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    Vapor chamber
    1.
    发明授权
    Vapor chamber 有权
    蒸气室

    公开(公告)号：US07913748B2

    公开(公告)日：2011-03-29

    申请号：US12128127

    申请日：2008-05-28

    Applicant: Kuo-Len Lin ,  Wen-Jung Liu ,  Chen-Hsiang Lin ,  Chih-Hung Cheng ,  Ju-Tsu Huang

    Inventor： Kuo-Len Lin ,  Wen-Jung Liu ,  Chen-Hsiang Lin ,  Chih-Hung Cheng ,  Ju-Tsu Huang

    IPC: F28D15/00

    CPC classification number: F28D15/0233 ,  F28D15/046 ,  F28D2021/0029 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A vapor chamber includes a plate and a wick structure. The plate is provided therein with a working fluid, and the plate has a heated end and a condensed end. The wick structure includes a first wick portion adhered to be opposite to the heated end, a second wick portion overlapping on the first wick portion, and a third wick portion adhered on the rest portion of a chamber. The aperture diameter of the first wick portion is larger than that of the second wick portion, or the aperture density of the first wick portion is smaller than that of the second wick portion. The amount of working fluid attached to the second wick portion is smaller than that of the first wick portion. After heating, the working fluid attached to the second wick portion is vaporized more quickly.

    Abstract translation: 蒸气室包括板和芯结构。 板中设置有工作流体，并且板具有加热端和冷凝端。 芯体结构包括粘附到加热端的第一芯部，与第一芯部重叠的第二芯部，以及粘附在室的其余部分上的第三芯部。 第一灯芯部分的孔径大于第二灯芯部分的孔径直径，或者第一灯芯部分的孔径密度小于第二灯芯部分的开口密度。 附着到第二芯部的工作流体的量小于第一芯部的工作流体的量。 加热后，连接到第二芯部的工作流体更快地蒸发。

    Heat sink and heat dissipation device having the same
    3.
    发明授权
    Heat sink and heat dissipation device having the same 有权
    散热器和散热装置具有相同的功能

    公开(公告)号：US08132615B2

    公开(公告)日：2012-03-13

    申请号：US12133030

    申请日：2008-06-04

    Applicant: Kuo-Len Lin ,  Wen-Jung Liu ,  Chen-Hsiang Lin

    Inventor： Kuo-Len Lin ,  Wen-Jung Liu ,  Chen-Hsiang Lin

    IPC: F28F7/00

    CPC classification number: H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A heat sink includes a heat dissipation fins assembly, a heat spreader, and a heat pipe. The heat dissipation fins assembly includes a plurality of heat dissipation fins. A guide plate extruding from a bottom of each of the heat dissipation fins. The guide plate being connected to an adjacent heat dissipation fins. The heat dissipation fins are connected in series by the guide plate thereby defining a number of air channels. Each heat dissipation fin includes a through hole defined therein and aligned with each other. The heat spreader is disposed under the heat dissipation fins assembly and a through groove is formed in the heat spreader. A heat pipe passes through the through hole and the through groove. The heat sink has improved heat dissipation efficiency.

    Abstract translation: 散热器包括散热片组件，散热器和热管。 散热片组件包括多个散热片。 从每个散热片的底部挤出的引导板。 引导板连接到相邻的散热片上。 散热片通过引导板串联连接，从而限定多个空气通道。 每个散热片包括限定在其中的通孔并且彼此对准。 散热器布置在散热片组件的下方，并且散热器中形成有通孔。 热管穿过通孔和通孔。 散热器具有改善的散热效率。

    LED lamp tube heat dissipating structure
    4.
    发明授权
    LED lamp tube heat dissipating structure 有权
    LED灯管散热结构

    公开(公告)号：US07815347B2

    公开(公告)日：2010-10-19

    申请号：US12166591

    申请日：2008-07-02

    Applicant: Kuo-Len Lin ,  Chen-Hsiang Lin ,  Wen-Jung Liu ,  Hwai-Ming Wang ,  Ken Hsu ,  Chih-Hung Cheng

    Inventor： Kuo-Len Lin ,  Chen-Hsiang Lin ,  Wen-Jung Liu ,  Hwai-Ming Wang ,  Ken Hsu ,  Chih-Hung Cheng

    IPC: F21V29/02

    CPC classification number: F21V29/83 ,  F21K9/27 ,  F21K9/66 ,  F21S8/04 ,  F21V29/507 ,  F21V29/60 ,  F21Y2105/16 ,  F21Y2115/10

    Abstract: A light emitting diode (LED) lamp tube heat dissipating structure is capable of dissipating heat in a tube quickly to improve the heat dissipating efficiency. A circuit board with a light radiating surface and a heat dissipating surface is contained in the tube, and the light radiating surface of the circuit board is electrically connected to LED lamps. Two conductive bushings are sheathed onto both ends of the tube and electrically connected with the circuit board, and at least one heat dissipating hole is disposed separately on both distal surfaces of the tube that covers the heat dissipating surface of the circuit board, such that external air is entered into the tube from the heat dissipating hole on a distal surface of the tube and dispersed from the heat dissipating hole on another distal surface of the tube for dissipating the heat in the tube.

