- 专利标题： Direct to chip application of boiling enhancement coating
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申请号： US18460091申请日： 2023-09-01
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公开(公告)号： US12051637B1公开(公告)日： 2024-07-30
- 发明人: Luke Gregory , Jimil Shah , Ethan Schmitz , Richard Eiland , Ioannis Manousakis
- 申请人： MTS IP Holdings Ltd
- 申请人地址： KY Grand Cayman
- 专利权人： MTS IP Holdings Ltd
- 当前专利权人： MTS IP Holdings Ltd
- 当前专利权人地址： KY Grand Cayman
- 代理机构： Smith Baluch LLP
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; H01L23/02 ; H01L23/31
摘要：
Methods to form a boiling enhancement coating (BEC) directly on a protective lid or directly on a semiconductor die are described. The BEC can improve heat dissipation from the protective lid or semiconductor die into a coolant liquid of a two-phase immersion-cooling system. In some cases, a heat spreader is not needed to cool the semiconductor die.
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