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公开(公告)号：US20080221720A1
公开(公告)日：2008-09-11
申请号：US11683218
申请日：2007-03-07
申请人： Lawrence Hendler , Matthew Richter
发明人： Lawrence Hendler , Matthew Richter
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/45031 , Y02P90/22
摘要： A method for identifying a predetermined state of a manufacturing process by monitoring the process which involves, monitoring a plurality of variables that vary in value during the manufacturing process. The method also involves mapping as points in a hyperspace the values of each variable at a plurality of times, where the hyperspace has a number of dimensions equal to the number of variables and the number of points is equal to the plurality of times. The method also involves identifying that a manufacturing process has reached the predetermined state when one of the points reaches a closed volume in the hyperspace that is located within a predefined distance from a predefined location in the hyperspace.
摘要翻译： 一种用于通过监视涉及在制造过程中监测价值变化的多个变量的过程来识别制造过程的预定状态的方法。 该方法还包括在多空间中将每个变量的值映射到超空间中的点，其中超空间具有等于变量数量的维数，并且点数等于多个次数。 该方法还涉及当其中一个点达到位于距超空间中的预定义位置的预定距离内的超空间中的闭合体积时，制造过程已经达到预定状态。
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公开(公告)号：US07630786B2
公开(公告)日：2009-12-08
申请号：US11683218
申请日：2007-03-07
申请人： Lawrence Hendler , Matthew Richter
发明人： Lawrence Hendler , Matthew Richter
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/45031 , Y02P90/22
摘要： A method for identifying a predetermined state of a manufacturing process by monitoring the process which involves, monitoring a plurality of variables that vary in value during the manufacturing process. The method also involves mapping as points in a hyperspace the values of each variable at a plurality of times, where the hyperspace has a number of dimensions equal to the number of variables and the number of points is equal to the plurality of times. The method also involves identifying that a manufacturing process has reached the predetermined state when one of the points reaches a closed volume in the hyperspace that is located within a predefined distance from a predefined location in the hyperspace.
摘要翻译： 一种用于通过监视涉及在制造过程中监测价值变化的多个变量的过程来识别制造过程的预定状态的方法。 该方法还包括在多空间中将每个变量的值映射到超空间中的点，其中超空间具有等于变量数量的维数，并且点数等于多个次数。 该方法还涉及当其中一个点达到位于距超空间中的预定义位置的预定距离内的超空间中的闭合体积时，制造过程已经达到预定状态。
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公开(公告)号：US07313454B2
公开(公告)日：2007-12-25
申请号：US11292485
申请日：2005-12-02
申请人： Lawrence Hendler , Matthew Richter
发明人： Lawrence Hendler , Matthew Richter
CPC分类号： G05B23/0281
摘要： A method for process monitoring involves acquiring data samples associated with a plurality of manufacturing related variables for a plurality of outputs of a manufacturing process. The distance of each data sample relative to every other data sample is then calculated. The outputs are then grouped based on the Euclidean distances that satisfy a boundary determining criterion.
摘要翻译： 用于过程监控的方法包括获取与制造过程的多个输出相关联的多个制造相关变量的数据样本。 然后计算每个数据样本相对于每个其他数据样本的距离。 然后基于满足边界确定标准的欧氏距离对输出进行分组。
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公开(公告)号：US20070129836A1
公开(公告)日：2007-06-07
申请号：US11292485
申请日：2005-12-02
申请人： Lawrence Hendler , Matthew Richter
发明人： Lawrence Hendler , Matthew Richter
IPC分类号： G06F19/00
CPC分类号： G05B23/0281
摘要： A method for process monitoring involves acquiring data samples associated with a plurality of manufacturing related variables for a plurality of outputs of a manufacturing process. The distance of each data sample relative to every other data sample is then calculated. The outputs are then grouped based on the Euclidean distances that satisfy a boundary determining criterion.
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公开(公告)号：US20100304035A1
公开(公告)日：2010-12-02
申请号：US12789357
申请日：2010-05-27
摘要： A linear process tool comprising at least two deposition modules each comprising one or more plasma spray guns operable to move in a direction approximately orthogonal to the direction of a substrate carrier is configured to deposit at least a first and second layer, in direct contact with each other, wherein a first layer is of first composition and the second layer is of second composition different than the first composition.
