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公开(公告)号：US20180280175A1
公开(公告)日：2018-10-04
申请号：US15763877
申请日：2016-09-28
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Charles Frederik Sio , Maarten Petrus Joseph Kuenen , Marc Andre de Samber , Murtaza Bulut
IPC: A61F4/00 , A61B5/16 , A61B5/1171 , A61B5/11 , G05B19/042
Abstract: A device for providing assistance to a person comprises a data input for obtaining person related data representing data obtained by monitoring the person, a data processing unit for processing the obtained person related data to determine the person's mental state and/or cognitive level from the obtained person related data, to detect if the person has limited or no ability to perform a desired task and to generate assistance data in case of detection that the person has limited or no ability to perform the desired task and/or if the person's current mental state and/or cognitive level is below a threshold or out of a distribution or value range required to perform the desired task, said assistance data representing data directed to supporting the person in performing the desired task by adapting the number of functions of an appliance accessible and controllable by the person according to the person's current mental state and/or cognitive level, and a data output for providing said assistance data for supporting the person in performing the desired task.
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公开(公告)号：US09871167B2
公开(公告)日：2018-01-16
申请号：US14783780
申请日：2014-03-31
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Brendan Jude Moran , Marc Andre de Samber , Grigoriy Basin , Norbertus Antonius Maria Sweegers , Mark Melvin Butterworth , Kenneth Vampola , Clarisse Mazuir
IPC: H01L33/46 , H01L25/075 , H01L33/20 , H01L33/44 , H01L33/06 , H01L33/32 , H01L33/50 , H01L33/56 , H01L33/62 , H01L33/00
CPC classification number: H01L33/20 , H01L25/0753 , H01L33/007 , H01L33/0079 , H01L33/0095 , H01L33/06 , H01L33/32 , H01L33/44 , H01L33/46 , H01L33/465 , H01L33/502 , H01L33/56 , H01L33/62 , H01L2933/0025 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2933/0091
Abstract: Embodiments of the invention include a semiconductor structure including a light emitting layer sandwiched between an n-type region and a p-type region. A growth substrate is attached to the semiconductor structure. The growth substrate has at least one angled sidewall. A reflective layer is disposed on the angled sidewall. A majority of light extracted from the semiconductor structure and the growth substrate is extracted through a first surface of the growth substrate.
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公开(公告)号：US20170256690A1
公开(公告)日：2017-09-07
申请号：US15506663
申请日：2015-08-26
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Floris Maria Hermansz Crompvoets , Benno Spinger , Pascal Bloemen , Norbertus Antonius Maria Sweegers , Marc Andre de Samber
CPC classification number: H01L33/60 , H01L33/46 , H01L33/502 , H01L33/58 , H01L51/5271 , H01L2933/0025 , H01L2933/0058
Abstract: There is proposed a light source comprising: a semiconductor diode structure adapted to generate light; and an optical enhancement section above the semiconductor diode structure and adapted to output light from the semiconductor diode structure. A partially-reflective layer covers at least a portion of the top of the optical enhancement section and is adapted to reflect a portion of the output light towards the optical enhancement section. The partially-reflective layer has a light transmittance characteristic that varies laterally.
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公开(公告)号：US09991238B2
公开(公告)日：2018-06-05
申请号：US15325693
申请日：2015-07-17
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Floris Maria Hermansz Crompvoets , Norbertus Antonius Maria Sweegers , Hugo Johan Cornelissen , Marc Andre de Samber
IPC: H01L31/00 , H01L25/075 , H01L33/60 , F21V8/00
CPC classification number: H01L25/0756 , F21Y2107/60 , G02B6/0006 , G02B6/0008 , G02B6/08 , H01L25/0753 , H01L33/60 , H01L2924/0002 , H01L2924/00
Abstract: Proposed is a light source comprising first and second LED light sources. Each of the first and second LED light sources have: a semiconductor diode structure adapted to generate light; and a light output section above the semiconductor diode structure adapted to output light from the semiconductor diode structure in a light output direction, the area of the light output section being less than the area of the semiconductor diode structure. The second LED light source is arranged above and at least partially overlapping the first LED light source with non-aligned light output sections with respect to the light output direction.
