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公开(公告)号：US20240231427A9
公开(公告)日：2024-07-11
申请号：US18457360
申请日：2023-08-29
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Atsushi Ohyama , Yusuke Onoue , Akinori Uchino
CPC classification number: G06F1/1618 , G06F1/1681 , G06F1/203 , H05K5/0226 , H05K7/20472
Abstract: An electronic apparatus includes a first chassis in which a motherboard mounted with a processing device is mounted, a second chassis provided adjacent to the first chassis, a hinge device that relatively rotatably connects the first chassis to the second chassis, an electrical component that is provided in the first chassis and generates heat, a plate-shaped thermal module that is provided in the first chassis and is thermally connected to the electrical component to radiate heat, and a graphite sheet provided to extend from the first chassis to the second chassis. A connection edge portion of the first chassis is made of a heat conductive material, the thermal module is provided with a heat pipe along the connection edge portion, and the graphite sheet is thermally connected to the heat pipe and the connection edge portion by being laminated and interposed therebetween.
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公开(公告)号：US20230121174A1
公开(公告)日：2023-04-20
申请号：US17943429
申请日：2022-09-13
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Atsushi Ohyama , Yusuke Onoue , Takanori Hoshino
Abstract: An electronic apparatus includes: a first chassis equipped with a substrate on which a processing device is mounted; a second chassis which is provided adjacently to the first chassis and equipped with a battery device; a hinge device that connects the first chassis and the second chassis in such a manner as to be rotatable relative to each other between a first posture in which the first chassis and the second chassis are stacked to overlap each other in a surface normal direction and a second posture in which the first chassis and the second chassis are arranged side by side in a direction perpendicular in the surface normal direction; a spine component which is made of a thermally conductive material.
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公开(公告)号：US20220232729A1
公开(公告)日：2022-07-21
申请号：US17644111
申请日：2021-12-14
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Atsushi Ohyama , Takayuki Morino , Takuroh Kamimura , Akinori Uchino
Abstract: An electronic apparatus includes a first chassis having a heat generating element, a second chassis, a hinge device that connects the first chassis and the second chassis such that the first chassis and the second chassis can be rotated relative to each other between a 0-degree attitude and a 180-degree attitude, and a display provided across the first chassis and the second chassis. The hinge device has a metal hinge main body, a metal first support plate provided to be relatively movable with respect to the inner surface of the first chassis, and a metal second support plate provided to be relatively movable with respect to the inner surface of the second chassis. The electronic apparatus further includes a flexible heat conductive member in the first chassis. The heat conductive member thermally connects a heat receiving member that receives heat from a heat generating element, and the first support plate.
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公开(公告)号：US12158779B2
公开(公告)日：2024-12-03
申请号：US17943429
申请日：2022-09-13
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Atsushi Ohyama , Yusuke Onoue , Takanori Hoshino
Abstract: An electronic apparatus includes: a first chassis equipped with a substrate on which a processing device is mounted; a second chassis which is provided adjacently to the first chassis and equipped with a battery device; a hinge device that connects the first chassis and the second chassis in such a manner as to be rotatable relative to each other between a first posture in which the first chassis and the second chassis are stacked to overlap each other in a surface normal direction and a second posture in which the first chassis and the second chassis are arranged side by side in a direction perpendicular in the surface normal direction; a spine component which is made of a thermally conductive material.
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公开(公告)号：US12019486B2
公开(公告)日：2024-06-25
申请号：US17804175
申请日：2022-05-26
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Hao-Yu Wang , Akinori Uchino , Atsushi Ohyama
CPC classification number: G06F1/203 , B21D5/16 , H05K7/20145 , H05K7/20154 , H05K7/20172 , H05K7/20409
Abstract: A heat sink faces an exhaust port of a blower fan in use, and includes: a first plate-shaped portion; a second plate-shaped portion disposed in parallel with the first plate-shaped portion having a gap therebetween; a plurality of fins that stand up between the first plate-shaped portion and the second plate-shaped portion and are disposed side by side with a gap therebetween to define an air flow path between the fins, through which air flows from the exhaust port; and a protrusion that is disposed at a part of each fin including a center of the upright height, and protrudes into the air flow path.
