公开(公告)号：US20250038126A1

公开(公告)日：2025-01-30

申请号：US18784941

申请日：2024-07-26

Applicant: MEDIATEK INC.

Inventor： De-Wei Liu ,  Pu-Shan Huang ,  Sang-Mao Chiu ,  Shih-Yi Syu

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/055 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L23/58

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface, and a vertical sidewall extending between the top surface and the bottom surface; an integrated circuit die mounted within a device region on the top surface of the substrate; a metal interconnect structure embedded within the device region of the substrate, wherein the integrated circuit die is electrically connected to the metal interconnect structure; and a peripheral shielding ring embedded within a peripheral region of the substrate. The peripheral region surrounds the device region. A lid is mounted on the top surface of the substrate. The lid is electrically connected with the peripheral shielding ring.