摘要翻译： 线性加工工具包括至少两个沉积模块，每个沉积模块包括一个或多个等离子体喷枪，其可操作以在大致垂直于衬底载体的方向的方向上移动。至少沉积与第一和第二层直接接触的第一和第二层 其中，第一层是第一组成，第二层是第二组成不同于第一组成。
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公开(公告)号：US20100100223A1
公开(公告)日：2010-04-22
申请号：US12603976
申请日：2009-10-22
CPC分类号： G05B23/0254 , G05B17/02 , G05B2219/1112 , G05B2219/32187 , G05B2219/32201 , G05B2219/45031 , G05B2223/02 , Y02P90/22 , Y02P90/86
摘要： A method for monitoring a manufacturing process features acquiring metrology data for semiconductor wafers at the conclusion of a final process step for the manufacturing process (“Step a”). Data is acquired for a plurality of process variables for a first process step for manufacturing semiconductor wafers (“Step b”). A first mathematical model of the first process step is created based on the metrology data and the acquired data for the plurality of process variables for the first process step (“Step c”). Steps b and c are repeated for at least a second process step for manufacturing the semiconductor wafers (“Step d”). An nth mathematical model is created based on the metrology data and the data for the plurality of process variables for each of the n process steps ('Step e“). A top level mathematical model is created based on the metrology data and the models created by steps c, d and e (”Step f'). The top level mathematical model of Step f is based on those process variables that have a substantial effect on the metrology data.
摘要翻译： 在制造过程（“步骤a”）的最终处理步骤结束时，用于监测制造过程的方法特征在于获得半导体晶片的度量数据。 对于用于制造半导体晶片的第一工艺步骤的多个工艺变量获取数据（“步骤b”）。 基于测量数据和用于第一处理步骤（“步骤c”）的多个处理变量的获取数据，创建第一处理步骤的第一数学模型。 对于用于制造半导体晶片的至少第二工艺步骤重复步骤b和c（“步骤d”）。 基于计量学数据和用于n个处理步骤（“步骤e”）中的每一个的多个处理变量的数据创建第n个数学模型。 基于测量数据和步骤c，d和e（“Step f”）创建的模型创建顶级数学模型。 步骤f的顶级数学模型基于对测量数据具有实质性影响的过程变量。
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公开(公告)号：US20120303142A1
公开(公告)日：2012-11-29
申请号：US13568881
申请日：2012-08-07
申请人： Lawrence Hendler , Stela Diamant Lazarovich , Ron Hadar , Nouna Kettaneh , Uzi Levami , Dmitry Perlroizen
发明人： Lawrence Hendler , Stela Diamant Lazarovich , Ron Hadar , Nouna Kettaneh , Uzi Levami , Dmitry Perlroizen
IPC分类号： G05B13/04
CPC分类号： G05B19/41875 , G05B2219/32201 , G05B2219/42001 , G05B2219/45031
摘要： A system and computer-implemented method for creating a new model or updating a previously-created model based on a template are described. A template is generated from a previously-created model. The previously-created model specifies a set of parameters associated with a manufacturing process, a process tool or chamber. Variables associated with the manufacturing process are acquired, monitored, and analyzed. A statistical analysis (or multivariate statistical analysis) is employed to analyze the monitored variables and the set of parameters. When any of the monitored variables satisfy a threshold condition, a new model is created or the parameters of the previously-created model are updated, adjusted, or modified based on the template and the monitored variables. A user interface facilitating communication between a user and the systems and display of information is also described.
摘要翻译： 描述了用于创建新模型或基于模板更新先前创建的模型的系统和计算机实现的方法。 从先前创建的模型生成模板。 先前创建的模型指定与制造过程，过程工具或室相关联的一组参数。 获取，监测和分析与制造过程相关的变量。 采用统计分析（或多变量统计分析）来分析监测变量和参数集。 当任何受监视的变量满足阈值条件时，将根据模板和监视变量创建新模型或先前创建的模型的参数进行更新，调整或修改。 还描述了便于用户和系统之间的通信以及信息显示的用户界面。
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公开(公告)号：US07622308B2
公开(公告)日：2009-11-24
申请号：US12044346
申请日：2008-03-07
IPC分类号： H01L21/00
CPC分类号： G05B23/0254 , G05B17/02 , G05B2219/1112 , G05B2219/32187 , G05B2219/32201 , G05B2219/45031 , G05B2223/02 , Y02P90/22 , Y02P90/86
摘要： A method for monitoring a manufacturing process features acquiring metrology data for semiconductor wafers at the conclusion of a final process step for the manufacturing process (“Step a”). Data is acquired for a plurality of process variables for a first process step for manufacturing semiconductor wafers (“Step b”). A first mathematical model of the first process step is created based on the metrology data and the acquired data for the plurality of process variables for the first process step (“Step c”). Steps b and c are repeated for at least a second process step for manufacturing the semiconductor wafers (“Step d”). An nth mathematical model is created based on the metrology data and the data for the plurality of process variables for each of the n process steps (“Step e”). A top level mathematical model is created based on the metrology data and the models created by steps c, d and e (“Step f”). The top level mathematical model of Step f is based on those process variables that have a substantial effect on the metrology data.
