公开(公告)号：US20230245854A1

公开(公告)日：2023-08-03

申请号：US18013736

申请日：2022-02-07

Applicant: LAM RESEARCH CORPORATION

Inventor： Andrea ALBERTI ,  Saravanapriyan SRIRAMAN ,  John DREWERY ,  Alexander Miller PATERSON

IPC: H01J37/32

CPC classification number: H01J37/32119 ,  H01J37/3244 ,  H01J37/32522

Abstract: A dielectric window assembly for a substrate processing system includes a dielectric window, a Faraday shield that is one of adjacent to the dielectric window, embedded within the dielectric window, and arranged in a recess in an upper surface of the dielectric window, and cooling channels arranged within the Faraday shield. The cooling channels are configured to flow coolant throughout the Faraday shield.