SOLAR CELL AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    SOLAR CELL AND METHOD OF MANUFACTURING THE SAME 审中-公开
    太阳能电池及其制造方法

    公开(公告)号:US20160351737A1

    公开(公告)日:2016-12-01

    申请号:US15166593

    申请日:2016-05-27

    Abstract: Disclosed is a method of manufacturing a solar cell, the method including forming a tunneling layer over one surface of a semiconductor substrate, forming a semiconductor layer over the tunneling layer, forming a conductive area including a first conductive area of a first conductive type and a second conductive area of a second conductive type in the semiconductor layer, and forming an electrode including a first electrode connected to the first conductive area and a second electrode connected to the second conductive area. The forming of the conductive area includes forming a mask layer over the semiconductor layer, forming a doping opening corresponding to at least one of the first conductive area and the second conductive area in the mask layer using a laser, and performing doping using the doping opening.

    Abstract translation: 公开了一种制造太阳能电池的方法,该方法包括在半导体衬底的一个表面上形成隧穿层,在隧道层上形成半导体层,形成包括第一导电类型的第一导电区域和 在所述半导体层中形成第二导电类型的第二导电区域,以及形成包括连接到所述第一导电区域的第一电极和连接到所述第二导电区域的第二电极的电极。 导电区域的形成包括在半导体层上形成掩模层,使用激光形成对应于掩模层中的第一导电区域和第二导电区域中的至少一个的掺杂开口,并且使用掺杂开口 。

    DISPLAY DEVICE AND METHOD FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DIODES

    公开(公告)号:US20220302342A1

    公开(公告)日:2022-09-22

    申请号:US17832221

    申请日:2022-06-03

    Abstract: A display device includes a plurality of semiconductor light emitting diodes, first and second electrodes respectively extending from the plurality of semiconductor light emitting diodes to supply an electrical signal to the plurality of semiconductor light emitting diodes, a plurality of pair electrodes disposed on a substrate and having a first electrode and a second electrode, a dielectric layer disposed on the plurality of pair electrodes, and a chemical bond layer disposed between the dielectric layer and the plurality of semiconductor light emitting diodes and forming a covalent bond with the dielectric layer and each of the plurality of semiconductor light emitting diodes. The chemical bond layer bonds the semiconductor light emitting diodes to the dielectric layer when a voltage applied to the plurality of pair electrodes is cut off after the plurality of semiconductor light emitting diodes are assembled on the dielectric layer.

    SOLAR CELL AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20190326457A1

    公开(公告)日:2019-10-24

    申请号:US16502812

    申请日:2019-07-03

    Abstract: A solar cell can include a semiconductor substrate; a tunneling layer formed over the semiconductor substrate; a conductive area located over the tunneling layer, the conductive area including a first conductive area of a first conductive type and a second conductive area of a second conductive type; and an electrode including a first electrode connected to the first conductive area and a second electrode connected to the second conductive area, wherein a mark is located in at least one of the first conductive area and the second conductive area, and has a different shape from that of a crystal plane of the semiconductor substrate and the conductive area, and wherein the mark is formed along a longitudinally extending edge of at least one of the first conductive area and the second conductive area.

    SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20180083149A1

    公开(公告)日:2018-03-22

    申请号:US15600042

    申请日:2017-05-19

    Abstract: Disclosed is a solar cell including a control passivation film on one surface of a semiconductor substrate, and being formed of a dielectric material; and a semiconductor layer on the control passivation film, wherein the semiconductor layer including a first conductive region having a first conductive type and a second conductive region having a second conductive type opposite to the first conductive type. The semiconductor substrate includes a diffusion region including at least one of a first diffusion region and a second diffusion region adjacent to the control passivation film, wherein the first diffusion region being locally formed to correspond to the first conductive region and having a doping concentration lower than a doping concentration of the first conductive region, wherein the second diffusion region being locally formed to correspond to the second conductive region and having a doping concentration lower than a doping concentration of the second conductive region.

    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS

    公开(公告)号:US20240072213A1

    公开(公告)日:2024-02-29

    申请号:US18271183

    申请日:2021-01-06

    CPC classification number: H01L33/483 H01L25/167 H01L33/20

    Abstract: A display device, according to the present invention, comprises a red semiconductor light-emitting element, a green semiconductor light-emitting element and a blue semiconductor light-emitting element, and comprises: a substrate on which the red, green and blue semiconductor light-emitting elements are arranged; and receiving holes which are formed on the substrate and in which the red, green and blue semiconductor light-emitting elements are assembled, wherein the red, green and blue semiconductor light-emitting elements each comprise a tip on a side surface thereof, such that at least any one among the angle formed by the tip and the thickness of one side with respect to the tip is formed so as to be different.

    METHOD OF MANUFACTURING DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENT

    公开(公告)号:US20220393074A1

    公开(公告)日:2022-12-08

    申请号:US17775746

    申请日:2019-11-15

    Abstract: A method of manufacturing a display device according to the present invention involves assembling a semiconductor light emitting element to an assembly substrate and then transferring the same to a wiring substrate, wherein, during self-assembly using magnetic and electric fields, the semiconductor light emitting element is fixed to the assembly substrate by forming a covalent bond between the semiconductor light emitting element and the assembly substrate so that the semiconductor light emitting element does not become separated from the assembly substrate, and when transferring the assembled object to the wiring substrate, the formed covalent bond is broken down so that the semiconductor light emitting element can be easily detached from the assembly substrate.

    DISPLAY DEVICE USING MICRO LED
    10.
    发明申请

    公开(公告)号:US20230005886A1

    公开(公告)日:2023-01-05

    申请号:US17779907

    申请日:2020-02-10

    Abstract: Discussed is a display device including a base part; a plurality of assembly electrodes disposed on the base part and having a first electrode and a second electrode that generate an electric field when power is applied; a dielectric layer disposed to cover the plurality of assembly electrodes; and a plurality of semiconductor light emitting devices disposed on a surface of the dielectric layer, wherein one surface of the plurality of semiconductor light emitting devices facing the dielectric layer and one surface of the dielectric layer facing the plurality of semiconductor light emitting devices respectively comprise a concave-convex structure.

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