摘要翻译： 在制造过程（“步骤a”）的最终处理步骤结束时，用于监测制造过程的方法特征在于获得半导体晶片的度量数据。 对于用于制造半导体晶片的第一工艺步骤的多个工艺变量获取数据（“步骤b”）。 基于测量数据和用于第一处理步骤（“步骤c”）的多个处理变量的获取数据，创建第一处理步骤的第一数学模型。 对于用于制造半导体晶片的至少第二工艺步骤重复步骤b和c（“步骤d”）。 基于计量学数据和用于n个处理步骤（“步骤e”）中的每一个的多个处理变量的数据创建第n个数学模型。 基于测量数据和由步骤c，d和e创建的模型（“步骤f”）创建顶级数学模型。 步骤f的顶级数学模型基于对测量数据具有实质性影响的过程变量。
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公开(公告)号：US08271103B2
公开(公告)日：2012-09-18
申请号：US12113613
申请日：2008-05-01
申请人： Lawrence Hendler , Stela Diamant Lazarovich , Ron Hadar , Nouna Kettaneh , Uzi Levami , Dmitry Perlroizen
发明人： Lawrence Hendler , Stela Diamant Lazarovich , Ron Hadar , Nouna Kettaneh , Uzi Levami , Dmitry Perlroizen
CPC分类号： G05B19/41875 , G05B2219/32201 , G05B2219/42001 , G05B2219/45031
摘要： A system and computer-implemented method for creating a new model or updating a previously-created model based on a template are described. A template is generated from a previously-created model. The previously-created model specifies a set of parameters associated with a manufacturing process, a process tool or chamber. Variables associated with the manufacturing process are acquired, monitored, and analyzed. A statistical analysis (or multivariate statistical analysis) is employed to analyze the monitored variables and the set of parameters. When any of the monitored variables satisfy a threshold condition, a new model is created or the parameters of the previously-created model are updated, adjusted, or modified based on the template and the monitored variables. A user interface facilitating communication between a user and the systems and display of information is also described.
摘要翻译： 描述了用于创建新模型或基于模板更新先前创建的模型的系统和计算机实现的方法。 从先前创建的模型生成模板。 先前创建的模型指定与制造过程，过程工具或室相关联的一组参数。 获取，监测和分析与制造过程相关的变量。 采用统计分析（或多变量统计分析）来分析监测变量和参数集。 当任何受监视的变量满足阈值条件时，将根据模板和监视变量创建新模型或先前创建的模型的参数进行更新，调整或修改。 还描述了便于用户和系统之间的通信以及信息显示的用户界面。
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公开(公告)号：US07996102B2
公开(公告)日：2011-08-09
申请号：US12603976
申请日：2009-10-22
IPC分类号： G06F19/00
CPC分类号： G05B23/0254 , G05B17/02 , G05B2219/1112 , G05B2219/32187 , G05B2219/32201 , G05B2219/45031 , G05B2223/02 , Y02P90/22 , Y02P90/86
摘要： A method for monitoring a manufacturing process features acquiring metrology data for semiconductor wafers at the conclusion of a final process step for the manufacturing process (“Step a”). Data is acquired for a plurality of process variables for a first process step for manufacturing semiconductor wafers (“Step b”). A first mathematical model of the first process step is created based on the metrology data and the acquired data for the plurality of process variables for the first process step (“Step c”). Steps b and c are repeated for at least a second process step for manufacturing the semiconductor wafers (“Step d”). An nth mathematical model is created based on the metrology data and the data for the plurality of process variables for each of the n process steps ('Step e“). A top level mathematical model is created based on the metrology data and the models created by steps c, d and e (”Step f'). The top level mathematical model of Step f is based on those process variables that have a substantial effect on the metrology data.
摘要翻译： 在制造过程（“步骤a”）的最终处理步骤结束时，用于监测制造过程的方法特征在于获得半导体晶片的度量数据。 对于用于制造半导体晶片的第一工艺步骤的多个工艺变量获取数据（“步骤b”）。 基于测量数据和用于第一处理步骤（“步骤c”）的多个处理变量的获取数据，创建第一处理步骤的第一数学模型。 对于用于制造半导体晶片的至少第二工艺步骤重复步骤b和c（“步骤d”）。 基于计量学数据和用于n个处理步骤（“步骤e”）中的每一个的多个处理变量的数据创建第n个数学模型。 基于测量数据和步骤c，d和e（“Step f”）创建的模型创建顶级数学模型。 步骤f的顶级数学模型基于对测量数据具有实质性影响的过程变量。
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