公开(公告)号：US20220077122A1

公开(公告)日：2022-03-10

申请号：US17530155

申请日：2021-11-18

Applicant: LG ELECTRONICS INC.

Inventor： Changseo PARK ,  Jinhyung LEE ,  Jungsub KIM ,  Seongmin MOON ,  Younho HEO

IPC: H01L25/075 ,  H01L33/00 ,  H01L21/683 ,  H01L33/62

Abstract: Discussed is an assembly substrate used for a display device manufacturing method of mounting semiconductor light-emitting diodes on the assembly substrate at preset positions using electric field and magnetic field. The assembly substrate includes a base portion, a plurality of assembly electrodes on the base portion, a dielectric layer on the base portion to cover the assembly electrodes, a barrier wall on the base portion, and a metal shielding layer on the base portion, wherein the metal shielding layer overlaps the barrier wall.

公开(公告)号：US20170278986A1

公开(公告)日：2017-09-28

申请号：US15465026

申请日：2017-03-21

Applicant: LG ELECTRONICS INC.

Inventor： Jinhyung LEE ,  Jungmin HA ,  Sangwook PARK

IPC: H01L31/02 ,  H01L31/075 ,  H01L31/0224 ,  H01L31/0747 ,  H01L31/05 ,  H01L31/048

CPC classification number: H01L31/02013 ,  H01L31/0201 ,  H01L31/022425 ,  H01L31/022433 ,  H01L31/022466 ,  H01L31/0481 ,  H01L31/0504 ,  H01L31/0512 ,  H01L31/0747 ,  H01L31/075 ,  Y02E10/50

Abstract: A solar cell panel includes a first solar cell and a second solar cell; and a plurality of leads connecting the first solar cell and the second solar cell. Each of the first solar cell and the second solar cell includes: a first electrode including a plurality of finger lines in a first direction and a plurality of first bus bars in a second direction crossing the first direction; and a second electrode including a plurality of second bus bars in the second direction. The plurality of leads have a diameter or width of 100 to 500 μm, and include 6 or more leads arranged at one surface side of the first or second solar cell. The plurality of leads are connected to the plurality of first bus bars of the first solar cell and the plurality of second bus bars of the second solar cell by a solder layer, respectively.

公开(公告)号：US20230268456A1

公开(公告)日：2023-08-24

申请号：US18012823

申请日：2020-06-26

Applicant: LG ELECTRONICS INC.

Inventor： Kisu KIM ,  Jinhyung LEE ,  Gunho KIM ,  Jungsub KIM

IPC: H01L33/00 ,  H01L33/48 ,  H01L25/075 ,  H01L33/20 ,  H01L33/16

CPC classification number: H01L33/0093 ,  H01L25/0753 ,  H01L33/16 ,  H01L33/20 ,  H01L33/483

Abstract: Discussed is a substrate for manufacturing a display apparatus, and the substrate can include a base portion, pair electrodes disposed on the base portion to extend in an extension direction, a dielectric layer disposed on the base portion to cover the pair electrodes, a partition wall portion disposed on the dielectric layer, and cells defined by the partition wall portion, and arranged to overlap the pair electrodes along the extension direction of the pair electrodes. The pair electrodes are arranged at different intervals.

公开(公告)号：US20230138336A1

公开(公告)日：2023-05-04

申请号：US17978781

申请日：2022-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Seongmin MOON ,  Yangwoo BYUN ,  Kiseong JEON ,  Jinhyung LEE

IPC: H01L33/54 ,  H01L33/38 ,  H01L25/16

Abstract: A display device according to an embodiment can include a first assembly electrode and a second assembly electrode disposed to be spaced apart from each other on a substrate, a first insulating layer disposed on the first assembly electrode and the second assembly electrode, a semiconductor light emitting device having an assembly barrier wall including a predetermined assembly hole and disposed on the first insulating layer, a side electrode electrically connected to a first side surface of the semiconductor light emitting device, and a second panel electrode electrically connected to the second conductivity type semiconductor layer.

公开(公告)号：US20180190843A1

公开(公告)日：2018-07-05

申请号：US15903653

申请日：2018-02-23

Applicant: LG ELECTRONICS INC.

Inventor： Junyong AHN ,  Younghyun LEE ,  Jinhyung LEE

IPC: H01L31/0224 ,  H01L31/068

CPC classification number: H01L31/022433 ,  H01L31/022425 ,  H01L31/068 ,  Y02E10/547

Abstract: A solar cell includes a first conductive type substrate; an emitter layer of a second conductive type opposite the first conductive type, the emitter layer and the substrate forming a p-n junction; an anti-reflection layer positioned on the emitter layer; a plurality of first electrodes passing through the anti-reflection layer and being electrically connected to the emitter layer, at least one of the plurality of first electrodes including: a first electrode layer and a plurality of first electrode auxiliaries separated from the first electrode layer and positioned around the first electrode layer; and a second electrode layer positioned on the first electrode layer and on the plurality of first electrode auxiliaries; and a second electrode electrically connected to the substrate.

公开(公告)号：US20230317491A1

公开(公告)日：2023-10-05

申请号：US18024371

申请日：2020-09-29

Applicant: LG ELECTRONICS INC.

