公开(公告)号：US10211602B2

公开(公告)日：2019-02-19

申请号：US15638859

申请日：2017-06-30

Applicant: Lumentum Operations LLC

Inventor： Michael Ayliffe ,  Yuliya Akulova ,  Claude Gamache

IPC: H01S5/00 ,  H01S5/40 ,  H01S5/022 ,  H01S5/026 ,  H01S5/183

Abstract: An optical device may include a semiconductor laser chip to independently generate four laser beams at different wavelengths. Each laser beam, of the four laser beams, may be directed to a respective optical output of the optical device with a sub-micron level of tolerance of each laser beam relative to the respective optical outputs of the optical device, and each laser beam, of the four laser beams, may be associated with a different optical path from the semiconductor laser chip to the respective optical output of the optical device. The optical device may include a lens to receive each of the four laser beams. The lens may be positioned to direct each laser beam, of the four laser beams, toward the respective optical output of the optical device. The optical device may include an optical isolator to receive each of the four laser beams.

公开(公告)号：US10162135B2

公开(公告)日：2018-12-25

申请号：US15632917

申请日：2017-06-26

Applicant: Lumentum Operations LLC

Inventor： Claude Gamache ,  Nicolas Belanger ,  Scott Cameron

IPC: G02B6/42

Abstract: The invention relates to an optical transmitter assembly (OTA) for vertical coupling of light into a chip, and to a method for manufacturing the OTA. The OTA includes a laser diode, a microlens and a turning mirror mounted at a top face of a supporting substrate within a sealed enclosure, and an optical component, such as an optical isolator, a polarizer, or a microlens disposed in a substrate cavity that opens to the back face of the substrate. The optical component may be placed into the cavity after the enclosure is sealed.

公开(公告)号：US09774172B1

公开(公告)日：2017-09-26

申请号：US15337916

申请日：2016-10-28

Applicant: Lumentum Operations LLC

Inventor： Michael Ayliffe ,  Yuliya Akulova ,  Claude Gamache

IPC: H01S5/00 ,  H01S5/40 ,  H01S5/022 ,  H01S5/183 ,  H01S5/026

CPC classification number: H01S5/4075 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/0071 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/0267 ,  H01S5/18388 ,  H01S5/4025 ,  H01S5/4056 ,  H01S5/4087

Abstract: An optical device may include a semiconductor laser chip to independently generate four laser beams at different wavelengths. Each laser beam, of the four laser beams, may be directed to a respective optical output of the optical device with a sub-micron level of tolerance of each laser beam relative to the respective optical outputs of the optical device, and each laser beam, of the four laser beams, may be associated with a different optical path from the semiconductor laser chip to the respective optical output of the optical device. The optical device may include a lens to receive each of the four laser beams. The lens may be positioned to direct each laser beam, of the four laser beams, toward the respective optical output of the optical device. The optical device may include an optical isolator to receive each of the four laser beams.

公开(公告)号：US09341786B1

公开(公告)日：2016-05-17

申请号：US14810880

申请日：2015-07-28

Applicant: Lumentum Operations LLC

Inventor： Claude Gamache ,  Adonios Bitzanis ,  Michael Ayliffe

IPC: G02B6/12 ,  G02F1/035 ,  H01L33/00 ,  H01S5/00 ,  G02B6/30 ,  G02B6/124 ,  G02B6/34 ,  G02B6/32 ,  G02B6/38 ,  G02B6/27

CPC classification number: G02B6/30 ,  G02B6/12019 ,  G02B6/124 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4292 ,  G02B2006/12104 ,  G02B2006/12164

Abstract: An optomechanical assembly for a photonic chip is disclosed. The optomechanical assembly may include a planar lightwave circuit optically coupled to a plurality of vertical coupling gratings on the photonic chip, to couple light between an optical connector abutting the planar lightwave circuit and the photonic chip.

Abstract translation: 公开了一种用于光子芯片的光学机械组件。 光学机械组件可以包括光学耦合到光子芯片上的多个垂直耦合光栅的平面光波电路，以便在邻接平面光波电路的光学连接器和光子芯片之间耦合光。