公开(公告)号：US12051637B1

公开(公告)日：2024-07-30

申请号：US18460091

申请日：2023-09-01

申请人： MTS IP Holdings Ltd

发明人： Luke Gregory ,  Jimil Shah ,  Ethan Schmitz ,  Richard Eiland ,  Ioannis Manousakis

IPC分类号： H01L23/373 ,  H01L23/02 ,  H01L23/31

CPC分类号： H01L23/3735 ,  H01L23/02 ,  H01L23/3107 ,  H01L23/3731 ,  H01L23/3736

摘要： Methods to form a boiling enhancement coating (BEC) directly on a protective lid or directly on a semiconductor die are described. The BEC can improve heat dissipation from the protective lid or semiconductor die into a coolant liquid of a two-phase immersion-cooling system. In some cases, a heat spreader is not needed to cool the semiconductor die.