公开(公告)号：US20230245854A1

公开(公告)日：2023-08-03

申请号：US18013736

申请日：2022-02-07

Applicant: LAM RESEARCH CORPORATION

Inventor： Andrea ALBERTI ,  Saravanapriyan SRIRAMAN ,  John DREWERY ,  Alexander Miller PATERSON

IPC: H01J37/32

CPC classification number: H01J37/32119 ,  H01J37/3244 ,  H01J37/32522

Abstract: A dielectric window assembly for a substrate processing system includes a dielectric window, a Faraday shield that is one of adjacent to the dielectric window, embedded within the dielectric window, and arranged in a recess in an upper surface of the dielectric window, and cooling channels arranged within the Faraday shield. The cooling channels are configured to flow coolant throughout the Faraday shield.

公开(公告)号：US20230253217A1

公开(公告)日：2023-08-10

申请号：US18013161

申请日：2021-08-23

Applicant: LAM RESEARCH CORPORATION

Inventor： John DREWERY ,  David INORI ,  Andre DESEPTE ,  Michael Julius KINSLER

IPC: H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67115 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67346

Abstract: A substrate transfer door assembly includes a body, one or more radiating elements, a member, and at least one lifting coupler. The body includes a central portion. At least the central portion of the body operates as a substrate transfer door and covers at least one of an opening of a liner or an opening of a chamber wall of a substrate processing chamber. The one or more radiating elements radiating heat away from the body. The member extends from the body. The at least one lifting coupler is connected to the member and movable in a vertical direction between an open position and a closed position to cover the at least one of the opening of the liner or the opening of the chamber wall with the central portion of the body.

公开(公告)号：US20220199378A1

公开(公告)日：2022-06-23

申请号：US17603636

申请日：2020-04-14

Applicant: LAM RESEARCH CORPORATION

Inventor： John DREWERY

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/46

Abstract: A substrate support assembly to support a semiconductor substrate in a processing chamber includes a baseplate arranged in the processing chamber, a dielectric layer arranged on the baseplate to support the semiconductor substrate, an electrode disposed in the dielectric layer along a horizontal plane, and a plurality of channels to carry a fluid. The plurality of channels are disposed in the dielectric layer along the horizontal plane on a side of the electrode facing away from the baseplate.

公开(公告)号：US20230274919A1

公开(公告)日：2023-08-31

申请号：US18013475

申请日：2021-08-11

Applicant: LAM RESEARCH CORPORATION

Inventor： John DREWERY

IPC: H01J37/32

CPC classification number: H01J37/3299 ,  H01J37/32522 ,  H01J37/32724 ,  H01J37/32935

Abstract: A system for estimating stress on a component of a processing chamber during a process includes a plurality of sensors configured to sense temperatures at a plurality of locations of the component during the process and a controller a controller configured to interpolate the temperatures to estimate a temperature distribution across the component and to estimate the stress on the component during the process. A method of estimating stress on a component of a processing chamber during a process includes sensing temperatures at a plurality of locations of the component during the process, interpolating the temperatures to estimate a temperature distribution across the component, and estimating the stress on the component during the process.

公开(公告)号：US20230178344A1

公开(公告)日：2023-06-08

申请号：US17924618

申请日：2021-05-04

Applicant: LAM RESEARCH CORPORATION

Inventor： John DREWERY ,  Kevin FLYNN ,  Jeremy George SMITH ,  Tom A. KAMP

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J37/32449 ,  H01J2237/002 ,  H01J2237/334 ,  H01J2237/3321

Abstract: A baseplate of a substrate support assembly includes a cavity between an upper region, a lower region, and sidewalls of the baseplate, a plurality of pillars arranged in the cavity between the upper and lower regions, an inlet to supply a liquid to the cavity, and an outlet to vent vapor of the liquid. In another implementation, a baseplate of a substrate support assembly includes a first channel arranged in the baseplate, a second channel arranged above the first channel, a plurality of vertical channels connecting the first channel to the second channel, an inlet to supply a liquid to the first channel, and an outlet to vent vapor of the liquid from the second channel.