摘要: A semiconductor device made of a group-III nitride semiconductor having excellent properties is provided. The semiconductor device has a horizontal diode structure of Schottky type or P-N junction type, or combined type thereof having a main conduction pathway in the horizontal direction in a conductive layer with unit anode portions and unit cathode electrodes being integrated adjacently to each other in the horizontal direction. The conductive layer is preferably formed by depositing a group-III nitride layer and generating a two-dimensional electron gas layer on the interface. Forming the conductive layer of the group-III nitride having high breakdown field allows the breakdown voltage to be kept high while the gap between electrodes is narrow, which achieves a semiconductor device having high output current per chip area. Further, an electrode pad layer provided on an insulation protecting layer relieves electric field concentration at a junction of each unit anode portion and each unit cathode electrode, which achieves higher breakdown voltage.

    摘要翻译: 提供由具有优异特性的III-III族氮化物半导体制成的半导体器件。 半导体器件具有肖特基型或PN结型的水平二极管结构,或者其组合型在导电层中具有在水平方向上的主导电通路,其中单元阳极部分和单元阴极电极在水平方向彼此相邻地相互整合 方向。 导电层优选通过沉积III族氮化物层并在界面上产生二维电子气层形成。 形成具有高击穿场的III族氮化物的导电层允许击穿电压保持较高,同时电极之间的间隙窄,这实现了每芯片面积具有高输出电流的半导体器件。 此外,设置在绝缘保护层上的电极焊盘层可以减轻每个单元阳极部分和每个单位阴极电极的接合处的电场浓度,从而实现更高的击穿电压。