公开(公告)号：US20140292141A1

公开(公告)日：2014-10-02

申请号：US14191480

申请日：2014-02-27

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Yasuhiro NISHISAKA ,  Satoshi MATSUNO ,  Tetsuya KISUMI ,  Yoko OKABE

IPC: H01G4/30 ,  H01C7/00 ,  H01F17/00 ,  H02N2/00

CPC classification number: H02N2/00 ,  H01C7/008 ,  H01F17/0013 ,  H01L41/0471 ,  H01L41/0472 ,  H01L41/0533

Abstract: A ceramic electronic component includes a ceramic body, inner electrodes, a glass coating layer, and outer electrodes. The glass coating layer extends from an exposed portion of one of the inner electrodes at a first end surface to a first principal surface. The outer electrodes are each constituted by a plating film disposed directly above the glass coating layer. The glass coating layer includes a glass medium and metal powder particles that define conductive paths. The metal powder particles have an elongated or substantially elongated shape and are dispersed in the glass medium. The dimension of a portion of the glass coating layer located on the first principal surface in the length direction, is larger than that of a portion of the glass coating layer located on the first end surface in the thickness direction.

Abstract translation: 陶瓷电子部件包括陶瓷体，内电极，玻璃涂层和外电极。 玻璃涂层从一个内电极的暴露部分在第一端面延伸到第一主表面。 外部电极由直接设置在玻璃涂层上方的镀膜构成。 玻璃涂层包括限定导电路径的玻璃介质和金属粉末颗粒。 金属粉末颗粒具有细长的或基本上细长的形状并且分散在玻璃介质中。 位于第一主表面上的长度方向上的玻璃涂层的一部分的尺寸大于位于厚度方向上的第一端面上的玻璃涂层的部分的尺寸。

公开(公告)号：US20180166215A1

公开(公告)日：2018-06-14

申请号：US15835597

申请日：2017-12-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kenichi HAMANAKA ,  Satoshi MATSUNO

IPC: H01G4/012 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H05K1/18 ,  H01G4/248 ,  H05K1/09 ,  H01G4/008 ,  H01G4/30

CPC classification number: H01G4/012 ,  H01G2/06 ,  H01G2/065 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/10015

Abstract: A multilayer ceramic capacitor includes a laminate of ceramic layers and internal electrodes, and a pair of external electrodes located on both end surfaces of the laminate and electrically connected to the internal electrodes. Each of the pair of external electrodes includes an underlying electrode layer on the surface of the laminate and including Cu, a bonding portion partially provided on a surface of the underlying electrode layer and including a Cu3Sn alloy, and a conductive resin layer provided on surfaces of the underlying electrode layer and the bonding portion, and a total area of the bonding portion is not less than about 2.7% and not more than about 40.6% of a total area of the underlying electrode layer.

公开(公告)号：US20180108483A1

公开(公告)日：2018-04-19

申请号：US15784235

申请日：2017-10-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takehisa SASABAYASHI ,  Yasuhiro NISHISAKA ,  Satoshi MATSUNO ,  Yoko OKABE

IPC: H01G4/30 ,  H01G4/248 ,  H01G4/12 ,  H01G4/008

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/0085 ,  H01G4/1209 ,  H01G4/2325 ,  H01G4/248 ,  H01G13/006

Abstract: A method for manufacturing a multilayer ceramic capacitor includes preparing a green multilayer body including a stack of dielectric sheets printed with inner electrodes, coating the green multilayer body with a conductive paste that is connected to the inner electrodes, and firing the conductive paste and the green multilayer body at the same time, wherein a rate of temperature increase from about 800° C. to about 1,100° C. during the firing is about 15° C. per minute or more.

公开(公告)号：US20140292142A1

公开(公告)日：2014-10-02

申请号：US14191481

申请日：2014-02-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Satoshi MATSUNO ,  Tetsuya KISUMI ,  Yoko OKABE

IPC: C03C8/18 ,  H01L41/083 ,  H01C7/00 ,  H01G4/30 ,  H01F27/28

CPC classification number: C03C8/18 ,  H01C7/008 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01L41/0471 ,  H01L41/0533

Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and terminal electrodes. End portions of inner electrodes are exposed at a surface of the ceramic body. The glass coating layer covers portions of the ceramic body in which the inner electrodes are exposed. The terminal electrodes are disposed directly above the glass coating layer and are each constituted by a plating film. The glass coating layer includes a glass medium and metal powder particles that are dispersed in the glass medium and define conductive paths which electrically connect the inner electrodes and the terminal electrodes. The metal powder particles include first metal powder particles and second metal powder particles. The first metal powder particles are flat or substantially flat powder particles. The second metal powder particles are spherical or substantially spherical powder particles.

Abstract translation: 陶瓷电子部件包括陶瓷体，玻璃涂层和端子电极。 内部电极的端部在陶瓷体的表面露出。 玻璃涂层覆盖内部电极露出的陶瓷体的部分。 端子电极直接设置在玻璃涂层的上方，并且各自由镀膜构成。 玻璃涂层包括玻璃介质和分散在玻璃介质中的金属粉末颗粒，并且限定电连接内部电极和端子电极的导电路径。 金属粉末颗粒包括第一金属粉末颗粒和第二金属粉末颗粒。 第一金属粉末颗粒是平坦或基本平坦的粉末颗粒。 第二金属粉末颗粒是球形或基本上球形的粉末颗粒。

公开(公告)号：US20140291000A1

公开(公告)日：2014-10-02

申请号：US14223258

申请日：2014-03-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Satoshi MATSUNO ,  Akihiro YOSHIDA ,  Yasunori TASEDA

IPC: H01G4/01 ,  H05K1/18 ,  H01G4/008

CPC classification number: H05K1/0306 ,  H01G4/2325 ,  H05K1/185 ,  H05K2201/10636 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P70/611

Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer containing Cu and glass, and a Cu plating layer. The underlying electrode layer is disposed on the first principal surface. The Cu plating layer is disposed on the underlying electrode layer. The Cu plating layer is thicker than the underlying electrode layer.

Abstract translation: 陶瓷电子部件包括陶瓷体和外部电极。 陶瓷体包括第一和第二主表面，第一和第二侧表面以及第一和第二端面。 外电极设置在第一主表面上。 外电极包括含有Cu和玻璃的底层电极层和Cu镀层。 底层电极层设置在第一主表面上。 Cu镀层设置在下面的电极层上。 Cu镀层比下面的电极层厚。