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公开(公告)号：US09198302B2
公开(公告)日：2015-11-24
申请号：US14414918
申请日：2013-07-17
CPC分类号： H05K3/3484 , B23K1/0016 , B23K35/02 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/302 , C22C9/00 , C22C13/00 , H01L24/81 , H01L2924/00011 , H01L2924/01322 , H05K3/303 , H05K3/3431 , H05K3/3463 , H05K2201/10106 , H05K2203/04 , H05K2203/0475 , H01L2224/81805
摘要： The present invention relates to a method of soldering an electronic component (3) to a substrate (1) with high accuracy using transient liquid phase soldering. The component (3) is exactly positioned above the substrate (1) with a handling tool, placed in the melted solder (2) and pressed against the substrate (1). The component (3) is then released and the solder (2) allowed solidifying. Due to the use of a solder (2) having a sufficiently high amount of a second metal or metal alloy of a higher melting point which only partly dissolves in the melted first metal or metal alloy of a lower melting point, a solid framework forms during the liquid phase soldering which inhibits a lateral movement of the placed component (3) during soldering. Since the positioning of the component (3) is made using exact reference features on the substrate (1), the whole soldering process results in a highly accurate lateral position of the soldered component.
摘要翻译： 本发明涉及使用瞬态液相焊接以高精度将电子部件（3）焊接到基板（1）的方法。 组件（3）用处理工具精确地定位在基板（1）上方，放置在熔化的焊料（2）中并压靠在基板（1）上。 然后将组分（3）释放并使焊料（2）凝固。 由于使用具有足够高量的第二金属或金属合金的焊料（2），该第二金属或金属合金仅在熔融的第一低熔点金属或金属合金中部分溶解，熔点较低的金属或金属合金，在 在焊接期间抑制放置的部件（3）的横向移动的液相焊接。 由于组件（3）的定位是使用基板（1）上的精确参考特征进行的，所以整个焊接过程导致焊接部件的高度精确的横向位置。
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公开(公告)号：US10018310B2
公开(公告)日：2018-07-10
申请号：US14405299
申请日：2013-06-03
发明人： Lukas Kuepper , Mohammad Mirsadeghi , Gunnar Luettgens , Gordon Patrick Rudolf Elger , Nadin Roesler , Aldo Tralli
IPC分类号： F21S8/10 , F21V21/00 , F21K99/00 , F21V29/67 , F21V29/74 , F21V23/06 , F21K9/232 , F21S41/19 , F21S41/141 , F21S41/147 , F21S41/32 , F21S43/19 , F21S43/14 , F21S43/31 , F21S45/43 , F21Y115/10
CPC分类号： F21K9/232 , F21S41/141 , F21S41/147 , F21S41/192 , F21S41/32 , F21S43/14 , F21S43/195 , F21S43/31 , F21S45/43 , F21V23/06 , F21V29/677 , F21V29/74 , F21Y2115/10
摘要： The present invention relates to a LED lamp unit (10) comprising at least two LED light sources (2) arranged between a heat sink (3) and an electrical connector base at two opposing sides of the lamp unit (10) to emit in opposed half spaces. The proposed LED lamp unit can be constructed in a very compact form in order to replace known halogen, xenon and incandescent bulbs without changing the construction of the reflector and mechanical parts in a head lamp or signaling lamp.
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3.发明申请公开(公告)号：US20150223347A1
公开(公告)日：2015-08-06
申请号：US14414918
申请日：2013-07-17
CPC分类号： H05K3/3484 , B23K1/0016 , B23K35/02 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/302 , C22C9/00 , C22C13/00 , H01L24/81 , H01L2924/00011 , H01L2924/01322 , H05K3/303 , H05K3/3431 , H05K3/3463 , H05K2201/10106 , H05K2203/04 , H05K2203/0475 , H01L2224/81805
摘要： The present invention relates to a method of soldering an electronic component (3) to a substrate (1) with high accuracy using transient liquid phase soldering. The component (3) is exactly positioned above the substrate (1) with a handling tool, placed in the melted solder (2) and pressed against the substrate (1). The component (3) is then released and the solder (2) allowed solidifying. Due to the use of a solder (2) having a sufficiently high amount of a second metal or metal alloy of a higher melting point which only partly dissolves in the melted first metal or metal alloy of a lower melting point, a solid framework forms during the liquid phase soldering which inhibits a lateral movement of the placed component (3) during soldering. Since the positioning of the component (3) is made using exact reference features on the substrate (1), the whole soldering process results in a highly accurate lateral position of the soldered component.
摘要翻译： 本发明涉及使用瞬态液相焊接以高精度将电子部件（3）焊接到基板（1）的方法。 组件（3）用处理工具精确地定位在基板（1）上方，放置在熔化的焊料（2）中并压靠在基板（1）上。 然后将组分（3）释放并使焊料（2）凝固。 由于使用具有足够高量的第二金属或金属合金的焊料（2），该第二金属或金属合金仅在熔融的第一低熔点金属或金属合金中部分溶解，熔点较低的金属或金属合金，在 在焊接期间抑制放置的部件（3）的横向移动的液相焊接。 由于组件（3）的定位是使用基板（1）上的精确参考特征进行的，所以整个焊接过程导致焊接部件的高度精确的横向位置。
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