公开(公告)号：US20220246404A1

公开(公告)日：2022-08-04

申请号：US17617271

申请日：2020-06-10

Applicant: Lam Research Corporation

Inventor： Benjamin Philip HEINE ,  Darrell EHRLICH ,  Robin KOSHY ,  Slobodan MITROVIC ,  John DAUGHERTY

IPC: H01J37/32 ,  H01L21/683 ,  C23C14/12 ,  C23C14/58

Abstract: A component for use in a plasma processing chamber is provided. A metal containing component body is provided. A sealant coating is over a surface of the metal containing component body, wherein the sealant coating comprises at least one of a silicone sealant, an organic sealant, or epoxy sealant, wherein the sealant coating is not covered and directly exposed to plasma in the plasma processing chamber.

公开(公告)号：US20230343627A1

公开(公告)日：2023-10-26

申请号：US18011103

申请日：2021-08-23

Applicant: Lam Research Corporation

Inventor： Debanjan DAS ,  Eric SAMULON ,  Darrell EHRLICH

IPC: H01L21/683 ,  H01J37/32

CPC classification number: H01L21/6833 ,  H01J37/32715 ,  H01J37/32807 ,  H01J2237/3341 ,  H01L21/67069

Abstract: A component of a semiconductor processing chamber formed of a metal matrix component having an anodized layer on a surface thereof. The anodized layer comprises an aluminum oxide layer and is formed over an AlSic component. The anodized layer provides the component with protection against corrosion due to plasma processing gases, as the anodized layer provides a protective coating. A layer of aluminum is plated over a surface of the component and the aluminum layer is subsequently anodized to form the protective layer.

公开(公告)号：US20230039670A1

公开(公告)日：2023-02-09

申请号：US17790009

申请日：2021-01-08

Applicant: LAM RESEARCH CORPORATION

Inventor： Eric SAMULON ,  Darrell EHRLICH

IPC: H01L21/687 ,  C23C16/458

Abstract: A baseplate of a substrate support assembly for supporting a semiconductor substrate in a processing chamber comprises a first component made of a first material including a metal and a nonmetal. The first material has a first coefficient of thermal expansion. A layer coating the first component is made of a second material. The second material has a second coefficient of thermal expansion. The first and second coefficients of thermal expansion are different.

公开(公告)号：US20230087913A1

公开(公告)日：2023-03-23

申请号：US17799897

申请日：2021-02-18

Applicant: LAM RESEARCH CORPORATION

Inventor： Feng WANG ,  Alexander MATYUSHKIN ,  Darrell EHRLICH ,  Eric SAMULON

IPC: H01L21/683 ,  H01J37/32

Abstract: A baseplate for a substrate support in a substrate processing system includes at least one coolant channel formed within the baseplate. The at least one coolant channel defines a volume within the baseplate configured to retain a coolant and follows a path configured to distribute the coolant in the volume throughout the baseplate. At least one fin is provided within the at least one coolant channel The at least one fin extends from at least one of a top, a bottom, and a sidewall of the at least one coolant channel into the volume to increase a surface area of the at least one coolant channel.

公开(公告)号：US20220254612A1

公开(公告)日：2022-08-11

申请号：US17632066

申请日：2020-08-04

Applicant: LAM RESEARCH CORPORATION

Inventor： Christopher KIMBALL ,  Hema Swaroop MOPIDEVI ,  Saravanapriyan SRIRAMAN ,  Tom A. KAMP ,  Darrell EHRLICH ,  Anthony CONTRERAS ,  Chiara Helena Catherina MACPHERSON

IPC: H01J37/32 ,  H01L21/687

Abstract: A moveable edge ring system for a plasma processing system includes a top edge ring and a first edge ring arranged below the top edge ring. A second edge ring is made of conductive material and includes an upper portion, a middle portion and a lower portion. The top edge ring and the second edge ring are configured to move in a vertical direction relative to a substrate support and the first edge ring when biased upwardly by a lift pin. The second edge ring is arranged below the top edge ring and radially outside of the first edge ring.

