公开(公告)号：US20220415700A1

公开(公告)日：2022-12-29

申请号：US17903499

申请日：2022-09-06

Applicant: Kokusai Electric Corporation

Inventor： Takayuki SATO ,  Masaki MUROBAYASHI ,  Yuichiro TAKESHIMA ,  Tomokazu WAKUI

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is accommodated; a substrate mounting table provided in the process chamber and heated by a heater; and a substrate mounting table cover arranged on an upper surface of the substrate mounting table and configured such that the substrate is placed on an upper surface of the substrate mounting table cover, wherein the substrate mounting table cover is made of silicon carbide and is provided with a silicon oxide layer of a first thickness at least on the upper surface of the substrate mounting table cover where the substrate is placed.

公开(公告)号：US20230274916A1

公开(公告)日：2023-08-31

申请号：US18181620

申请日：2023-03-10

Applicant: Kokusai Electric Corporation

Inventor： Takayuki SATO ,  Tetsuaki INADA ,  Kenta SASAKI

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01J37/32513 ,  H01L21/67017 ,  H01L21/67115 ,  H01L21/0223 ,  H01J2237/2001 ,  H01J2237/338

Abstract: According to one aspect of the technique of the present disclosure, there is provided a seal structure capable of sealing a space between a first structure heated by a heater and a second structure arranged so as to face the first structure, the seal structure including: a metal plate arranged in contact with the first structure; and a sealing material made of a resin material and arranged in contact with the metal plate and the second structure, wherein the space between the first structure and the second structure is sealed by the metal plate and the sealing material.

公开(公告)号：US20180374740A1

公开(公告)日：2018-12-27

申请号：US16117328

申请日：2018-08-30

Applicant: Kokusai Electric Corporation

Inventor： Takayuki SATO ,  Naoya MATSUURA

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: Described herein is a technique capable of preventing a susceptor made of quartz from being damaged by contacting a reflector deformed by thermal expansion. A substrate support according to the technique may include an upper susceptor made of quartz; a lower susceptor made of quartz; and a reflector reflecting heat and made of a metal in a planar shape. A lower surface of the upper susceptor is bonded with an upper surface of the lower susceptor such that the reflector is interposed therebetween, a first recess accommodating the reflector is provided at the upper surface of the lower susceptor, and a portion of the lower surface of the upper susceptor facing the first recess is roughened.