公开(公告)号：US20150287661A1

公开(公告)日：2015-10-08

申请号：US14677601

申请日：2015-04-02

申请人： Kyocera America Inc

发明人： Mark EBLEN ,  Franklin KIM ,  Chong Il-Park ,  Shinichi HIRA

IPC分类号： H01L23/367 ,  H01L23/00 ,  H01L25/00 ,  H01L21/48 ,  H01L23/373 ,  H01L25/065

CPC分类号： H01L23/3675 ,  H01L21/4871 ,  H01L21/50 ,  H01L23/047 ,  H01L23/10 ,  H01L23/36 ,  H01L23/3736 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/291 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32501 ,  H01L2224/32505 ,  H01L2224/45124 ,  H01L2224/4809 ,  H01L2224/48137 ,  H01L2224/48153 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83801 ,  H01L2224/85399 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/206 ,  H01L2924/2065 ,  H01L2924/30111 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/0665 ,  H01L2924/0105

摘要： An electronics packaging system includes an insulator that electrically insulates a heat sink from electrical leads. An interface between the insulator and the heat sink includes a stress reliever constructed such that a stiffness of the interface is greater than the stiffness of the interface without the stress reliever.

摘要翻译： 电子封装系统包括使散热器与电引线电绝缘的绝缘体。 绝缘体和散热器之间的界面包括应力消除器，其被构造成使得界面的刚度大于没有应力消除器的界面刚度。