公开(公告)号：US20220139681A1

公开(公告)日：2022-05-05

申请号：US17435340

申请日：2020-03-04

Applicant: Lam Research Corporation

Inventor： Ann ERICKSON ,  Darrell EHRLICH

IPC: H01J37/32 ,  H01L21/683

Abstract: An electrostatic chuck system for a plasma processing chamber is provided. A base plate comprising Al—SiC is provided. A ceramic plate is disposed over the base plate. A bonding layer bonds the ceramic plate to the base plate.

公开(公告)号：US20230369026A1

公开(公告)日：2023-11-16

申请号：US18029708

申请日：2021-09-29

Applicant: LAM RESEARCH CORPORATION

Inventor： Christopher KIMBALL ,  Darrell EHRLICH ,  Yuma OHKURA

IPC: H01J37/32 ,  H01L21/687

CPC classification number: H01J37/32642 ,  H01J37/32651 ,  H01L21/68735 ,  H01L21/68742

Abstract: A moveable edge ring system for a substrate processing system includes a top moveable ring including a first annular body arranged around a substrate support. The top moveable ring is exposed to plasma during substrate processing. A moveable support ring is arranged below the top moveable ring and radially outside of a baseplate of the substrate support and includes a second annular body. A shield ring is arranged radially outside of the moveable support ring and includes a third annular body. A cover ring includes a fourth annular body arranged above a radially outer edge of the top moveable ring. An actuator and a lift pin are configured to adjust a position of the top moveable ring and the moveable support ring relative to the shield ring and the cover ring.

公开(公告)号：US20230081544A1

公开(公告)日：2023-03-16

申请号：US17794576

申请日：2021-01-26

Applicant: Lam Research Corporation

Inventor： Pylin SAROBOL ,  Eric SAMULON ,  Pankaj HAZARIKA ,  Dennis SMITH ,  Kurt KERN ,  Debanjan DAS ,  Darrell EHRLICH ,  Eric A. PAPE ,  Matthew Brian SCHICK

IPC: H01J37/32 ,  H01L21/683 ,  B23K26/352

Abstract: A component for use inside a semiconductor chamber with a laser textured surface facing a vacuum region inside the semiconductor chamber is provided.

公开(公告)号：US20220148903A1

公开(公告)日：2022-05-12

申请号：US17429434

申请日：2020-01-27

Applicant: LAM RESEARCH CORPORATION

Inventor： Feng WANG ,  Keith GAFF ,  Christopher KIMBALL ,  Darrell EHRLICH

IPC: H01L21/683 ,  H01J37/32 ,  C04B37/00 ,  C04B41/00 ,  C04B41/45

Abstract: An electrostatic chuck for a substrate processing system includes a monolithic body made of ceramic. A plurality of first electrodes are arranged in the monolithic body adjacent to a top surface of the monolithic body and that are configured to selectively receive a chucking signal. A gas channel is formed in the monolithic body and is configured to supply back side gas to the top surface. Coolant channels are formed in the monolithic body and are configured to receive fluid to control a temperature of the monolithic body.

公开(公告)号：US20180174804A1

公开(公告)日：2018-06-21

申请号：US15895367

申请日：2018-02-13

Applicant: LAM RESEARCH CORPORATION

Inventor： Darrell EHRLICH ,  Daniel Arthur Brown ,  Ian Kenworthy

IPC: H01J37/32 ,  H01L21/3065

CPC classification number: H01J37/32541 ,  C23C16/4557 ,  H01J37/32091 ,  H01J37/3244 ,  H01J37/32522 ,  H01L21/3065 ,  Y10T29/49002 ,  Y10T29/49083 ,  Y10T29/49098 ,  Y10T29/49117 ,  Y10T29/49803

Abstract: A compression member for use in a showerhead electrode assembly of a capacitively coupled plasma chamber. The member applies a compression force to a portion of a film heater adjacent a power supply boot on an upper surface of a thermal control plate and is located between the thermal control plate and a temperature-controlled top plate. The member is composed of an electrically insulating elastomeric material which can work over a large range of compressions and temperatures.