公开(公告)号：US20020020556A1

公开(公告)日：2002-02-21

申请号：US09975780

申请日：2001-10-12

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hidenori Hayashi ,  Toru Fujimoto ,  Toshiharu Okada ,  Izuru Nakai

IPC: B32B003/00

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K3/0032 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/09581 ,  H05K2203/1136 ,  H05K2203/1461 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

Abstract: In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Abstract translation: 在制造双层或多层印刷线路板的过程中，利用辐射能在衬底的穿孔过程中，在孔的内壁上形成通过变换衬底材料产生的变质物质层。 变质物质层防止形成在孔的内壁上的电连接装置的导电材料在基体的表面上分散或渗透到基底中。

公开(公告)号：US20020112822A1

公开(公告)日：2002-08-22

申请号：US10128417

申请日：2002-04-24

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Shigeru Yamane ,  Toshihiro Nishii ,  Shinji Nakamura ,  Masayuki Sakai

IPC: B32B031/00

CPC classification number: H05K3/0032 ,  H05K3/227 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2203/081 ,  H05K2203/085 ,  H05K2203/1383 ,  H05K2203/1388 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T428/24994 ,  Y10T442/2902

Abstract: A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.

Abstract translation: 一种制造印刷电路板的方法，包括通过诸如激光束的能量束形成孔的步骤，其中防止通过渗透到孔的内壁表面的基底材料树脂形成树脂膜 通过作为用于形成用于形成在两面或多层上的互连电路的通孔或非贯通孔的成孔步骤的预处理，通过除湿步骤降低基板材料的吸水率，由此 可以通过防止树脂成膜不良而获得高可靠性的印刷线路板来实现高质量的孔形成。

公开(公告)号：US20020112815A1

公开(公告)日：2002-08-22

申请号：US10128418

申请日：2002-04-24

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Shigeru Yamane ,  Toshihiro Nishii ,  Shinji Nakamura ,  Masayuki Sakai

IPC: B32B031/00

CPC classification number: H05K3/0032 ,  H05K3/227 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2203/081 ,  H05K2203/085 ,  H05K2203/1383 ,  H05K2203/1388 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T428/24994 ,  Y10T442/2902

Abstract: A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.

公开(公告)号：US20020020557A1

公开(公告)日：2002-02-21

申请号：US09976376

申请日：2001-10-12

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hidenori Hayashi ,  Toru Fujimoto ,  Toshiharu Okada ,  Izuru Nakai

IPC: H05K001/11

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K3/0032 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/09581 ,  H05K2203/1136 ,  H05K2203/1461 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

Abstract: In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Abstract translation: 在制造双层或多层印刷线路板的过程中，利用辐射能在衬底的穿孔过程中，在孔的内壁上形成通过变换衬底材料产生的变质物质层。 变质物质层防止形成在孔的内壁上的电连接装置的导电材料在基体的表面上分散或渗透到基底中。

公开(公告)号：US20040035604A1

公开(公告)日：2004-02-26

申请号：US10648187

申请日：2003-08-27

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Toshiaki Takenaka ,  Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hideaki Komoda ,  Kunio Kishimoto

IPC: H05K001/03

CPC classification number: H05K3/462 ,  H05K1/0268 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/066 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.

Abstract translation: 可以获得具有稳定的连接电阻的电路板。 多层电路板包括以下步骤：在不可压缩的基板上形成通孔，该基板在其任一侧经由接合层具有膜; 将导电膏填充到通孔中; 从基板去除膜; 将金属箔层叠到基板的任一侧并在压力下加热相同以使粘合层硬化，将金属箔粘合到基板上并将基板的侧面彼此电连接; 并通过加工金属箔形成电路图案。