- 专利标题: Electronic apparatus
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申请号: US17644111申请日: 2021-12-14
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公开(公告)号: US11723170B2公开(公告)日: 2023-08-08
- 发明人: Atsushi Ohyama , Takayuki Morino , Takuroh Kamimura , Akinori Uchino
- 申请人: LENOVO (SINGAPORE) PTE. LTD.
- 申请人地址: SG Singapore
- 专利权人: LENOVO (SINGAPORE) PTE. LTD.
- 当前专利权人: LENOVO (SINGAPORE) PTE. LTD.
- 当前专利权人地址: SG Singapore
- 代理机构: Shimokaji IP
- 优先权: JP 21006660 2021.01.19
- 主分类号: H05K5/00
- IPC分类号: H05K5/00 ; H05K7/20 ; G06F1/16 ; H05K5/02
摘要:
An electronic apparatus includes a first chassis having a heat generating element, a second chassis, a hinge device that connects the first chassis and the second chassis such that the first chassis and the second chassis can be rotated relative to each other between a 0-degree attitude and a 180-degree attitude, and a display provided across the first chassis and the second chassis. The hinge device has a metal hinge main body, a metal first support plate provided to be relatively movable with respect to the inner surface of the first chassis, and a metal second support plate provided to be relatively movable with respect to the inner surface of the second chassis. The electronic apparatus further includes a flexible heat conductive member in the first chassis. The heat conductive member thermally connects a heat receiving member that receives heat from a heat generating element, and the first support plate.
公开/授权文献
- US20220232729A1 ELECTRONIC APPARATUS 公开/授权日:2022-07-21
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