摘要:
A micro-mirror for deflecting an incident light is disclosed, wherein the micro-mirror comprises: a mirror section for reflecting an incident light issued from a laser diode; a hinge section including a fixed section and a movable section each having a flat surface; and a drive section having a bi-morph structure made of two or more of materials having different heat expansion coefficient for deflecting said mirror section to change relative angle to said incident light.
摘要:
A micro-mirror for deflecting an incident light is disclosed, wherein the micro-mirror comprises: a mirror section for reflecting an incident light issued from a laser diode; a hinge section including a fixed section and a movable section each having a flat surface; and a drive section having a bi-morph structure made of two or more of materials having different heat expansion coefficient for deflecting said mirror section to change relative angle to said incident light.
摘要:
A micro-mirror for deflecting an incident light is disclosed, wherein the micro-mirror comprises: a mirror section for reflecting an incident light issued from a laser diode; a hinge section including a fixed section and a movable section each having a flat surface; and a drive section having a bi-morph structure made of two or more of materials having different heat expansion coefficient for deflecting said mirror section to change relative angle to said incident light.
摘要:
If a semiconductor device employing semiconductor light-receiving elements is disposed on a single optical axis, laser light which is incident on these light-receiving elements is interrupted by the semiconductor device, and it will be impossible to confirm as a whole that the alignment of a multiplicity of components disposed over a distance has been correctly adjusted. This problem is overcome by using a semiconductor light-receiving element with a structure which absorbs only some of a received laser light beam and which allows the greater part of the beam to be transmitted to its rear face.
摘要:
A system for locating a vehicle may include a hand-held device and a communication device on-board the vehicle. The hand-held device may include a screen, and may be adapted to import a map and display a present location of the hand-held device on the map. The communication device on-board the vehicle may be adapted to communicate a present location of the vehicle to the hand-held device. The hand-held device may be capable of displaying the location of the vehicle and the location of the hand-held device on the map at the same time.
摘要:
A system for locating a vehicle may include a hand-held device and a communication device on-board the vehicle. The hand-held device may include a screen, and may be adapted to import a map and display a present location of the hand-held device on the map. The communication device on-board the vehicle may be adapted to communicate a present location of the vehicle to the hand-held device. The hand-held device may be capable of displaying the location of the vehicle and the location of the hand-held device on the map at the same time.
摘要:
A process for producing a semi-solidified slurry of an iron alloy including the steps of pouring a melt of an iron alloy into a semi-solidified slurry producing vessel 30 and cooling the melt therein to obtain a semi-solidified slurry having a crystallized solid phase and a residual liquid phase, wherein a hypereutectoid or hypoeutectic cast iron composition containing 0.8-4.3 wt. % C is used as a material, a melt of the composition is poured into the semi-solidified slurry producing vessel in a predetermined amount at a time, a temperature of the melt when poured into the semi-solidified slurry producing vessel is controlled to be not lower than a crystallization initiation temperature of the composition and not greater than a temperature that is 50° C. higher than the crystallization initiation temperature, and a cooling rate of the melt poured into the semi-solidified slurry producing vessel is controlled not to exceed 20° C. per minute.
摘要:
The invention can provide a miniaturized noise filter. The noise filter for reducing noise comprises a coil with a conductive wire (2) wound around a core (1); a case (6) formed of an insulating material receiving the coil; a bracket (8) of a magnetic material forming a flux path of magnetic flux generated from the coil, which places the case thereon, which has a pair of end plates (12a, 12b) disposed opposite to both ends of the core of the coil respectively through a gap of a predetermined distance, and which has a bottom plate (8a) disposed between the pair of the end plates; and an input/output terminal (3a, 3b) for the coil.
摘要:
A compound represented by the formula (I): wherein R1 is an oxo group, ═N—R or the like; a group represented by the formula: is a group represented by the formula: R2 is a group represented by the formula: R3 and R4 are each H, or C1-C6 alkyl, C3-C6 cycloalkyl, C1-C6 alkoxy, C1-C6 alkylamino, di(C1-C6)alkylamino or C1-C6 alkylthio, each of which is optionally substituted; and R5 is H, or C1-C6 alkyl, C2-C6 alkenyl, cyclic group, each of which is optionally substituted, —CO—R8 or —O—R8′, or a salt thereof. The compound of the present invention is useful as a drug for the prophylaxis or treatment of circulatory diseases, metabolic diseases and/or central nervous system diseases.
摘要:
An electron beam drawing process of high throughput, coping with the changes in static distortion and dynamic distortion of a lower layer exposure apparatus or an optical reduction exposure apparatus. At least two marks formed in each chip formed on a wafer are detected for a predetermined number of chips, and the relation between the shape distortion of each chip in the wafer plane and the wafer coordinates is determined from the positions of the detected marks and the designed positions of the marks by a statistical processing. Patterns are drawn in all chips while correcting the patterns to be drawn on the individual chips, by using the relation between the determined chip shape distortion and the wafer coordinates. As a result, the superposition exposure with the lower layer can be with a high throughput and with a high accuracy without any manual adjustment.