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    ELECTRONIC COMPONENT, ELECTRONIC-COMPONENT-EMBEDDED SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
    1.
    发明申请
    ELECTRONIC COMPONENT, ELECTRONIC-COMPONENT-EMBEDDED SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT 有权
    电子元件，电子元件嵌入式基板及其制造方法

    公开(公告)号：US20130299215A1

    公开(公告)日：2013-11-14

    申请号：US13888639

    申请日：2013-05-07

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Yasunori TASEDA ,  Isamu FUJIMOTO

    IPC: H01G4/30 ,  H05K1/18

    CPC classification number: H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H05K1/185 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/43

    Abstract: An electronic component includes a body and first and second external electrodes arranged on an external surface of the body. An edge portion of the first external electrode and an edge portion of the second external electrode face each other on the body. The first and second external electrodes each include a copper-metal-containing layer and a protective copper oxide layer covering the copper-metal-containing layer within the edge portion of the first and second external electrodes, respectively.

    Abstract translation: 电子部件包括主体和布置在主体的外表面上的第一和第二外部电极。 第一外部电极的边缘部分和第二外部电极的边缘部分在主体上彼此面对。 第一外部电极和第二外部电极分别包括含铜金属层和覆盖第一和第二外部电极的边缘部分内的含铜金属层的保护性铜氧化物层。

    ELECTRONIC COMPONENT
    2.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20150116899A1

    公开(公告)日：2015-04-30

    申请号：US14517957

    申请日：2014-10-20

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takayuki KAYATANI ,  Yoshikazu SASAOKA ,  Kotaro SHIMIZU ,  Yasunori TASEDA ,  Shinichiro KUROIWA

    IPC: H01G4/248 ,  H01G4/232 ,  H01G4/008 ,  H01G4/30

    CPC classification number: H01G4/232 ,  H01C7/008 ,  H01G4/30

    Abstract: An electronic component has dimensions (length×width×thickness) of about 0.6 mm to about 1.0 mm×about 0.3 mm to about 0.5 mm×about 0.07 mm to about 0.15 mm. An area of a triangle defined by a first hypothetical straight line being in contact with the top of a portion of an outer electrode positioned on a first main surface at a center in the width direction and extending in the length direction, a second hypothetical straight line being in contact with the top of a portion of the outer electrode positioned on the first end surface at the center in the width direction and extending in the thickness direction, and a third hypothetical straight line being in contact with the outer electrode at the center in the width direction and being inclined at about 45° with respect to the first and second hypothetical straight lines is about 450 μm2 or larger.

    Abstract translation: 电子部件具有约0.6mm至约1.0mm×约0.3mm至约0.5mm×约0.07mm至约0.15mm的尺寸（长×宽×厚）。 由第一假想直线限定的三角形区域与位于宽度方向中心并沿长度方向延伸的第一主表面的外部电极的一部分的顶部接触，第二假想直线 与位于宽度方向中心的第一端面的外部电极的一部分的顶部接触，并且在厚度方向上延伸，并且第三假想直线与中心的外部电极接触 宽度方向相对于第一和第二假想直线倾斜约45°，为约450μm2以上。

    CERAMIC ELECTRONIC COMPONENT AND WIRING BOARD HAVING BUILT-IN CERAMIC ELECTRONIC COMPONENT
    5.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND WIRING BOARD HAVING BUILT-IN CERAMIC ELECTRONIC COMPONENT 有权
    陶瓷电子元器件和接线板，内置陶瓷电子元器件

    公开(公告)号：US20140291000A1

    公开(公告)日：2014-10-02

    申请号：US14223258

    申请日：2014-03-24

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yasuhiro NISHISAKA ,  Satoshi MATSUNO ,  Akihiro YOSHIDA ,  Yasunori TASEDA

    IPC: H01G4/01 ,  H05K1/18 ,  H01G4/008

    CPC classification number: H05K1/0306 ,  H01G4/2325 ,  H05K1/185 ,  H05K2201/10636 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P70/611

    Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer containing Cu and glass, and a Cu plating layer. The underlying electrode layer is disposed on the first principal surface. The Cu plating layer is disposed on the underlying electrode layer. The Cu plating layer is thicker than the underlying electrode layer.

    Abstract translation: 陶瓷电子部件包括陶瓷体和外部电极。 陶瓷体包括第一和第二主表面，第一和第二侧表面以及第一和第二端面。 外电极设置在第一主表面上。 外电极包括含有Cu和玻璃的底层电极层和Cu镀层。 底层电极层设置在第一主表面上。 Cu镀层设置在下面的电极层上。 Cu镀层比下面的电极层厚。

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