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    FLEXIBLE SUBSTRATE WITH ADAPTABLE PARAMETERS FOR INTEGRATED LED ARRAYS
    1.
    发明申请
    FLEXIBLE SUBSTRATE WITH ADAPTABLE PARAMETERS FOR INTEGRATED LED ARRAYS 审中-公开
    柔性基板，具有适用于整体LED阵列的参数

    公开(公告)号：US20170006710A1

    公开(公告)日：2017-01-05

    申请号：US15103991

    申请日：2014-12-16

    Applicant: KONINKLIJKE PHILIPS N.V.

    Inventor： Frederic Stephane Diana ,  Patrick Allen Bournes ,  Walter Daeschner ,  Yong Seok Choi ,  Axel Mehnert ,  Mohiuddin Mala

    IPC: H05K3/30 ,  H05K3/04

    CPC classification number: H05K3/303 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0293 ,  H05K1/189 ,  H05K3/005 ,  H05K3/04 ,  H05K2201/0909 ,  H05K2201/10106 ,  H05K2203/175 ,  H01L2924/00

    Abstract: A patterned conductive layer on a flexible substrate includes pads for mounting an array of LEDs, conductive strips, and conductive tabs that couple the conductive strips to the pads. The desired circuit configuration is created by removing select tabs by punching holes or otherwise piercing the flexible substrate at the location of the tabs. In some embodiments, the patterned conductive layer is arranged to permit each LED to be mounted in either of two mirrored orientations, and in some embodiments, the patterned conductive layer is arranged to permit a separation between LEDs that is not predefined by the pattern. In some embodiments, the unmodified patterned conductive layer is arranged to provide a parallel circuit configuration, and the modified patterned conductive layer is arranged to provide a series or series-parallel configuration.

    Abstract translation: 柔性基板上的图案化导电层包括用于安装LED阵列，导电条和将导电条耦合到焊盘的导电突片的焊盘。 所需的电路配置是通过在突片的位置处冲孔或以其他方式刺穿柔性基板来移除选择的突片来产生的。 在一些实施例中，图案化导电层被布置成允许每个LED被安装在两个镜像取向中的任一个中，并且在一些实施例中，图案化导电层被布置成允许未由图案预定义的LED之间的间隔。 在一些实施例中，未修改的图案化导电层被布置成提供并联电路配置，并且经修改的图案化导电层被布置成提供串联或串联并联配置。

    REFLECTIVE SOLDER MASK LAYER FOR LED PHOSPHOR PACKAGE
    3.
    发明申请
    REFLECTIVE SOLDER MASK LAYER FOR LED PHOSPHOR PACKAGE 审中-公开
    用于LED磷光体封装的反射焊膏掩模层

    公开(公告)号：US20160315069A1

    公开(公告)日：2016-10-27

    申请号：US15103474

    申请日：2014-11-26

    Applicant: KONINKLIJKE PHILIPS N.V.

    Inventor： Yiwen Rong ,  Frederic Stephane Diana ,  Ting Zhu ,  Gregory Guth

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60

    CPC classification number: H01L25/0753 ,  H01L33/501 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

    Abstract: A mounting substrate (40) has a patterned metal layer defining a plurality of top metal bond pads for bonding to bottom metal bond pads of LED dies. A solder mask layer (52) is formed over the mounting substrate, where the mask has openings that expose the top metal bond pads and protects metal traces on the substrate. The mask layer is a highly reflective white paint. The exposed top metal bond pads are then wetted with solder. The LED dies' bottom metal bond pads are then soldered to the exposed top metal bond pads, such that the mask layer surrounds each LED die to reflect light. A reflective ring (60) is affixed to the substrate to surround the LED dies. A viscous phosphor material (62) then partially fills the ring and is cured. All downward light by the LED dies and phosphor is reflected upward by the ring and solder mask layer.

    Abstract translation: 安装基板（40）具有限定多个顶部金属接合焊盘的图案化金属层，用于结合LED管芯的底部金属接合焊盘。 在安装基板上形成焊接掩模层（52），其中掩模具有暴露顶部金属接合焊盘并保护基板上的金属迹线的开口。 掩模层是高反射性的白色涂料。 然后将暴露的顶部金属接合垫用焊料润湿。 然后将LED芯片的底部金属焊盘焊接到暴露的顶部金属焊盘，使得掩模层围绕每个LED管芯以反射光。 反射环（60）固定到基板上以围绕LED管芯。 粘性荧光体材料（62）然后部分地填充环并固化。 LED芯片和荧光体的所有向下的光都被环和焊料掩模层向上反射。

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