Inventor： Kisu KIM ,  Jinhyung LEE ,  Yongil SHIN

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01L25/0753

Abstract: A semiconductor light emitting diode self-assembling device according to the present invention comprises: an assembly chamber in which fluid and semiconductor light emitting diodes are received; a magnetic chuck disposed above the assembly chamber and applying, while moving in a horizontal direction, a magnetic force thereto so as to induce movement of the semiconductor light emitting diodes in the assembly chamber; a substrate chuck for placing an assembly substrate, on which the semiconductor light emitting diodes in the assembly chamber are seated, between the assembly chamber and the magnetic chuck and supporting the assembly substrate; and a control part for controlling the driving of the magnetic chuck and the substrate chuck, wherein the magnetic chuck includes: a magnetic force forming part including a plurality of magnets; and a vacuum forming part for correcting a bending phenomenon of the assembly substrate by using vacuum pressure between the plurality of magnets so as to maintain a predetermined interval between one side of the magnetic chuck and the assembly substrate.

公开(公告)号：US20190103500A1

公开(公告)日：2019-04-04

申请号：US16135929

申请日：2018-09-19

Applicant: LG ELECTRONICS INC.

Inventor： Jinhyung LEE ,  Sangwook PARK ,  Ayoung BAK ,  Jemin YU

IPC: H01L31/049 ,  H01L31/05 ,  H01L31/0224 ,  H01L31/18 ,  H01L31/20 ,  H01L31/0376

Abstract: Disclosed is a solar cell panel including a solar cell; a sealing member surrounding and sealing the solar cell; a moisture barrier layer positioned between the solar cell and the sealing member and including silicon, a first cover member positioned at a surface of the solar cell on the sealing member; and a second cover member positioned at another surface of the solar cell on the sealing member.

公开(公告)号：US20190035655A1

公开(公告)日：2019-01-31

申请号：US16146958

申请日：2018-09-28

Applicant: LG ELECTRONICS INC.

Inventor： Kyoungsoo LEE ,  Minho CHOI ,  Jinhyung LEE ,  Gyeayoung KWAG ,  Sangwook PARK

IPC: H01L21/67 ,  H01L31/18 ,  H01L21/677 ,  H05B3/00

Abstract: A post-processing apparatus of a solar cell that carries out a post-processing operation including a main period for heat-treating a solar cell having a semiconductor substrate while providing light to the solar cell, the post-processing apparatus including a main section to carry out the main period, wherein the main section comprises a first heat source unit to provide heat to the semiconductor substrate and a light source unit to provide light to the semiconductor substrate, the first heat source unit and the light source unit being positioned in the main section, and the light source unit comprises a light source constituted by a plasma lighting system (PLS).

公开(公告)号：US20150357510A1

公开(公告)日：2015-12-10

申请号：US14733620

申请日：2015-06-08

Applicant: LG ELECTRONICS INC.

Inventor： Kyoungsoo LEE ,  Minho CHOI ,  Jinhyung LEE ,  Gyeayoung KWAG ,  Sangwook PARK

IPC: H01L31/18

CPC classification number: H01L31/1864 ,  H01L21/3003 ,  H01L31/1868 ,  Y02E10/50 ,  Y02P70/521

Abstract: A method of manufacturing a solar cell is discussed. The method of manufacturing the solar cell includes: forming a conductive region on a semiconductor substrate; forming an electrode connected to the conductive region; and post-processing the semiconductor substrate to passivate the semiconductor substrate. The post-processing of the semiconductor substrate comprises a main processing process for heat-treating the semiconductor substrate while providing light to the semiconductor substrate. A temperature of the main processing process is about 100° C. to about 800° C., and the temperature and light intensity of the main processing process satisfy Equation of 1750−31.8·T+(0.16)·T2≦I. Here, T is the temperate (° C.) of the main processing process, and I is the light intensity (mW/cm2) of the main processing process.

Abstract translation: 讨论了太阳能电池的制造方法。 太阳能电池的制造方法包括：在半导体基板上形成导电区域; 形成连接到所述导电区域的电极; 并对半导体衬底进行后处理以钝化半导体衬底。 半导体衬底的后处理包括用于在向半导体衬底提供光的同时对半导体衬底进行热处理的主要处理工艺。 主加工工艺的温度为约100℃至约800℃，主加工工艺的温度和光强度满足公式1750-31.8·T +（0.16）·T2＆nlE; I。 这里，T是主处理过程的温度（℃），I是主处理过程的光强度（mW / cm 2）。

公开(公告)号：US20230299055A1

公开(公告)日：2023-09-21

申请号：US18020608

申请日：2020-08-10

Applicant: LG ELECTRONICS INC.

Inventor： Changseo PARK ,  Jinhyung LEE ,  Younho HEO ,  Yongil SHIN ,  Kisu KIM

IPC: H01L25/075 ,  H01L33/36 ,  H01L21/304 ,  H01L33/08 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L33/36 ,  H01L21/3043 ,  H01L33/08 ,  H01L33/0095

Abstract: A method for manufacturing a substrate for manufacturing a display device, according to the present invention, comprises the steps of: (a) forming, at predetermined intervals, assembly electrodes extending in one direction on a base part, and forming a dielectric layer so as to cover the assembly electrodes; (b) forming, on the dielectric layer, metal patterns so as to overlap the assembly electrodes; (c) forming partition parts on the dielectric layer so as to cover the metal patterns, and then forming assembly holes so as to overlap the metal patterns; and (d) removing the metal patterns exposed through the assembly holes, wherein, in step (d), a groove part is formed on the surface of each partition part, which forms the inner surface of each assembly hole, as the metal patterns are removed.