公开(公告)号：US20240038647A1

公开(公告)日：2024-02-01

申请号：US18215830

申请日：2023-06-29

Applicant: MEDIATEK INC.

Inventor： Wei-Chih Chen ,  Shi-Bai Chen

IPC: H01L23/498 ,  H10B80/00 ,  H01L25/18 ,  H01L23/00 ,  H01L25/16

CPC classification number: H01L23/49833 ,  H10B80/00 ,  H01L25/18 ,  H01L24/13 ,  H01L24/16 ,  H01L25/16 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L24/32 ,  H01L2224/32225 ,  H01L24/73 ,  H01L2224/73204

Abstract: A semiconductor package includes a partitioned package substrate composed of substrate parts arranged in a side-by-side manner; an integrated circuit die mounted on a first surface of the partitioned package substrate; and solder balls mounted on a second surface of the partitioned package substrate opposite to the first surface.

公开(公告)号：US20240038648A1

公开(公告)日：2024-02-01

申请号：US18216561

申请日：2023-06-29

Applicant: MEDIATEK INC.

Inventor： Wei-Chih Chen ,  Shi-Bai Chen

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49833 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/13 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/13147

Abstract: A semiconductor package includes a partitioned package substrate that is composed of multiple discrete substrates arranged in a side-by-side manner. The discrete substrates include a central substrate and peripheral substrates surrounding the central substrate. At least one integrated circuit die is mounted on a first surface of the partitioned package substrate. A plurality of solder balls is mounted on a second surface of the partitioned package substrate opposite to the first surface.