公开(公告)号：US10446508B2

公开(公告)日：2019-10-15

申请号：US15682908

申请日：2017-08-22

Applicant: MEDIATEK INC.

Inventor： Sheng-Mou Lin ,  Chih-Chun Hsu ,  Wen-Chou Wu

IPC: H01L23/66 ,  H01L23/64 ,  H01L23/552 ,  H01L25/065 ,  H01L25/18

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a package substrate. An integrated circuit (IC) die having a radio frequency (RF) circuit and a memory die are stacked over the package substrate. The memory die entirely covers a first surface portion of the package substrate to define a second surface portion of the package substrate exposed from the memory die, and the IC die partially covers the first surface portion and the second surface portion of the package substrate. The RF circuit includes a first sensitive device region corresponding to the second surface portion of the package substrate and a second sensitive device region corresponding to the first surface portion of the package substrate and offsetting a memory input/output (I/O) electrical path of the memory die, as viewed from a top-view perspective.

公开(公告)号：US20180019210A1

公开(公告)日：2018-01-18

申请号：US15609039

申请日：2017-05-31

Applicant: MEDIATEK INC.

Inventor： Jui-Chih Kao ,  Ming-Da Tsai ,  Yuan-Yu Fu ,  Chih-Chun Hsu

IPC: H01L23/552 ,  H01L23/64 ,  H01L23/58

CPC classification number: H01L23/552 ,  H01L23/585 ,  H01L23/645 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/18161 ,  H01L2924/3025

Abstract: An integrated circuit apparatus includes a substrate, an IC chip disposed above the substrate, and an electromagnetic shielding layer disposed on a surface of the substrate. The IC chip includes an electromagnetic coupling device. The electromagnetic shielding layer and the electromagnetic coupling device partially overlap in a vertical projection direction of the surface of the substrate.

公开(公告)号：US09881882B2

公开(公告)日：2018-01-30

申请号：US15335226

申请日：2016-10-26

Applicant: MEDIATEK INC.

Inventor： Chih-Chun Hsu ,  Sheng-Mou Lin

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor package is provided. The semiconductor package includes a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region. A semiconductor die is disposed on the package substrate in the first region. A three-dimensional (3D) antenna is disposed on the package substrate in the second region. The 3D antenna includes a planar structure portion and a bridge or wall structure portion. A molding compound encapsulates the semiconductor die and at least a portion of the 3D antenna. A conductive shielding element is inside the molding compound or partially covers the molding compound. A semiconductor package assembly having the semiconductor package is also provided.

公开(公告)号：US10340235B2

公开(公告)日：2019-07-02

申请号：US15841667

申请日：2017-12-14

Applicant: MEDIATEK INC.

Inventor： Chih-Chun Hsu ,  Sheng-Mou Lin

IPC: H01L27/08 ,  H01L23/66 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00

Abstract: A semiconductor package is provided. The semiconductor package includes a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region, a semiconductor die disposed on the package substrate in the first region, a conductive shielding element disposed on the package substrate and covering the semiconductor die, and a three-dimensional (3D) antenna. The 3D antenna includes a planar structure portion disposed on the package substrate in the second region, and a bridge structure portion above the planar structure portion and connected thereto.

公开(公告)号：US10068856B2

公开(公告)日：2018-09-04

申请号：US15609039

申请日：2017-05-31

Applicant: MEDIATEK INC.

Inventor： Jui-Chih Kao ,  Ming-Da Tsai ,  Yuan-Yu Fu ,  Chih-Chun Hsu

IPC: H01L23/552 ,  H01L23/58 ,  H01L23/64

Abstract: An integrated circuit apparatus includes a substrate, an IC chip disposed above the substrate, and an electromagnetic shielding layer disposed on a surface of the substrate. The IC chip includes an electromagnetic coupling device. The electromagnetic shielding layer and the electromagnetic coupling device partially overlap in a vertical projection direction of the surface of the substrate.