    Abstract translation: 发光二极管（LED）灯管散热结构能够快速散热管中的热量，从而提高散热效率。 具有光辐射面和散热面的电路板被容纳在管中，并且电路板的光辐射表面电连接到LED灯。 两个导电衬套被套在管的两端并与电路板电连接，并且至少一个散热孔分别设置在管的两个远端表面上，该远端表面覆盖电路板的散热表面，使得外部 空气从管的远端表面上的散热孔进入管中，并从管的另一远端表面上的散热孔分散，以消散管中的热量。

    HEAT SINK AND HEAT DISSIPATION DEVICE HAVING THE SAME
    6.
    发明申请
    HEAT SINK AND HEAT DISSIPATION DEVICE HAVING THE SAME 有权
    具有相同功能的散热器和散热装置

    公开(公告)号：US20090237882A1

    公开(公告)日：2009-09-24

    申请号：US12133030

    申请日：2008-06-04

    Applicant: Kuo-Len Lin ,  Wen-Jung Liu ,  Chen-Hsiang Lin

    Inventor： Kuo-Len Lin ,  Wen-Jung Liu ,  Chen-Hsiang Lin

    IPC: H05K7/20

    CPC classification number: H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A heat sink includes a heat dissipation fins assembly, a heat spreader, and a heat pipe. The heat dissipation fins assembly includes a plurality of heat dissipation fins. A guide plate extruding from a bottom of each of the heat dissipation fins. The guide plate being connected to an adjacent heat dissipation fins. The heat dissipation fins are connected in series by the guide plate thereby defining a number of air channels. Each heat dissipation fin includes a through hole defined therein and aligned with each other. The heat spreader is disposed under the heat dissipation fins assembly and a through groove is formed in the heat spreader. A heat pipe passes through the through hole and the through groove. The heat sink has improved heat dissipation efficiency.

    Abstract translation: 散热器包括散热片组件，散热器和热管。 散热片组件包括多个散热片。 从每个散热片的底部挤出的引导板。 引导板连接到相邻的散热片。 散热片通过引导板串联连接，从而限定多个空气通道。 每个散热片包括限定在其中的通孔并且彼此对准。 散热器布置在散热片组件的下方，并且散热器中形成有通孔。 热管穿过通孔和通孔。 散热器具有改善的散热效率。

    LED LAMP TUBE HEAT DISSIPATING STRUCTURE
    7.
    发明申请
    LED LAMP TUBE HEAT DISSIPATING STRUCTURE 有权
    LED灯管散热结构

    公开(公告)号：US20100002439A1

    公开(公告)日：2010-01-07

    申请号：US12166591

    申请日：2008-07-02

    Applicant: Kuo-Len Lin ,  Chen-Hsiang Lin ,  Wen-Jung Liu ,  Hwai-Ming Wang ,  Ken Hsu ,  Chih-Hung Cheng

    Inventor： Kuo-Len Lin ,  Chen-Hsiang Lin ,  Wen-Jung Liu ,  Hwai-Ming Wang ,  Ken Hsu ,  Chih-Hung Cheng

    IPC: F21V29/00 ,  F21V21/00

    CPC classification number: F21V29/83 ,  F21K9/27 ,  F21K9/66 ,  F21S8/04 ,  F21V29/507 ,  F21V29/60 ,  F21Y2105/16 ,  F21Y2115/10

    Abstract: A light emitting diode (LED) lamp tube heat dissipating structure is capable of dissipating heat in a tube quickly to improve the heat dissipating efficiency. A circuit board with a light radiating surface and a heat dissipating surface is contained in the tube, and the light radiating surface of the circuit board is electrically connected to LED lamps. Two conductive bushings are sheathed onto both ends of the tube and electrically connected with the circuit board, and at least one heat dissipating hole is disposed separately on both distal surfaces of the tube that covers the heat dissipating surface of the circuit board, such that external air is entered into the tube from the heat dissipating hole on a distal surface of the tube and dispersed from the heat dissipating hole on another distal surface of the tube for dissipating the heat in the tube.

