公开(公告)号：US20210217707A1

公开(公告)日：2021-07-15

申请号：US17111456

申请日：2020-12-03

Applicant: MEDIATEK INC.

Inventor： Yi-Lin Tsai ,  Shih-Chao Chiu ,  Wen-Sung Hsu ,  Sang-Mao Chiu ,  Chi-Yuan Chen ,  Yao-Pang Hsu

IPC: H01L23/00 ,  H01L23/498

Abstract: A semiconductor package includes a substrate component having a first surface, a second surface opposite to the first surface, and a sidewall surface extending between the first surface and the second surface; a re-distribution layer (RDL) structure disposed on the first surface and electrically connected to the first surface through first connecting elements comprising solder bumps or balls; a plurality of ball grid array (BGA) balls mounted on the second surface of the substrate component; and at least one integrated circuit die mounted on the RDL structure through second connecting elements.

公开(公告)号：US20250038126A1

公开(公告)日：2025-01-30

申请号：US18784941

申请日：2024-07-26

Applicant: MEDIATEK INC.

Inventor： De-Wei Liu ,  Pu-Shan Huang ,  Sang-Mao Chiu ,  Shih-Yi Syu

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/055 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L23/58

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface, and a vertical sidewall extending between the top surface and the bottom surface; an integrated circuit die mounted within a device region on the top surface of the substrate; a metal interconnect structure embedded within the device region of the substrate, wherein the integrated circuit die is electrically connected to the metal interconnect structure; and a peripheral shielding ring embedded within a peripheral region of the substrate. The peripheral region surrounds the device region. A lid is mounted on the top surface of the substrate. The lid is electrically connected with the peripheral shielding ring.