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公开(公告)号：US11968806B2
公开(公告)日：2024-04-23
申请号：US17805043
申请日：2022-06-02
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Masahiro Kitamura , Yusuke Onoue , Takuroh Kamimura , Akinori Uchino
CPC classification number: H05K7/2039 , G06F1/203 , H05K7/20136 , H05K7/20336
Abstract: An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.
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公开(公告)号：US12158779B2
公开(公告)日：2024-12-03
申请号：US17943429
申请日：2022-09-13
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Atsushi Ohyama , Yusuke Onoue , Takanori Hoshino
Abstract: An electronic apparatus includes: a first chassis equipped with a substrate on which a processing device is mounted; a second chassis which is provided adjacently to the first chassis and equipped with a battery device; a hinge device that connects the first chassis and the second chassis in such a manner as to be rotatable relative to each other between a first posture in which the first chassis and the second chassis are stacked to overlap each other in a surface normal direction and a second posture in which the first chassis and the second chassis are arranged side by side in a direction perpendicular in the surface normal direction; a spine component which is made of a thermally conductive material.
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公开(公告)号：US20230069684A1
公开(公告)日：2023-03-02
申请号：US17805043
申请日：2022-06-02
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Masahiro Kitamura , Yusuke Onoue , Takuroh Kamimura , Akinori Uchino
Abstract: An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.
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公开(公告)号：US20230079287A1
公开(公告)日：2023-03-16
申请号：US17859714
申请日：2022-07-07
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Masahiro Kitamura , Yusuke Onoue , Takuroh Kamimura
Abstract: An electronic apparatus uses the cooling effect of a vapor chamber and includes: a chassis; a motherboard which is provided in the chassis and has a CPU mounted on a front surface thereof; a vapor chamber having a working fluid sealed in a hermetically sealed space formed between two metal plates; a stud fixed to the upper surface of the vapor chamber; and a screw fixing the stud and the motherboard. The CPU is thermally connected to the upper surface of the vapor chamber. The motherboard has a mounting hole formed therein, and the screw is screwed to the stud through the mounting hole from the rear surface of the motherboard. The CPU is rectangular, and four studs and four screws are provided at positions in the vicinity of the four corners of the CPU.
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公开(公告)号：US20220357114A1
公开(公告)日：2022-11-10
申请号：US17313425
申请日：2021-05-06
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Tsutomu Chonan , Shogo Akiyama , Yusuke Onoue
Abstract: A stacked conductance fin assembly, that is connected to a heatpipe and an exhaust fan of a computing device, includes: a plurality of fins that are partially overlapped and stacked in a linear array along a first axis of the stacked conductance fin assembly. Overlapping regions of the plurality of fins form two parallel structural walls along the first axis. The overlapping regions overlap along a second axis of the stacked conductance fin assembly, the second axis being perpendicular to the first axis. Each of the plurality of fins includes: a main surface that extends along the second axis between two outermost ends of the main surface; two walls that extend along the first axis, each wall extending from each of the outermost ends of the main surface, respectively; and two offset walls that extend along the first axis, each offset wall extending from each wall, respectively.
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Patent Agency Ranking
公开(公告)号：US20240422929A1
公开(公告)日：2024-12-19
申请号：US18615168
申请日：2024-03-25
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Daisuke Takahashi , Hiroaki Kinoshita , Yalu Liu , Yusuke Onoue
Abstract: An electronic apparatus includes a first chassis and a second chassis that are rotatably connected via a hinge device. A graphite sheet is disposed on an inner face of the first chassis to come in contact with a spine component in the 180-degree posture. A graphite sheet is disposed on an inner face of the second chassis to come in contact with a spine component in the 180-degree posture. A flexible board extends across the first and second chassis, and forms substantially S-shaped surplus length absorbing parts having a first folded part and a second folded part that are curved in opposite directions in the chassis. In the graphite sheet, a protective layer at the place where it comes in contact with the surplus length absorbing parts includes a sliding material.
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公开(公告)号：US20240231427A9
公开(公告)日：2024-07-11
申请号：US18457360
申请日：2023-08-29
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Atsushi Ohyama , Yusuke Onoue , Akinori Uchino
CPC classification number: G06F1/1618 , G06F1/1681 , G06F1/203 , H05K5/0226 , H05K7/20472
Abstract: An electronic apparatus includes a first chassis in which a motherboard mounted with a processing device is mounted, a second chassis provided adjacent to the first chassis, a hinge device that relatively rotatably connects the first chassis to the second chassis, an electrical component that is provided in the first chassis and generates heat, a plate-shaped thermal module that is provided in the first chassis and is thermally connected to the electrical component to radiate heat, and a graphite sheet provided to extend from the first chassis to the second chassis. A connection edge portion of the first chassis is made of a heat conductive material, the thermal module is provided with a heat pipe along the connection edge portion, and the graphite sheet is thermally connected to the heat pipe and the connection edge portion by being laminated and interposed therebetween.
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公开(公告)号：US20230121174A1
公开(公告)日：2023-04-20
申请号：US17943429
申请日：2022-09-13
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Atsushi Ohyama , Yusuke Onoue , Takanori Hoshino
Abstract: An electronic apparatus includes: a first chassis equipped with a substrate on which a processing device is mounted; a second chassis which is provided adjacently to the first chassis and equipped with a battery device; a hinge device that connects the first chassis and the second chassis in such a manner as to be rotatable relative to each other between a first posture in which the first chassis and the second chassis are stacked to overlap each other in a surface normal direction and a second posture in which the first chassis and the second chassis are arranged side by side in a direction perpendicular in the surface normal direction; a spine component which is made of a thermally conductive material.
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公开(公告)号：US20240237292A9
公开(公告)日：2024-07-11
申请号：US18459361
申请日：2023-08-31
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Atsushi Ohyama , Yusuke Onoue , Akinori Uchino
CPC classification number: H05K7/20481 , G06F1/203
Abstract: An electronic apparatus includes a CPU provided in a first chassis and generating heat, a plate-shaped vapor chamber provided in the first chassis and thermally connected to the CPU to radiate heat, and two heat pipes protruding and extending from the vapor chamber at positions separated from each other. A graphite sheet that is thinner than the vapor chamber is thermally connected to the two heat pipes. A battery device having three cells is provided in the first chassis, and the heat pipe extends into a groove portion formed between the cells.
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公开(公告)号：US20240138116A1
公开(公告)日：2024-04-25
申请号：US18459361
申请日：2023-08-30
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Atsushi Ohyama , Yusuke Onoue , Akinori Uchino
CPC classification number: H05K7/20481 , G06F1/203
Abstract: An electronic apparatus includes a CPU provided in a first chassis and generating heat, a plate-shaped vapor chamber provided in the first chassis and thermally connected to the CPU to radiate heat, and two heat pipes protruding and extending from the vapor chamber at positions separated from each other. A graphite sheet that is thinner than the vapor chamber is thermally connected to the two heat pipes. A battery device having three cells is provided in the first chassis, and the heat pipe extends into a groove portion formed between the cells.
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