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公开(公告)号：US20160133801A1
公开(公告)日：2016-05-12
申请号：US14996192
申请日：2016-01-14
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Marc Andre de Samber
CPC classification number: H01L33/502 , H01L25/0753 , H01L33/06 , H01L33/32 , H01L33/50 , H01L33/507 , H01L33/52 , H01L33/56 , H01L33/60 , H01L2224/16 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
Abstract: A relatively large substrate has a reflective surface, such as a diffusive white surface. LED dies, either as bare LED dies or packaged LED dies, are mounted to the substrate to form separate arrays of LEDs. Each array is intended for a separate mixing chamber. A layer of an encapsulant, such as silicone, is deposited over the substrate to encapsulate the LED dies. A laser etches through the encapsulant to form slots, and a reflective material, such as a white paint, is deposited in the slots to form reflective walls of each mixing chamber. If desired, a phosphor layer is deposited over the encapsulant and reflective walls. The substrate is then singulated to separate out the mixing chambers. Since no discrete parts are assembled, and multiple mixing chambers are formed simultaneously, the resulting mixing chambers are inexpensive and very reliable.
Abstract translation: 相对较大的衬底具有反射表面，例如漫射的白色表面。 无论是裸LED还是封装的LED芯片，LED芯片都安装到基板上以形成独立的LED阵列。 每个阵列用于单独的混合室。 将诸如硅树脂的密封剂层沉积在衬底上以封装LED管芯。 激光器通过密封剂蚀刻以形成槽，并且诸如白色涂料的反射材料沉积在槽中以形成每个混合室的反射壁。 如果需要，在密封剂和反射壁上沉积磷光体层。 然后将衬底分离以分离出混合室。 由于没有组装分立的部件，并且同时形成多个混合室，所以产生的混合室便宜并且非常可靠。
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Patent Agency Ranking
6.发明授权公开(公告)号：US09812612B2
公开(公告)日：2017-11-07
申请号：US15036879
申请日：2014-11-06
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Sander Petrus Martinus Noijen , Roy Antoin Bastiaan Engelen , Norbertus Antonius Maria Sweegers , Marc Andre de Samber
Abstract: A solid state light emitting device includes a light emitting stack (20), a metallization (30), comprising a guard layer (36) of metal, and a dielectric layer (50) over the guard layer (36) of the metallization. During subsequent processing delamination and/or cracking may occur at the edges of the devices, sometimes referred to as die edge defects. To address these defects a plurality of stress-relief elements (62, 64) and/or anchor elements may be provided in an edge region of the metallization and/or dielectric layer for reducing delamination. The stress-relief elements (62, 64) are formed by regions of reduced thickness or increased thickness in the guard layer (36).
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7.发明申请公开(公告)号：US20160329467A1
公开(公告)日：2016-11-10
申请号：US15036879
申请日：2014-11-06
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Sander Petrus Martinus Noijen , Roy Antoin Bastiaan Engelen , Norbertus Antonius Maria Sweegers , Marc Andre de Samber
CPC classification number: H01L33/38 , H01L33/0095 , H01L33/382 , H01L33/387 , H01L2933/0016
Abstract: A solid state light emitting device includes a light emitting stack (20), a metallization (30), comprising a guard layer (36) of metal, and a dielectric layer (50) over the guard layer (36) of the metallization. During subsequent processing delamination and/or cracking may occur at the edges of the devices, sometimes referred to as die edge defects. To address these defects a plurality of stress-relief elements (62, 64) and/or anchor elements may be provided in an edge region of the metallization and/or dielectric layer for reducing delamination. The stress-relief elements (62, 64) are formed by regions of reduced thickness or increased thickness in the guard layer (36).
