摘要:
The present invention provides a seasoning processing system capable of uniform seasoning and, moreover, having superior cleanability. A seasoning processing system (2) according to the present invention comprises a seasoning dispersion apparatus (20) and a vertical pillow-type bag manufacturing and packaging apparatus (30). The seasoning dispersion apparatus (20) disperses powdered seasoning to be adhered to supplied intermediate articles (X . . . X) from an end part (22b), which is a dispersing mouth, of a second conduit (22). The vertical pillow-type bag manufacturing and packaging apparatus (30) introduces and packages inside a bag shaped packaging material (Fc) seasoned articles (X2. . . X2) to which the powdered seasoning has been adhered. Furthermore, the end part (22b), which is the dispersing mouth,of the second conduit (22) is provided and arranged so that it is positioned inside the bag shaped packaging material (Fc). A first electrical charging mechanism is provided to charge the seasoning with a polarity and a second electrical charging mechanism is provided to a transverse sealing mechanism of the packaging material to charge the packaging material with the same polarity as the seasoning. In this manner the seasoning and the packaging material repel each other during the sealing operation.
摘要:
The present invention provides a seasoning processing system capable of uniform seasoning and, moreover, having superior cleanability. A seasoning processing system (2) according to the present invention comprises a seasoning dispersion apparatus (20) and a vertical pillow-type bag manufacturing and packaging apparatus (30). The seasoning dispersion apparatus (20) disperses powdered seasoning to be adhered to supplied intermediate articles (X . . . X) from an end part (22b), which is a dispersing mouth, of a second conduit (22). The vertical pillow-type bag manufacturing and packaging apparatus (30) introduces and packages inside a bag shaped packaging material (Fc) seasoned articles (X2 . . . X2) to which the powdered seasoning has been adhered. Furthermore, the end part (22b), which is the dispersing mouth, of the second conduit (22) is provided and arranged so that it is positioned inside the bag shaped packaging material (Fc).
摘要:
An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.
摘要:
The present invention provides a pressure-sensitive adhesion sheet being excellent in moisture and heat resistance and having a high adhesion to inorganic materials such as glass and tile, particularly a high adhesion even under high temperature and high humidity conditions, without using a silane coupling agent. The pressure-sensitive adhesion sheet for a silicone oxide-containing material comprises a base material having formed on at least one surface thereof a layer composed of an acrylic pressure-sensitive adhesive, wherein the base material is selected from a foamed base material having a water absorption rate less than 15% by weight after having been immersed in warm water having a temperature of 40° C. for 24 hours and a plastic film having a water vapor permeability of 500 g or less/m2/24 hours, and the acrylic pressure-sensitive adhesive to be used in combination with the base material selected is specified.
摘要翻译:本发明提供一种耐湿性和耐热性优异且对玻璃和瓦片等无机材料附着性高的粘合片,即使在高温高湿条件下也具有高附着力,而不使用硅烷偶联剂 。 用于含氧化硅氧化物的材料的压敏粘合片包括在其至少一个表面上形成由丙烯酸类压敏粘合剂构成的层的基材,其中所述基材选自具有水的发泡基材 浸渍在温度为40℃的温水中24小时后的吸收率小于15重量%,水蒸气透过度为500g / m 2 / m 2/24小时的塑料膜,丙烯酸压力 规定与所选择的基材组合使用的敏感粘合剂。
摘要:
The present invention provides a heat-conductive and pressure-sensitive adhesive sheet comprising an electrical insulating plastic film having formed on one or both of the surfaces thereof (1) at least one thin layer composed of an inorganic material selected from the group consisting of ceramics, metals and metal oxides other than ceramics, and (2) a pressure-sensitive adhesive composition layer formed on the thin layer. The heat-conductive and pressure-sensitive adhesive sheet is excellent in heat-conductivity and pressure-sensitivity, results in no trouble such as complicated procedures in the production process or worsened working environment, exhibits good adhesion between the base material and the pressure-sensitive adhesive composition layer, scarcely undergoes anchoring fracture between the base material even after allowing to stand at high temperatures for a long time, and has good heat resistance.
摘要:
An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.
摘要:
Adhesive sheets using an acrylic pressure-sensitive flame-retardant adhesive having excellent properties such as adhesive force and holding power at high temperature and also having a self fire-extinguishing property which instantaneously extinguishes fire, i.e., a flame-retardance, are provided. A photopolymerizable composition comprising a) 100 parts by weight of a monomer (or the oligomer thereof) comprising 70 to 100% by weight of a (meth)acrylic acid alkyl ester having on the average a carbon number of 2 to 14 in the alkyl group and 30 to 0% by weight of a monoethylenically unsaturated monomer copolymerizable with the ester, b) 0.02 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, c) 0.01 to 5 parts by weight of a photopolymerization initiator, and d) 10 to 180 parts by weight of a flame retardant having a melting point of at least 60° C. is prepared, a pressure-sensitive flame-retardant adhesive is prepared from the photopolymerized product of the composition, and the adhesive is formed on one or both surfaces of a substrate.
摘要:
An adhesive sheet (2) in which heat-conductive and pressure-sensitive adhesive layers (22, 23) which comprise a) a copolymer of a monomer mixture containing main monomers comprising as main component an alkyl (meth)acrylate carrying an alkyl group having from 2 to 14 carbon atoms on average and from 1 to 30% by weight, based on the above main monomers, of a polar monomer having a glass transition point, as a homo-polymer, of ° C. or lower; and b) from 10 to 300 parts by weight, per 100 parts by weight of the copolymer, of a heat-conductive filler are formed on both surfaces of a heat-conductive base material (21) is inserted between an electronic part (1) and a heat-radiating member (3) to thereby adhere and fix the heat-radiating member (3) to the electronic part (1) while providing a high heat-conductivity with the heat-conductive and pressure-sensitive adhesive layers (22, 23).
摘要:
A photopolymerized acrylic pressure-sensitive adhesive having excellent heat-resistance, an adhesive sheet using the adhesive, and methods for producing the adhesive and the adhesive sheet, are disclosed. The pressure-sensitive adhesive sheet having excellent heat resistance comprising a photopolymerization product of a composition comprising;a) 100 parts by weight of monomers comprising from 70 to 100% by weight of a (meth)acrylic acid alkyl ester having from 2 to 14 carbon atoms in the alkyl moiety, and from 30 to 0% by weight of a monoethylenically unsaturated monomer copolymerizable with the (meth)acrylic acid alkyl ester,b) from 0.02 to 20 parts by weight of a radical chain inhibitor,c) up to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, andd) from 0.01 to 5 parts by weight of a photopolymerization initiator.
摘要:
The present invention has an object to provide a technology capable of reducing consumption current of a bag making and packaging machine making a bag and packaging a product with the bag. In order to accomplish the object, the bag making and packaging machine is provided with a seal jaw sealing a film to be packaging material, a heater part (201F) heating the seal jaw, and a heater driving part (260) driving the heater part (201F). Further, the bag making and packaging machine is provided with a motor driving part (270) to be a regenerative current supplying part supplying regenerative current generated in a motor to the heater part (201F).