    Abstract translation: 发光二极管（LED）灯管散热结构能够快速散热管中的热量，从而提高散热效率。 具有光辐射面和散热面的电路板被容纳在管中，并且电路板的光辐射表面电连接到LED灯。 两个导电衬套被套在管的两端并与电路板电连接，并且至少一个散热孔分别设置在管的两个远端表面上，该远端表面覆盖电路板的散热表面，使得外部 空气从管的远端表面上的散热孔进入管中，并从管的另一远端表面上的散热孔分散，以消散管中的热量。

    VAPOR CHAMBER
    9.
    发明申请
    VAPOR CHAMBER 有权
    蒸气室

    公开(公告)号：US20090294104A1

    公开(公告)日：2009-12-03

    申请号：US12128127

    申请日：2008-05-28

    Applicant: Kuo-Len LIN ,  Wen-Jung Liu ,  Chen-Hsiang Lin ,  Chih-Hung Cheng ,  Ju-Tsu Huang

    Inventor： Kuo-Len LIN ,  Wen-Jung Liu ,  Chen-Hsiang Lin ,  Chih-Hung Cheng ,  Ju-Tsu Huang

    IPC: F28D15/00

    CPC classification number: F28D15/0233 ,  F28D15/046 ,  F28D2021/0029 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A vapor chamber includes a plate and a wick structure. The plate is provided therein with a working fluid, and the plate has a heated end and a condensed end. The wick structure comprises a first wick portion adhered to be opposite to the heated end, a second wick portion overlapping on the first wick portion, and a third wick portion adhered on the rest portion of a chamber. The aperture diameter of the first wick portion is larger than that of the second wick portion, or the aperture density of the first wick portion is smaller than that of the second wick portion. Therefore, the amount of working fluid attached to the second wick portion is smaller than of the first wick portion. As a result, after heated, the working fluid attached to the second wick portion will be vaporized more quickly, thereby increasing the efficiency of heat transfer and improving the heat-dissipating effect.

    Abstract translation: 蒸气室包括板和芯结构。 板中设置有工作流体，并且板具有加热端和冷凝端。 芯结构包括粘附到加热端的第一芯部，与第一芯部重叠的第二芯部，以及粘附在室的其余部分上的第三芯部。 第一灯芯部分的孔径大于第二灯芯部分的孔径直径，或者第一灯芯部分的孔径密度小于第二灯芯部分的开口密度。 因此，附着到第二芯部的工作流体的量比第一芯体部分小。 结果，加热后，附着于第二芯部的工作流体将更快地汽化，从而提高传热效率并提高散热效果。

    Thermal interface material compound and method of fabricating the same
    10.
    发明授权
    Thermal interface material compound and method of fabricating the same 失效
    热界面材料化合物及其制造方法

    公开(公告)号：US07445727B2

    公开(公告)日：2008-11-04

    申请号：US11530096

    申请日：2006-09-08

    Applicant: Kuo-Len Lin ,  Tien-Chih Tseng ,  Ming-Chang Liu ,  Wen-Jung Liu

    Inventor： Kuo-Len Lin ,  Tien-Chih Tseng ,  Ming-Chang Liu ,  Wen-Jung Liu

    IPC: C09K5/00

    CPC classification number: C09K5/14 ,  Y10T428/25 ,  Y10T428/26 ,  Y10T428/263

    Abstract: A high thermal conductivity thermal interface material compound includes 53% by weight of polyethylene glycol, 42% by weight of silicon carbide, and 5% by weight of lithium ions. The method of fabricating the thermal interface material includes the steps of: filling the above-described compound in a container and blending them to form aggregative compound by a blender; mixing the compound by a rolling machine to disperse the aggregative compound and filling the compound to another container; blending the compound and breaking the air bubble generated thereof, and pumping the air out of the container by a vacuum pump at the same time, to fabricate the high thermal conductivity thermal interface material compound without air bubbles.

    Abstract translation: 高导热性热界面材料化合物包括53重量％的聚乙二醇，42重量％的碳化硅和5重量％的锂离子。 制造热界面材料的方法包括以下步骤：将上述化合物填充在容器中并通过混合器混合形成聚集化合物; 通过轧制机混合化合物以分散聚集化合物并将化合物填充到另一容器中; 混合化合物并破坏其产生的气泡，同时通过真空泵将空气泵出容器，以制造高气体导热系数的热界面材料，而无气泡。

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