公开(公告)号：US20230274916A1

公开(公告)日：2023-08-31

申请号：US18181620

申请日：2023-03-10

Applicant: Kokusai Electric Corporation

Inventor： Takayuki SATO ,  Tetsuaki INADA ,  Kenta SASAKI

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01J37/32513 ,  H01L21/67017 ,  H01L21/67115 ,  H01L21/0223 ,  H01J2237/2001 ,  H01J2237/338

Abstract: According to one aspect of the technique of the present disclosure, there is provided a seal structure capable of sealing a space between a first structure heated by a heater and a second structure arranged so as to face the first structure, the seal structure including: a metal plate arranged in contact with the first structure; and a sealing material made of a resin material and arranged in contact with the metal plate and the second structure, wherein the space between the first structure and the second structure is sealed by the metal plate and the sealing material.

公开(公告)号：US20220005678A1

公开(公告)日：2022-01-06

申请号：US17475407

申请日：2021-09-15

Applicant: KOKUSAI ELECTRIC CORPORATION

Inventor： Tetsuaki INADA ,  Takeshi YASUI

IPC: H01J37/32 ,  H01L21/02 ,  C23C8/12

Abstract: Described herein is a technique capable of improving a heating efficiency for a substrate to be heated by a heater. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process vessel defining a process chamber; a process gas supplier configured to supply a process gas into the process vessel; an electromagnetic field generation electrode extending along an outer peripheral surface of the process vessel while being spaced apart from the outer peripheral surface of the process vessel and configured to generate an electromagnetic field in the process vessel by being supplied with a high frequency power; a heater configured to radiate an infrared light to heat a substrate accommodated in the process chamber; and a reflector provided between the process vessel and the electromagnetic field generation electrode and configured to reflect the infrared light radiated from the heater.

公开(公告)号：US20200347498A1

公开(公告)日：2020-11-05

申请号：US16933009

申请日：2020-07-20

Applicant: KOKUSAI ELECTRIC CORPORATION

Inventor： Tetsuaki INADA ,  Hideto TATENO

IPC: C23C16/44 ,  C23C16/52 ,  H01L21/02

Abstract: A technique capable of exhausting a process gas in a wide pressure range includes a substrate processing apparatus including: a process chamber; a gas supply system configured to supply a process gas containing a compound capable of reacting with a metal; and a gas exhaust system configured to exhaust an inner atmosphere of the process chamber, wherein the gas exhaust system includes: a common exhaust piping; a first exhaust piping made of a resin incapable of reacting with the compound and whose one end is connected to the common exhaust piping via a first valve and the other end is connected to a first exhauster; and a second exhaust piping made of the metal and whose one end is connected to the common exhaust piping via a second valve and the other end is connected to a second exhauster.

公开(公告)号：US20230245869A1

公开(公告)日：2023-08-03

申请号：US18087216

申请日：2022-12-22

Applicant: Kokusai Electric Corporation

Inventor： Tetsuaki INADA ,  Takeshi YASUI

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J2237/20235 ,  H01J2237/338 ,  H01L21/02164

Abstract: According to the present disclosure, there is provided a technique capable of efficiently heating a substrate with a light emitted from a lamp heater. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process vessel at least a part of which is made of opaque quartz; a substrate mounting table provided in the process vessel or in a processing space communicating with an inside of the process vessel; a lamp heater provided at a position facing a substrate placing surface of the substrate mounting table; and a plasma generator provided at an outer periphery of the process vessel and configured to excite a gas in the process vessel by a plasma.

公开(公告)号：US20230212753A1

公开(公告)日：2023-07-06

申请号：US18182862

申请日：2023-03-13

Applicant: Kokusai Electric Corporation

Inventor： Tetsuaki INADA ,  Junya KONISHI ,  Masaki MUROBAYASHI ,  Takeshi YASUI ,  Takeo SATO

IPC: C23C16/52 ,  C23C16/04 ,  H01J37/32

CPC classification number: C23C16/52 ,  C23C16/045 ,  H01J37/32449 ,  H01J37/32834 ,  H01L21/02164

Abstract: According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process vessel in which a substrate is processed; an outer vessel configured to cover an outer circumference of the process vessel; a gas flow path provided between the outer vessel and the outer circumference of the process vessel; an exhaust path in communication with the gas flow path; an adjusting valve configured to be capable of adjusting a conductance of the exhaust path; a first exhaust apparatus provided on the exhaust path downstream of the adjusting valve; a pressure sensor configured to measure an inner pressure of the outer vessel; and a controller configured to be capable of adjusting an exhaust volume flow rate of the first exhaust apparatus by controlling the first exhaust apparatus based on a pressure measured by the pressure sensor.