Abstract translation: 固态发光器件包括发光层（20），金属化层（30），其包括金属的保护层（36）和位于金属化层的保护层（36）之上的介电层（50）。 在随后的处理期间，在器件的边缘处可能发生分层和/或破裂，有时称为管芯边缘缺陷。 为了解决这些缺陷，可以在金属化和/或电介质层的边缘区域中提供多个应力消除元件（62,64）和/或锚定元件，以减少分层。 应力消除元件（62,64）由保护层（36）中厚度减小或厚度增加的区域形成。
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公开(公告)号：US09391246B2
公开(公告)日：2016-07-12
申请号：US14996192
申请日：2016-01-14
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Marc Andre de Samber
CPC classification number: H01L33/502 , H01L25/0753 , H01L33/06 , H01L33/32 , H01L33/50 , H01L33/507 , H01L33/52 , H01L33/56 , H01L33/60 , H01L2224/16 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
Abstract: A relatively large substrate has a reflective surface, such as a diffusive white surface. LED dies, either as bare LED dies or packaged LED dies, are mounted to the substrate to form separate arrays of LEDs. Each array is intended for a separate mixing chamber. A layer of an encapsulant, such as silicone, is deposited over the substrate to encapsulate the LED dies. A laser etches through the encapsulant to form slots, and a reflective material, such as a white paint, is deposited in the slots to form reflective walls of each mixing chamber. If desired, a phosphor layer is deposited over the encapsulant and reflective walls. The substrate is then singulated to separate out the mixing chambers. Since no discrete parts are assembled, and multiple mixing chambers are formed simultaneously, the resulting mixing chambers are inexpensive and very reliable.
Abstract translation: 相对较大的衬底具有反射表面，例如漫射的白色表面。 无论是裸LED还是封装的LED芯片，LED芯片都安装到基板上以形成独立的LED阵列。 每个阵列用于单独的混合室。 将诸如硅树脂的密封剂层沉积在衬底上以封装LED管芯。 激光器通过密封剂蚀刻以形成槽，并且诸如白色涂料的反射材料沉积在槽中以形成每个混合室的反射壁。 如果需要，在密封剂和反射壁上沉积磷光体层。 然后将衬底分离以分离出混合室。 由于没有组装分立的部件，并且同时形成多个混合室，所以产生的混合室便宜并且非常可靠。
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公开(公告)号：US10211187B2
公开(公告)日：2019-02-19
申请号：US15326484
申请日：2015-07-18
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Floris Maria Hermansz Crompvoets , Norbertus Antonius Maria Sweegers , Hugo Johan Cornelissen , Marc Andre de Samber
IPC: H01L25/075 , H01L33/46 , H01L33/50 , H01L33/60 , F21K9/90 , H01L33/58 , F21Y115/10
Abstract: A light source includes first and second semiconductor diode structures adapted to generate light, a light output section at least partially overlapping both of the first and the second semiconductor diode structures and being adapted to output light from the first and the second semiconductor diode structures, and a light reflecting structure at least partially enclosing side surfaces of the first and the second semiconductor diode structures and the light output section and being adapted to reflect light from the first and the second semiconductor diode structures towards the light output section. The area of the light output section is less than the combined area of the first and the second semiconductor diode structures.
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公开(公告)号：US20170207202A1
公开(公告)日：2017-07-20
申请号：US15326484
申请日：2015-07-18
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Floris Maria Hermansz Crompvoets , Norbertus Antonius Maria Sweegers , Hugo Johan Cornelissen , Marc Andre de Samber
IPC: H01L25/075 , F21K9/90 , H01L33/46 , H01L33/50 , H01L33/60
CPC classification number: H01L25/0753 , F21K9/90 , F21Y2115/10 , H01L33/46 , H01L33/504 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0025 , H01L2933/0058 , H01L2924/00
Abstract: Proposed is a light source comprising: first and second semiconductor diode structures adapted to generate light, the first and second semiconductor diode structures being laterally adjacent to each other; a light output section at least partially overlapping both of the first and second semiconductor diode structures and adapted to output light from the first and second semiconductor diode structures; and a light reflecting structure at least partially enclosing side surfaces of the first and second semiconductor diode structures and the light output section and adapted to reflect light from the semiconductor diode structures towards the light output section. The area of the light output section is less than the combined area of the first and second semiconductor diode structures.
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