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Patent Agency Ranking
公开(公告)号：US11723170B2
公开(公告)日：2023-08-08
申请号：US17644111
申请日：2021-12-14
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Atsushi Ohyama , Takayuki Morino , Takuroh Kamimura , Akinori Uchino
CPC classification number: H05K7/20154 , G06F1/1616 , G06F1/1626 , G06F1/1681 , H05K5/0017 , H05K5/0226
Abstract: An electronic apparatus includes a first chassis having a heat generating element, a second chassis, a hinge device that connects the first chassis and the second chassis such that the first chassis and the second chassis can be rotated relative to each other between a 0-degree attitude and a 180-degree attitude, and a display provided across the first chassis and the second chassis. The hinge device has a metal hinge main body, a metal first support plate provided to be relatively movable with respect to the inner surface of the first chassis, and a metal second support plate provided to be relatively movable with respect to the inner surface of the second chassis. The electronic apparatus further includes a flexible heat conductive member in the first chassis. The heat conductive member thermally connects a heat receiving member that receives heat from a heat generating element, and the first support plate.
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公开(公告)号：US20230011030A1
公开(公告)日：2023-01-12
申请号：US17804175
申请日：2022-05-26
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Hao-Yu Wang , Akinori Uchino , Atsushi Ohyama
Abstract: A heat sink faces an exhaust port of a blower fan in use, and includes: a first plate-shaped portion; a second plate-shaped portion disposed in parallel with the first plate-shaped portion having a gap therebetween; a plurality of fins that stand up between the first plate-shaped portion and the second plate-shaped portion and are disposed side by side with a gap therebetween to define an air flow path between the fins, through which air flows from the exhaust port; and a protrusion that is disposed at a part of each fin including a center of the upright height, and protrudes into the air flow path.
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公开(公告)号：US10681840B2
公开(公告)日：2020-06-09
申请号：US16022656
申请日：2018-06-28
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Tsutomu Chonan , Takuroh Kamimura , Takateru Adachi , Atsushi Ohyama , Shogo Akiyama
Abstract: The present invention aims to reduce noise derived from an operation sound of a fan while maintaining cooling capacity of the fan. A cooling system includes a fan which is disposed in a chassis in which a CPU which is exemplified as a heating element is housed, one temperature sensor which is disposed in the chassis, another temperature sensor which is disposed at a position which is different from a position of the one temperature sensor, and a fan control unit which drives the fan in a case where one temperature, which is based on a measured value of one temperature sensor, is at least a first threshold value or in a case where another temperature, which is based on a measured value of the other temperature sensor, is at least a second threshold value which is set to a value lower than the first threshold value.
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公开(公告)号：US20250016951A1
公开(公告)日：2025-01-09
申请号：US18735550
申请日：2024-06-06
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Yuki Saigusa , Ryota Watanabe , Atsushi Ohyama , Kengo Sano
Abstract: An electronic apparatus includes: a chassis; a heat generation element provided in the chassis; a heat transfer member in contact with the heat generation element in a heat-transferable manner; and one or a plurality of heat dissipation mechanisms configured to cool the heat transfer member. The heat dissipation mechanism includes a first cooling device configured to cool a first main surface of the heat transfer member, and a second cooling device configured to cool a second main surface of the heat transfer member opposite to the first main surface. The first cooling device includes a first heat dissipation plate in contact with the first main surface in a heat-transferable manner, and a first blower mechanism configured to blow a gas to come into contact with the first heat dissipation plate.
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公开(公告)号：US20240237292A9
公开(公告)日：2024-07-11
申请号：US18459361
申请日：2023-08-31
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Atsushi Ohyama , Yusuke Onoue , Akinori Uchino
CPC classification number: H05K7/20481 , G06F1/203
Abstract: An electronic apparatus includes a CPU provided in a first chassis and generating heat, a plate-shaped vapor chamber provided in the first chassis and thermally connected to the CPU to radiate heat, and two heat pipes protruding and extending from the vapor chamber at positions separated from each other. A graphite sheet that is thinner than the vapor chamber is thermally connected to the two heat pipes. A battery device having three cells is provided in the first chassis, and the heat pipe extends into a groove portion formed between the cells.
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