公开(公告)号：US20230207277A1

公开(公告)日：2023-06-29

申请号：US18172081

申请日：2023-02-21

Applicant: Kokusai Electric Corporation

Inventor： Tetsuaki INADA ,  Takayuki Sato

IPC: H01J37/32

CPC classification number: H01J37/32449 ,  H01J37/3211

Abstract: According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process vessel constituting a process chamber; a first gas supplier provided with a first supply port through which a first process gas is supplied; a second gas supplier provided with a second supply port through which a second process gas is supplied; a plasma generator provided along an outer circumference of the process vessel and configured to be capable of plasma-exciting the first process gas supplied into the process chamber; and a substrate mounting table on which a substrate is placed. The second supply port is provided at a supply pipe extending downward from a position in a ceiling surface of the process chamber located closer to a radial center of the process vessel than the first supply port, and is provided below the first supply port.

公开(公告)号：US20230002892A1

公开(公告)日：2023-01-05

申请号：US17941446

申请日：2022-09-09

Applicant: Kokusai Electric Corporation

Inventor： Naofumi OHASHI ,  Tetsuaki INADA

IPC: C23C16/44 ,  H01L21/67 ,  H01L21/687 ,  C23C16/458 ,  C23C16/34

Abstract: Described herein is a technique capable of suppressing generation of particles by removing by-products in a groove of a high aspect ratio. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; and a substrate support provided in the process chamber and including a plurality of supports where the substrate is placed, wherein the process chamber includes a process region where a process gas is supplied to the substrate and a purge region where the process gas above the substrate is purged, and the purge region includes a first pressure purge region to be purged at a first pressure and a second pressure purge region to be purged at a second pressure higher than the first pressure.

公开(公告)号：US20220230846A1

公开(公告)日：2022-07-21

申请号：US17576216

申请日：2022-01-14

Applicant: KOKUSAI ELECTRIC CORPORATION

Inventor： Takeshi YASUI ,  Tetsuaki INADA ,  Masaki MUROBAYASHI

IPC: H01J37/32 ,  C23C16/52 ,  H01L21/308 ,  H01L21/67

Abstract: There is included a process container; a gas supply system; and a coil provided with a section between a first grounding point and a second grounding point of the coil so as to be spirally wound a plurality of times along an outer periphery of the process container, wherein the coil is configured so that a coil separation distance, which is a distance from an inner periphery of the coil to an inner periphery of the process container, in a partial section of a first winding section, which is a section where the coil winds once along the outer periphery of the process container in a direction from the first grounding point toward the second grounding point, is longer than a coil separation distance in another partial section of the first winding section continuous with the partial section of the first winding section.

公开(公告)号：US20190186000A1

公开(公告)日：2019-06-20

申请号：US16269319

申请日：2019-02-06

Applicant: KOKUSAI ELECTRIC CORPORATION

Inventor： Tetsuaki INADA ,  Takuya JODA ,  Daisuke HARA

IPC: C23C16/44 ,  H01L21/67 ,  H01L21/673 ,  C23C16/40 ,  C23C16/458

CPC classification number: C23C16/4404 ,  C23C16/406 ,  C23C16/44 ,  C23C16/4412 ,  C23C16/4586 ,  H01L21/31 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/67309

Abstract: There is provided a substrate processing apparatus including a process chamber in which a substrate is accommodated, a processing gas supply system configured to introduce a processing gas containing hydrogen peroxide into the process chamber and an exhaust system configured to exhaust an interior of the process chamber, wherein at least one selected from the group of the process chamber, the processing gas supply system, and the exhaust system includes a metal member, the metal member exposed to the processing gas or a liquid generated by liquefying the processing gas is made of a material containing an iron element, and a surface of a plane of the metal members, which is exposed to the processing gas or the liquid, is formed of a layer containing iron oxide which is formed by performing a baking process on the metal member.

公开(公告)号：US20250014930A1

公开(公告)日：2025-01-09

申请号：US18894486

申请日：2024-09-24

Applicant: KOKUSAI ELECTRIC CORPORATION

Inventor： Tsukasa KAMAKURA ,  Tetsuaki INADA

IPC: H01L21/677 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: Provided is a technique including: a first container mover capable of moving a container; a second container mover disposed at a position different from the first container mover and capable of moving the container; a plurality of process modules capable of processing a substrate in the container; a substrate carrier disposed between the first container mover and the second container mover, configured to be communicable with the plurality of process modules, and capable of carrying the substrate; a substrate carry robot provided in the substrate carrier and capable of carrying the substrate to the process module; a third container mover disposed between the first container mover and the second container mover, and capable of moving the container from the first container mover to the second container mover; and a controller.