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公开(公告)号:US20240314975A1
公开(公告)日:2024-09-19
申请号:US18460070
申请日:2023-09-01
申请人: MTS IP Holdings Ltd
发明人: Brian H. Kim , Jianhua Bi , Ioannis Manousakis
IPC分类号: H05K7/20 , H01L23/367 , H01L23/40
CPC分类号: H05K7/203 , H01L23/3675 , H01L23/40 , H05K7/20318
摘要: Assemblies and related methods to cool high-power integrated circuits are described. A heat-dissipative element is thermally coupled directly to a semiconductor die with a thermal interface material and contacts a coolant liquid.
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公开(公告)号:US12051637B1
公开(公告)日:2024-07-30
申请号:US18460091
申请日:2023-09-01
申请人: MTS IP Holdings Ltd
发明人: Luke Gregory , Jimil Shah , Ethan Schmitz , Richard Eiland , Ioannis Manousakis
IPC分类号: H01L23/373 , H01L23/02 , H01L23/31
CPC分类号: H01L23/3735 , H01L23/02 , H01L23/3107 , H01L23/3731 , H01L23/3736
摘要: Methods to form a boiling enhancement coating (BEC) directly on a protective lid or directly on a semiconductor die are described. The BEC can improve heat dissipation from the protective lid or semiconductor die into a coolant liquid of a two-phase immersion-cooling system. In some cases, a heat spreader is not needed to cool the semiconductor die.
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公开(公告)号:US11894288B1
公开(公告)日:2024-02-06
申请号:US18325971
申请日:2023-05-30
申请人: MTS IP Holdings Ltd
发明人: Nihal Joshua , Jason Samuel , Ioannis Manousakis
IPC分类号: F16K17/00 , H01L23/427 , H01L23/433 , H05K1/02 , H05K7/20 , F16K17/08 , F16K24/04 , F28C3/08 , F16K15/02 , F16K15/06 , F16K17/04 , B01D53/26
CPC分类号: H01L23/427 , B01D53/261 , F16K15/028 , F16K15/065 , F16K15/067 , F16K17/0413 , F16K17/087 , F16K24/04 , F28C3/08 , H01L23/4332 , H05K1/0203 , H05K7/20327 , H05K7/20809 , B01D2257/80
摘要: A pressure relief valve for a two-phase immersion cooling system is configured to support fluid flow rates up to 500 cfm, 550 cfm, 600 cfm, or even 2000 cfm. This, in turn, allows the cooling system to support computing systems with a power density greater than 250 kW. This is accomplished by the valve having a relatively large passage (e.g., 2-6 inch diameter), a relatively large spring (e.g., 1.5-1.7 inch diameter), and a guide rod rigidly coupled to the poppet and slidably coupled to a guide plate. The valve may be used as an outlet valve and coupled to an adsorbent chamber to reduce the loss of coolant from the system as air is vented to an ambient environment. The valve may be used as an inlet valve and coupled to an adsorbent chamber to reduce the intake of water vapor as air from the ambient environment flows into the system.
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公开(公告)号:US11997825B1
公开(公告)日:2024-05-28
申请号:US18318870
申请日:2023-05-17
申请人: MTS IP Holdings Ltd
发明人: Nihal Joshua , Ioannis Manousakis , Jimil Shah
IPC分类号: H05K7/20 , H01L23/433 , H01L23/44
CPC分类号: H05K7/20272 , H05K7/20236 , H01L23/4332 , H01L23/44
摘要: A bellows assembly and related methods are described. The bellows assembly can be used in a two-phase immersion cooling system to regulate pressure in a tank's airspace above a coolant liquid. The bellows assembly can include a flexible container and pressure-release valves located to reduce emissions of coolant liquid vapor into an ambient environment.
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公开(公告)号:US11825631B1
公开(公告)日:2023-11-21
申请号:US18318888
申请日:2023-05-17
申请人: MTS IP Holdings Ltd
发明人: Nihal Joshua , Ioannis Manousakis , Jimil Shah
IPC分类号: H05K7/20
CPC分类号: H05K7/20327 , H05K7/203
摘要: A bellows assembly and related methods are described. The bellows assembly can be used in a two-phase immersion cooling system to regulate pressure in a tank's airspace above a coolant liquid. The bellows assembly can include a flexible container and pressure-release valves located to reduce emissions of coolant liquid vapor into an ambient environment.
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公开(公告)号:US11792956B1
公开(公告)日:2023-10-17
申请号:US18318905
申请日:2023-05-17
申请人: MTS IP Holdings Ltd
发明人: Nihal Joshua , Ioannis Manousakis , Jimil Shah
IPC分类号: H05K7/20
CPC分类号: H05K7/20327 , H05K7/203
摘要: A bellows assembly and related methods are described. The bellows assembly can be used in a two-phase immersion cooling system to regulate pressure in a tank's airspace above a coolant liquid. The bellows assembly can include a flexible container and pressure-release valves located to reduce emissions of coolant liquid vapor into an ambient environment.
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