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    CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
    陶瓷电子元件及其制造方法

    公开(公告)号：US20140373324A1

    公开(公告)日：2014-12-25

    申请号：US14305117

    申请日：2014-06-16

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kenichi HAMANAKA ,  Kota ZENZAI ,  Taku DEKURA ,  Kiyotaka MAEKAWA

    IPC: H01G4/008 ,  H01G4/30

    CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  Y10T29/435

    Abstract: A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. The inner external electrode includes a plurality of holes. An average opening diameter of the plurality of holes is not greater than about 2.5 μm. Some or all of the plurality of holes are embedded with the metal component of the outer external electrode.

    Abstract translation: 陶瓷电子部件包括矩形或大致矩形的平行六面体形状的叠层，其中陶瓷层和内部电极交替堆叠，外部电极设置在堆叠的表面的一部分上并与内部电极电连接。 外部电极包括覆盖堆叠表面的一部分的内部外部电极，并且包括树脂部件和金属部件的混合物以及覆盖内部外部电极并且包括金属部件的外部外部电极。 内部外部电极包括多个孔。 多个孔的平均开口直径不大于约2.5μm。 多个孔中的一些或全部嵌入外部外部电极的金属部件。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    2.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号：US20160141103A1

    公开(公告)日：2016-05-19

    申请号：US14669069

    申请日：2015-03-26

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kenichi HAMANAKA ,  Hidetaka SUGIYAMA ,  Kota ZENZAI

    IPC: H01G4/012 ,  H01G4/224 ,  H01G4/12 ,  H01G4/30

    CPC classification number: H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

    Abstract: A multilayer ceramic capacitor includes a ceramic element body including internal electrodes therein. External electrodes are provided on end surfaces of the ceramic element body and electrically connected to exposed portions of respective ones of the internal electrodes. Each of the external electrodes includes a sintered metal layer, a conductive resin layer, and a plating layer. In a cross section including a first interface between the sintered metal layer and the conductive resin layer, the sintered metal layer includes a plurality of recesses each including an inlet extending along the first interface and an inner portion extending from the first interface into the sintered metal layer, each of the recesses having a shape in which a dimension of the inner portion is larger than a dimension of the inlet measured along the first interface, and in a cross section including a second interface between the conductive resin layer and the plating layer, a number of the metal particles exposed from the conductive resin layer in a portion of the second interface with a length of about 1 mm is 50 to 250.

    Abstract translation: 多层陶瓷电容器包括其中包括内部电极的陶瓷元件体。 外部电极设置在陶瓷元件主体的端面上，并且电连接到各个内部电极的露出部分。 每个外部电极包括烧结金属层，导电树脂层和镀层。 在包括烧结金属层和导电树脂层之间的第一界面的横截面中，烧结金属层包括多个凹槽，每个凹槽包括沿着第一界面延伸的入口和从第一界面延伸到烧结金属 每个凹部具有内部尺寸大于沿着第一界面测量的入口的尺寸的形状，并且在包括导电树脂层和镀层之间的第二界面的截面中， 在第二界面的大约1mm的长度的一部分中，从导电树脂层露出的多个金属颗粒为50〜250。

    CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
    陶瓷电子元件及其制造方法

    公开(公告)号：US20140375173A1

    公开(公告)日：2014-12-25

    申请号：US14305103

    申请日：2014-06-16

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kenichi HAMANAKA ,  Kota ZENZAI ,  Taku DEKURA ,  Kiyotaka MAEKAWA

    IPC: H01C7/00 ,  H01G4/008 ,  H01G4/30 ,  H01L41/297 ,  H01L41/047 ,  H01F41/04 ,  H01C17/00 ,  H01G4/12 ,  H01F27/28

    CPC classification number: H01C7/008 ,  H01C1/148 ,  H01C7/18 ,  H01F17/0013 ,  H01F27/292 ,  H01F41/046 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H01L41/0472 ,  H01L41/0477 ,  H01L41/293 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/4902 ,  Y10T29/49085

    Abstract: A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped shaped laminate in which a ceramic layer and an internal electrode are alternately laminated and an external electrode provided on a portion of a surface of the laminate and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the laminate and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. The inner external electrode includes, as a metal component, a first metal component of which a portion forms an alloy with the internal electrode so as to connect the internal electrode and the inner external electrode to each other, and a second metal component higher in melting point than the first metal component, of which a portion forms an alloy with the first metal component so as to connect the inner external electrode and the outer external electrode to each other. A concentration of a metal in a surface layer of the inner external electrode is not lower than about 17%.

    Abstract translation: 陶瓷电子部件包括矩形或大致矩形的平行六面体形状的层压体，其中陶瓷层和内部电极交替层压，并且设置在层压体的表面的一部分上并与内部电极电连接的外部电极。 外部电极包括覆盖层压体的表面的一部分的内部外部电极，并且包括树脂组分和金属组分的混合物以及覆盖内部外部电极并包括金属组分的外部外部电极。 内部外部电极包括作为金属成分的与内部电极形成合金以使内部电极和内部外部电极彼此连接的第一金属成分，以及熔融时的第二金属成分 与第一金属部件相比，其中一部分与第一金属部件形成合金，以将内部外部电极和外部外部电极彼此连接。 内部外部电极的表面层中的金属的浓度不低于约17％。

    CONDUCTIVE PASTE AND CERAMIC ELECTRONIC COMPONENT
    6.
    发明申请
    CONDUCTIVE PASTE AND CERAMIC ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220293345A1

    公开(公告)日：2022-09-15

    申请号：US17684556

    申请日：2022-03-02

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kenichi HAMANAKA ,  Kota ZENZAI

    IPC: H01G4/232 ,  H01B1/22 ,  C22C9/06 ,  B22F1/17 ,  B22F1/103

    Abstract: A conductive paste includes a conductive metal powder and a curable resin. The conductive metal powder includes Ag, Cu, and Ni. In the conductive metal powder, a mass ratio of Ag is about 3.0 wt % or more and about 10.0 wt % or less, a mass ratio of Cu is about {(1−mass ratio of Ag/100)×70} wt % or more and about {(1−mass ratio of Ag/100)×95} wt % or less, and a mass ratio of Ni is about {(1−mass ratio of Ag/100)×5} wt % or more and about {(1−mass ratio of Ag/100)×30} wt % or less.

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