公开(公告)号：US20160315069A1

公开(公告)日：2016-10-27

申请号：US15103474

申请日：2014-11-26

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Yiwen Rong ,  Frederic Stephane Diana ,  Ting Zhu ,  Gregory Guth

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60

CPC classification number: H01L25/0753 ,  H01L33/501 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A mounting substrate (40) has a patterned metal layer defining a plurality of top metal bond pads for bonding to bottom metal bond pads of LED dies. A solder mask layer (52) is formed over the mounting substrate, where the mask has openings that expose the top metal bond pads and protects metal traces on the substrate. The mask layer is a highly reflective white paint. The exposed top metal bond pads are then wetted with solder. The LED dies' bottom metal bond pads are then soldered to the exposed top metal bond pads, such that the mask layer surrounds each LED die to reflect light. A reflective ring (60) is affixed to the substrate to surround the LED dies. A viscous phosphor material (62) then partially fills the ring and is cured. All downward light by the LED dies and phosphor is reflected upward by the ring and solder mask layer.

Abstract translation: 安装基板（40）具有限定多个顶部金属接合焊盘的图案化金属层，用于结合LED管芯的底部金属接合焊盘。 在安装基板上形成焊接掩模层（52），其中掩模具有暴露顶部金属接合焊盘并保护基板上的金属迹线的开口。 掩模层是高反射性的白色涂料。 然后将暴露的顶部金属接合垫用焊料润湿。 然后将LED芯片的底部金属焊盘焊接到暴露的顶部金属焊盘，使得掩模层围绕每个LED管芯以反射光。 反射环（60）固定到基板上以围绕LED管芯。 粘性荧光体材料（62）然后部分地填充环并固化。 LED芯片和荧光体的所有向下的光都被环和焊料掩模层向上反射。